Market Overview:
The global serial (SPI) NAND flash market is expected to grow at a CAGR of xx% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for consumer electronics, internet of things (IoT), automotive, industrial application, and communication applications. Additionally, the growing trend of miniaturization in electronic devices is also contributing to the growth of this market. The low density segment is expected to account for a larger share of the global serial (SPI) NAND flash market during the forecast period. This can be attributed to its lower cost as compared with high density NAND flash memory chips. However, high density NAND flash memory chips are witnessing higher growth rates due their superior performance and storage capacity as compared with low density variants. North America accounted for a major share of the global serial (SPI) NAND flash market in 2017 and is expected to maintain its dominance during the forecast period owing to technological advancements and rising demand from end-use industries such as automotive.
 NAND Flash Industry Outlook.svg)
Product Definition:
Serial peripheral interface (SPI) NAND flash is a type of NAND flash that uses the SPI bus to communicate with the host system. SPI NAND flash is typically used in embedded systems where low power consumption and high performance are important considerations.
Low Density:
Low-Density Parity (LDPC) is a data structure used to address cells in an array. It reduces the number of programming and reading cycles, resulting in lower power consumption during read/program operations. The LDPC technology has been widely accepted for NAND flash memory owing to its high performance efficiency and low cost over traditional technologies such as PCM (Parity Checker Memory).
High Density:
High Density (HD) NAND Flash is a type of flash memory that uses vertically stacked cells, where each cell can store more data than the traditional flash. The amount of data that can be stored in a given area is referred to as the capacity of the device. For instance, a 128 GB microSD card would use 2x 32GB High-Density NAND Flash chips to achieve its storage limit.
Application Insights:
The consumer electronics segment accounted for a major market share in 2017 and is expected to continue its dominance over the forecast period. The high storage density of Serial Peripheral Interface (SPI) NAND flash chips makes them suitable for use in consumer electronic products, such as smartphones and tablets. These devices have increasingly been incorporating cloud-based services that require large amounts of data to be stored. This has led to an increased demand for SPI NAND flash across the consumer electronics industry, especially in emerging markets such as China and India.
The internet of things (IoT) application segment is also expected to witness significant growth over the forecast period owing to rising demand from smart home appliances, wearable devices, networking products among others.
Regional Analysis:
Asia Pacific regional market accounted for the largest share in 2017 and is anticipated to witness significant growth over the forecast period. The region is expected to grow from 34% of global revenue in 2017 to 38% by 2030. This can be attributed to increasing production and sales of smartphones, tablets, personal computers, servers, storage devices as well as other consumer electronics products in China and India.
The presence of a large number of semiconductor manufacturers along with research institutes engaged in developing advanced serial (SPI NAND Flash) memory chips has fueled the regional market growth over the past few years. In addition, rising demand for high-density data storage media due to growing digitalization across various industry verticals such as healthcare & life sciences; government & defense; transportation & logistics; banking & financial services among others will drive this trend further.
Growth Factors:
- Increasing demand for storage in various applications such as consumer electronics, automotive, and industrial is expected to drive the growth of Serial (SPI) NAND Flash market.
- Proliferation of smart devices and growing trend of Internet of Things (IoT) is also anticipated to fuel the demand for Serial (SPI) NAND Flash over the forecast period.
- Rising demand for high-capacity storage solutions in data centers is another major factor that would propel the growth of this market during the forecast period.
- Growing popularity of SSDs over traditional hard drives is also projected to boost the adoption rate of Serial (SPI) NAND Flash memory products across different applications segments in coming years.
Scope Of The Report
Report Attributes
Report Details
Report Title
Serial (SPI) NAND Flash Market Research Report
By Type
Low Density, High Density
By Application
Consumer Electronics, Internet of Things, Automotive, Industrial Application, Communication Application
By Companies
Toshiba, Micron, Spansion, Winbond, Macronix, GigaDevice, ATO Solution
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
247
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
Global Serial (SPI) NAND Flash Market Report Segments:
The global Serial (SPI) NAND Flash market is segmented on the basis of:
Types
Low Density, High Density
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Internet of Things, Automotive, Industrial Application, Communication Application
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Toshiba
- Micron
- Spansion
- Winbond
- Macronix
- GigaDevice
- ATO Solution
 NAND Flash Market Overview.svg)
Highlights of The Serial (SPI) NAND Flash Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Low Density
- High Density
- By Application:
- Consumer Electronics
- Internet of Things
- Automotive
- Industrial Application
- Communication Application
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Serial (SPI) NAND Flash Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 NAND Flash Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Serial (SPI) NAND Flash is a type of flash memory that uses serial interface to communicate with the host system. Serial (SPI) NAND Flash can be used in applications where high-speed data access is required, such as industrial controllers and smart cards.
Some of the major players in the serial (spi) nand flash market are Toshiba, Micron, Spansion, Winbond, Macronix, GigaDevice, ATO Solution.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Serial (SPI) NAND Flash Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Serial (SPI) NAND Flash Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Serial (SPI) NAND Flash Market - Supply Chain
4.5. Global Serial (SPI) NAND Flash Market Forecast
4.5.1. Serial (SPI) NAND Flash Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Serial (SPI) NAND Flash Market Size (000 Units) and Y-o-Y Growth
4.5.3. Serial (SPI) NAND Flash Market Absolute $ Opportunity
5. Global Serial (SPI) NAND Flash Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Serial (SPI) NAND Flash Market Size and Volume Forecast by Type
5.3.1. Low Density
5.3.2. High Density
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Serial (SPI) NAND Flash Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Serial (SPI) NAND Flash Market Size and Volume Forecast by Application
6.3.1. Consumer Electronics
6.3.2. Internet of Things
6.3.3. Automotive
6.3.4. Industrial Application
6.3.5. Communication Application
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Serial (SPI) NAND Flash Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Serial (SPI) NAND Flash Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Serial (SPI) NAND Flash Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Serial (SPI) NAND Flash Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Serial (SPI) NAND Flash Demand Share Forecast, 2019-2026
9. North America Serial (SPI) NAND Flash Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Serial (SPI) NAND Flash Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Serial (SPI) NAND Flash Market Size and Volume Forecast by Application
9.4.1. Consumer Electronics
9.4.2. Internet of Things
9.4.3. Automotive
9.4.4. Industrial Application
9.4.5. Communication Application
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Serial (SPI) NAND Flash Market Size and Volume Forecast by Type
9.7.1. Low Density
9.7.2. High Density
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Serial (SPI) NAND Flash Demand Share Forecast, 2019-2026
10. Latin America Serial (SPI) NAND Flash Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Serial (SPI) NAND Flash Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Serial (SPI) NAND Flash Market Size and Volume Forecast by Application
10.4.1. Consumer Electronics
10.4.2. Internet of Things
10.4.3. Automotive
10.4.4. Industrial Application
10.4.5. Communication Application
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Serial (SPI) NAND Flash Market Size and Volume Forecast by Type
10.7.1. Low Density
10.7.2. High Density
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Serial (SPI) NAND Flash Demand Share Forecast, 2019-2026
11. Europe Serial (SPI) NAND Flash Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Serial (SPI) NAND Flash Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Serial (SPI) NAND Flash Market Size and Volume Forecast by Application
11.4.1. Consumer Electronics
11.4.2. Internet of Things
11.4.3. Automotive
11.4.4. Industrial Application
11.4.5. Communication Application
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Serial (SPI) NAND Flash Market Size and Volume Forecast by Type
11.7.1. Low Density
11.7.2. High Density
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Serial (SPI) NAND Flash Demand Share, 2019-2026
12. Asia Pacific Serial (SPI) NAND Flash Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Serial (SPI) NAND Flash Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Serial (SPI) NAND Flash Market Size and Volume Forecast by Application
12.4.1. Consumer Electronics
12.4.2. Internet of Things
12.4.3. Automotive
12.4.4. Industrial Application
12.4.5. Communication Application
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Serial (SPI) NAND Flash Market Size and Volume Forecast by Type
12.7.1. Low Density
12.7.2. High Density
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Serial (SPI) NAND Flash Demand Share, 2019-2026
13. Middle East & Africa Serial (SPI) NAND Flash Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Serial (SPI) NAND Flash Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Serial (SPI) NAND Flash Market Size and Volume Forecast by Application
13.4.1. Consumer Electronics
13.4.2. Internet of Things
13.4.3. Automotive
13.4.4. Industrial Application
13.4.5. Communication Application
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Serial (SPI) NAND Flash Market Size and Volume Forecast by Type
13.7.1. Low Density
13.7.2. High Density
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Serial (SPI) NAND Flash Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Serial (SPI) NAND Flash Market: Market Share Analysis
14.2. Serial (SPI) NAND Flash Distributors and Customers
14.3. Serial (SPI) NAND Flash Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Toshiba
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Micron
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Spansion
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Winbond
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Macronix
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. GigaDevice
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. ATO Solution
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. COMPANY8
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
