Market Overview:
The global silicon wafer cutting equipment market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for solar silicon wafers, LED sapphire wafers, and quartz substrates across the globe. In addition, the growing adoption of semiconductor devices in various applications is also contributing to the growth of this market. Based on type, the global silicon wafer cutting equipment market can be segmented into diamond coated wire and steel wire. The diamond coated wire segment is expected to grow at a higher CAGR than the steel wire segment during the forecast period from 2018 to 2030. This can be attributed to its superior performance as compared with other types of wires available in the market. Based on application,the global silicon wafer cutting equipment market can be divided into solar silicon cutting, LED sapphire cutting, quartz Cutting and other applications segments.
Product Definition:
The silicon wafer cutting equipment is used to cut the silicon wafers into different sizes. The importance of the silicon wafer cutting equipment is that it allows for the production of different size silicon wafers, which are necessary for a variety of applications.
Diamond Coated Wire:
Diamond coated wires are used in silicon wafer cutting equipment for the polishing of silicon wafers. Silicon is a semiconductor material, which is used in the production of integrated circuits (IC). The IC consists of millions of small electrical components called chips that are made from purified silicon crystals. These components work together as a single unit and perform specific functions to carry out various operations within a computer system or mobile phone.
Steel Wire:
Steel wire and it's usage in silicon wafer cutting equipment market is expected to witness significant growth over the forecast period. Silicon wafers are used as a base material for semiconductor devices such as microprocessors, integrated circuits, and memory chips. These semiconductor devices require precise shapes and sizes which are achieved by using steel wires of specific diameter for the process of cutting according to requirement.
Application Insights:
The quartz cutting application segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. Silicon wafer cutting equipment is widely used in manufacturing of various products such as LEDs, sapphire glass, solar cells and other electronic devices. The growth of the LED industry across different regions is expected to boost product demand during the forecast period.
The solar silicon cutting segment accounted for a significant market share in 2017 owing to increasing demand from China Italy Japan Malaysia Taiwan Thailand Vietnam U.
Regional Analysis:
Asia Pacific is expected to emerge as the fastest-growing region over the forecast period. The growth can be attributed to increasing demand for electronic products in countries, such as China and India. In addition, rising investments by foreign players in this region are likely to boost industry expansion over the next eight years. For instance, Taiwan Semiconductor Manufacturing Company (TSMC) has announced its plan of investing around USD X billion by 2020 on a new plant in Vietnam that would manufacture chips using sapphire technology.
North America accounted for more than 25% of market share owing to early adoption of advanced technologies across various industries including semiconductors and LEDs/lasers.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of USD 333.8 billion by 2020. This growth is primarily attributed to the increasing demand for semiconductor devices in consumer electronics, automotive, and industrial applications.
- Rising demand for miniaturized and energy-efficient electronic devices: With the growing trend of miniaturization and increased focus on energy efficiency, the need for advanced silicon wafer cutting equipment is rising rapidly across the globe.
- Technological advancements in semiconductor manufacturing: To meet the ever-growing demands of consumers, manufacturers are constantly making advancements in their production technologies – which is resulting in an increased demand for high-quality silicon wafers that can be cut with precision using latest equipment technologies.
Scope Of The Report
Report Attributes
Report Details
Report Title
Silicon Wafer Cutting Equipment Market Research Report
By Type
Diamond Coated Wire, Steel Wire
By Application
Solar Silicon Cutting, LED Sapphire Cutting, Quartz Cutting, Other
By Companies
Disco, Accretech, ADT, JFS, Nakamura Choukou, Nippon Seisen, Logomatic
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
245
Number of Tables & Figures
172
Customization Available
Yes, the report can be customized as per your need.
Global Silicon Wafer Cutting Equipment Market Report Segments:
The global Silicon Wafer Cutting Equipment market is segmented on the basis of:
Types
Diamond Coated Wire, Steel Wire
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Solar Silicon Cutting, LED Sapphire Cutting, Quartz Cutting, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Disco
- Accretech
- ADT
- JFS
- Nakamura Choukou
- Nippon Seisen
- Logomatic
Highlights of The Silicon Wafer Cutting Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Diamond Coated Wire
- Steel Wire
- By Application:
- Solar Silicon Cutting
- LED Sapphire Cutting
- Quartz Cutting
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Silicon Wafer Cutting Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Silicon Wafer Cutting Equipment is a machine that uses lasers to cut silicon wafers into desired shapes.
Some of the major players in the silicon wafer cutting equipment market are Disco, Accretech, ADT, JFS, Nakamura Choukou, Nippon Seisen, Logomatic.
The silicon wafer cutting equipment market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Silicon Wafer Cutting Equipment Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Silicon Wafer Cutting Equipment Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Silicon Wafer Cutting Equipment Market - Supply Chain
4.5. Global Silicon Wafer Cutting Equipment Market Forecast
4.5.1. Silicon Wafer Cutting Equipment Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Silicon Wafer Cutting Equipment Market Size (000 Units) and Y-o-Y Growth
4.5.3. Silicon Wafer Cutting Equipment Market Absolute $ Opportunity
5. Global Silicon Wafer Cutting Equipment Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Type
5.3.1. Diamond Coated Wire
5.3.2. Steel Wire
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Silicon Wafer Cutting Equipment Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Application
6.3.1. Solar Silicon Cutting
6.3.2. LED Sapphire Cutting
6.3.3. Quartz Cutting
6.3.4. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Silicon Wafer Cutting Equipment Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Silicon Wafer Cutting Equipment Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Silicon Wafer Cutting Equipment Demand Share Forecast, 2019-2026
9. North America Silicon Wafer Cutting Equipment Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Application
9.4.1. Solar Silicon Cutting
9.4.2. LED Sapphire Cutting
9.4.3. Quartz Cutting
9.4.4. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Type
9.7.1. Diamond Coated Wire
9.7.2. Steel Wire
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Silicon Wafer Cutting Equipment Demand Share Forecast, 2019-2026
10. Latin America Silicon Wafer Cutting Equipment Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Application
10.4.1. Solar Silicon Cutting
10.4.2. LED Sapphire Cutting
10.4.3. Quartz Cutting
10.4.4. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Type
10.7.1. Diamond Coated Wire
10.7.2. Steel Wire
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Silicon Wafer Cutting Equipment Demand Share Forecast, 2019-2026
11. Europe Silicon Wafer Cutting Equipment Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Application
11.4.1. Solar Silicon Cutting
11.4.2. LED Sapphire Cutting
11.4.3. Quartz Cutting
11.4.4. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Type
11.7.1. Diamond Coated Wire
11.7.2. Steel Wire
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Silicon Wafer Cutting Equipment Demand Share, 2019-2026
12. Asia Pacific Silicon Wafer Cutting Equipment Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Application
12.4.1. Solar Silicon Cutting
12.4.2. LED Sapphire Cutting
12.4.3. Quartz Cutting
12.4.4. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Type
12.7.1. Diamond Coated Wire
12.7.2. Steel Wire
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Silicon Wafer Cutting Equipment Demand Share, 2019-2026
13. Middle East & Africa Silicon Wafer Cutting Equipment Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Application
13.4.1. Solar Silicon Cutting
13.4.2. LED Sapphire Cutting
13.4.3. Quartz Cutting
13.4.4. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Silicon Wafer Cutting Equipment Market Size and Volume Forecast by Type
13.7.1. Diamond Coated Wire
13.7.2. Steel Wire
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Silicon Wafer Cutting Equipment Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Silicon Wafer Cutting Equipment Market: Market Share Analysis
14.2. Silicon Wafer Cutting Equipment Distributors and Customers
14.3. Silicon Wafer Cutting Equipment Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Disco
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Accretech
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. ADT
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. JFS
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Nakamura Choukou
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Nippon Seisen
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Logomatic
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. COMPANY8
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
