The global solder bumping flip chip market is expected to grow at a CAGR of 6.5% during the forecast period, from 2021 to 2030. The growth of this market can be attributed to the increasing demand for 3D ICs in electronics and industrial applications, which are driving the demand for solder bumping flip chips. The increasing adoption of 2D ICs in automotive and transport applications is also expected to drive the growth of this market during the forecast period.
The global solder bumping flip chip market by type is segmented into 3D IC, 2.5D IC, and 2D IC. The 3D IC segment accounted for a share of over 50% in 2018 owing to its high adoption rate in electronics and industrial applications such as smartphones, tablets, laptops, etc, which are driving its demand globally. However, with an increase in adoption rates for 2D ICs across various industries such as automotive & transport industry due to their low cost-per-unit production costs compared with 3D ICs; it is anticipated that by 2030 end-users will shift towards using more 2D than 3D chipsets owing to their lower cost per unit production costs when compared with 3Ds chipsets.
Some Of The Growth Factors Of This Market:
- The increasing demand for high-speed data transmission and storage devices is driving the growth of the solder bumping flip chip market.
- The increasing demand for low-cost, high-performance, and reliable electronic components is also driving the growth of the solder bumping flip chip market.
- The growing need to reduce power consumption in electronics products is also driving the growth of the solder bumping flip chip market.
- The rising adoption of 3D printing technology in electronics manufacturing processes will drive the growth of this market over time.
- Increasing investments by governments and private companies in research and development activities will drive this market over time.
Industry Growth Insights published a new data on “Solder Bumping Flip Chip Market”. The research report is titled “Solder Bumping Flip Chip Market research by Types (3D IC, 2.5D IC, 2D IC), By Applications (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace and Defense, Others), By Players/Companies TSMC (Taiwan), Samsung (South Korea), ASE Group (Taiwan), Amkor Technology (US), UMC (Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), STMicroelectronics (Switzerland)”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Solder Bumping Flip Chip Market Research Report
By Type
3D IC, 2.5D IC, 2D IC
By Application
Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace and Defense, Others
By Companies
TSMC (Taiwan), Samsung (South Korea), ASE Group (Taiwan), Amkor Technology (US), UMC (Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), STMicroelectronics (Switzerland)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
247
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
Global Solder Bumping Flip Chip Market Report Segments:
The global Solder Bumping Flip Chip market is segmented on the basis of:
Types
3D IC, 2.5D IC, 2D IC
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace and Defense, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- TSMC (Taiwan)
- Samsung (South Korea)
- ASE Group (Taiwan)
- Amkor Technology (US)
- UMC (Taiwan)
- STATS ChipPAC (Singapore)
- Powertech Technology (Taiwan)
- STMicroelectronics (Switzerland)
Highlights of The Solder Bumping Flip Chip Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 3D IC
- 2.5D IC
- 2D IC
- By Application:
- Electronics
- Industrial
- Automotive & Transport
- Healthcare
- IT & Telecommunication
- Aerospace and Defense
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Solder Bumping Flip Chip Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Solder bumping is a process of adding bumps to the surface of a semiconductor chip in order to improve electrical contact between the chip and its surrounding circuitry. Solder bumping is used on chips that are intended for use in high-speed, high-volume applications, such as microprocessors and other electronic devices.
Some of the major players in the solder bumping flip chip market are TSMC (Taiwan), Samsung (South Korea), ASE Group (Taiwan), Amkor Technology (US), UMC (Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), STMicroelectronics (Switzerland).
The solder bumping flip chip market is expected to grow at a compound annual growth rate of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Solder Bumping Flip Chip Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Solder Bumping Flip Chip Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Solder Bumping Flip Chip Market - Supply Chain
4.5. Global Solder Bumping Flip Chip Market Forecast
4.5.1. Solder Bumping Flip Chip Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Solder Bumping Flip Chip Market Size (000 Units) and Y-o-Y Growth
4.5.3. Solder Bumping Flip Chip Market Absolute $ Opportunity
5. Global Solder Bumping Flip Chip Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Solder Bumping Flip Chip Market Size and Volume Forecast by Type
5.3.1. 3D IC
5.3.2. 2.5D IC
5.3.3. 2D IC
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Solder Bumping Flip Chip Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Solder Bumping Flip Chip Market Size and Volume Forecast by Application
6.3.1. Electronics
6.3.2. Industrial
6.3.3. Automotive & Transport
6.3.4. Healthcare
6.3.5. IT & Telecommunication
6.3.6. Aerospace and Defense
6.3.7. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Solder Bumping Flip Chip Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Solder Bumping Flip Chip Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Solder Bumping Flip Chip Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Solder Bumping Flip Chip Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Solder Bumping Flip Chip Demand Share Forecast, 2019-2026
9. North America Solder Bumping Flip Chip Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Solder Bumping Flip Chip Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Solder Bumping Flip Chip Market Size and Volume Forecast by Application
9.4.1. Electronics
9.4.2. Industrial
9.4.3. Automotive & Transport
9.4.4. Healthcare
9.4.5. IT & Telecommunication
9.4.6. Aerospace and Defense
9.4.7. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Solder Bumping Flip Chip Market Size and Volume Forecast by Type
9.7.1. 3D IC
9.7.2. 2.5D IC
9.7.3. 2D IC
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Solder Bumping Flip Chip Demand Share Forecast, 2019-2026
10. Latin America Solder Bumping Flip Chip Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Solder Bumping Flip Chip Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Solder Bumping Flip Chip Market Size and Volume Forecast by Application
10.4.1. Electronics
10.4.2. Industrial
10.4.3. Automotive & Transport
10.4.4. Healthcare
10.4.5. IT & Telecommunication
10.4.6. Aerospace and Defense
10.4.7. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Solder Bumping Flip Chip Market Size and Volume Forecast by Type
10.7.1. 3D IC
10.7.2. 2.5D IC
10.7.3. 2D IC
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Solder Bumping Flip Chip Demand Share Forecast, 2019-2026
11. Europe Solder Bumping Flip Chip Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Solder Bumping Flip Chip Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Solder Bumping Flip Chip Market Size and Volume Forecast by Application
11.4.1. Electronics
11.4.2. Industrial
11.4.3. Automotive & Transport
11.4.4. Healthcare
11.4.5. IT & Telecommunication
11.4.6. Aerospace and Defense
11.4.7. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Solder Bumping Flip Chip Market Size and Volume Forecast by Type
11.7.1. 3D IC
11.7.2. 2.5D IC 11.7.3. 2D IC
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Solder Bumping Flip Chip Demand Share, 2019-2026
12. Asia Pacific Solder Bumping Flip Chip Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Solder Bumping Flip Chip Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Solder Bumping Flip Chip Market Size and Volume Forecast by Application
12.4.1. Electronics
12.4.2. Industrial
12.4.3. Automotive & Transport
12.4.4. Healthcare
12.4.5. IT & Telecommunication
12.4.6. Aerospace and Defense
12.4.7. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Solder Bumping Flip Chip Market Size and Volume Forecast by Type
12.7.1. 3D IC
12.7.2. 2.5D IC
12.7.3. 2D IC
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Solder Bumping Flip Chip Demand Share, 2019-2026
13. Middle East & Africa Solder Bumping Flip Chip Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Solder Bumping Flip Chip Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Solder Bumping Flip Chip Market Size and Volume Forecast by Application
13.4.1. Electronics
13.4.2. Industrial
13.4.3. Automotive & Transport
13.4.4. Healthcare
13.4.5. IT & Telecommunication
13.4.6. Aerospace and Defense
13.4.7. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Solder Bumping Flip Chip Market Size and Volume Forecast by Type
13.7.1. 3D IC
13.7.2. 2.5D IC
13.7.3. 2D IC
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Solder Bumping Flip Chip Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Solder Bumping Flip Chip Market: Market Share Analysis
14.2. Solder Bumping Flip Chip Distributors and Customers
14.3. Solder Bumping Flip Chip Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. TSMC (Taiwan)
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Samsung (South Korea)
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. ASE Group (Taiwan)
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Amkor Technology (US)
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. UMC (Taiwan)
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. STATS ChipPAC (Singapore)
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Powertech Technology (Taiwan)
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. STMicroelectronics (Switzerland)
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
