The global solder ball packaging material market is expected to grow at a CAGR of 4.5% during the forecast period, to reach USD 1.2 billion by 2030. The growth of this market is driven by the increasing demand for lead-free solder balls in various applications such as BGA, CSP & WLCSP, and FliChip. The increasing demand for lead-free solder balls in these applications is due to their environmental friendliness and low cost compared with leaded solder balls.
Lead Solder Ball: Lead soldering ball packaging material market size was valued at USD 0.6 billion in 2018 and is projected to grow at a CAGR of 3% during the forecast period, reaching USD 0.7 billion by 2030. Lead free soldering ball packaging material market size was valued at USD 0.4 billion in 2018 and is projected to grow at a CAGR of 5% during the forecast period, reaching USD 1 billion by 2030.
- The increasing demand for solder balls in the electronics industry is driving the growth of the solder ball packaging material market.
- The increasing use of lead-free solder balls is also driving the growth of this market.
- The growing need for high-quality and reliable products in order to meet stringent quality standards is also a factor that will drive this market's growth over the next few years.
- Increasing investments by companies in research and development activities will also fuel this market's growth over time, as they are looking to develop new materials with better properties than existing ones, which will help them stay competitive in their respective industries and increase their revenues from these products as well as from other products that use these materials as an input or output component, such as solder ball packaging material manufacturers themselves or end users who buy these materials for their own purposes such as manufacturing electronic components or assembling electronic devices like smartphones, tablets, laptops etc, which require soldering during assembly process to connect different components together on circuit boards etc, so they can function properly and provide desired functionality to end users who purchase them from manufacturers or retailers like Amazon etc, where they are available at affordable prices with free shipping options available on eligible orders above $25 USD value etc .
- The rising demand for green technologies due to environmental concerns is another factor that will drive this market's growth over time because it reduces pollution levels by using less energy than traditional technologies do while still providing desired functionality required by consumers who want greener alternatives when it comes to electronics manufacturing processes like soldering process used during assembly of electronic devices like smartphones, tablets etc.
Industry Growth Insights published a new data on “Solder Ball Packaging Material Market”. The research report is titled “Solder Ball Packaging Material Market research by Types (Lead Solder Ball, Lead Free Solder Ball), By Applications (BGA, CSP & WLCSP, Flip-Chip & Others), By Players/Companies Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Indium Corporation, Jovy Systems”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Solder Ball Packaging Material Market Research Report
By Type
Lead Solder Ball, Lead Free Solder Ball
By Application
BGA, CSP & WLCSP, Flip-Chip & Others
By Companies
Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Indium Corporation, Jovy Systems
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
242
Number of Tables & Figures
170
Customization Available
Yes, the report can be customized as per your need.
Global Solder Ball Packaging Material Market Report Segments:
The global Solder Ball Packaging Material market is segmented on the basis of:
Types
Lead Solder Ball, Lead Free Solder Ball
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
BGA, CSP & WLCSP, Flip-Chip & Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Senju Metal
- DS HiMetal
- MKE
- YCTC
- Nippon Micrometal
- Accurus
- PMTC
- Shanghai hiking solder material
- Shenmao Technology
- Indium Corporation
- Jovy Systems
Highlights of The Solder Ball Packaging Material Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead Solder Ball
- Lead Free Solder Ball
- By Application:
- BGA
- CSP & WLCSP
- Flip-Chip & Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Solder Ball Packaging Material Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Solder ball packaging material is a type of plastic that is used to package electronic components. It is often used in conjunction with other types of packaging materials, such as paper and cardboard, to create boxes or cases for the components. Solder ball packaging material can be made from a variety of materials, including polypropylene and PETG.
Some of the key players operating in the solder ball packaging material market are Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Indium Corporation, Jovy Systems.
The solder ball packaging material market is expected to grow at a compound annual growth rate of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Solder Ball Packaging Material Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Solder Ball Packaging Material Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Solder Ball Packaging Material Market - Supply Chain
4.5. Global Solder Ball Packaging Material Market Forecast
4.5.1. Solder Ball Packaging Material Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Solder Ball Packaging Material Market Size (000 Units) and Y-o-Y Growth
4.5.3. Solder Ball Packaging Material Market Absolute $ Opportunity
5. Global Solder Ball Packaging Material Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Solder Ball Packaging Material Market Size and Volume Forecast by Type
5.3.1. Lead Solder Ball
5.3.2. Lead Free Solder Ball
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Solder Ball Packaging Material Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Solder Ball Packaging Material Market Size and Volume Forecast by Application
6.3.1. BGA
6.3.2. CSP & WLCSP
6.3.3. Flip-Chip & Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Solder Ball Packaging Material Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Solder Ball Packaging Material Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Solder Ball Packaging Material Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Solder Ball Packaging Material Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Solder Ball Packaging Material Demand Share Forecast, 2019-2029
9. North America Solder Ball Packaging Material Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Solder Ball Packaging Material Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Solder Ball Packaging Material Market Size and Volume Forecast by Application
9.4.1. BGA
9.4.2. CSP & WLCSP
9.4.3. Flip-Chip & Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Solder Ball Packaging Material Market Size and Volume Forecast by Type
9.7.1. Lead Solder Ball
9.7.2. Lead Free Solder Ball
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Solder Ball Packaging Material Demand Share Forecast, 2019-2029
10. Latin America Solder Ball Packaging Material Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Solder Ball Packaging Material Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Solder Ball Packaging Material Market Size and Volume Forecast by Application
10.4.1. BGA
10.4.2. CSP & WLCSP
10.4.3. Flip-Chip & Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Solder Ball Packaging Material Market Size and Volume Forecast by Type
10.7.1. Lead Solder Ball
10.7.2. Lead Free Solder Ball
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Solder Ball Packaging Material Demand Share Forecast, 2019-2029
11. Europe Solder Ball Packaging Material Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Solder Ball Packaging Material Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Solder Ball Packaging Material Market Size and Volume Forecast by Application
11.4.1. BGA
11.4.2. CSP & WLCSP
11.4.3. Flip-Chip & Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Solder Ball Packaging Material Market Size and Volume Forecast by Type
11.7.1. Lead Solder Ball
11.7.2. Lead Free Solder Ball
11.8. Basis Poin Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Solder Ball Packaging Material Demand Share, 2019-2029
12. Asia Pacific Solder Ball Packaging Material Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Solder Ball Packaging Material Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Solder Ball Packaging Material Market Size and Volume Forecast by Application
12.4.1. BGA
12.4.2. CSP & WLCSP
12.4.3. Flip-Chip & Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Solder Ball Packaging Material Market Size and Volume Forecast by Type
12.7.1. Lead Solder Ball
12.7.2. Lead Free Solder Ball
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Solder Ball Packaging Material Demand Share, 2019-2029
13. Middle East & Africa Solder Ball Packaging Material Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Solder Ball Packaging Material Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Solder Ball Packaging Material Market Size and Volume Forecast by Application
13.4.1. BGA
13.4.2. CSP & WLCSP
13.4.3. Flip-Chip & Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Solder Ball Packaging Material Market Size and Volume Forecast by Type
13.7.1. Lead Solder Ball
13.7.2. Lead Free Solder Ball
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Solder Ball Packaging Material Demand Share, 2019-2029
14. Competition Landscape
14.1. Global Solder Ball Packaging Material Market: Market Share Analysis
14.2. Solder Ball Packaging Material Distributors and Customers
14.3. Solder Ball Packaging Material Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Senju Metal
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. DS HiMetal
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. MKE
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. YCTC
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Nippon Micrometal
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Accurus
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. PMTC
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Shanghai hiking solder material
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Shenmao Technology
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Indium Corporation
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Jovy Systems
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
