The global solder paste inspection (SPI) system market is expected to grow at a CAGR of 6.5% during the forecast period, from 2021 to 2030. The SPI system market is driven by the increasing demand for high-quality products in various industries such as automotive electronics, consumer electronics, and industrials. The SPI systems are used for inspecting solder joints on printed circuit boards (PCBs). These systems are also used for detecting defects in PCBs and other electronic components.
The global SPI system market is segmented on the basis of type into inline SPI systems and offline SPI systems; on the basis of application into automotive electronics, consumer electronics, and industrials; and on the basis of region into North America, Latin America, Europe, Asia Pacific (APAC), Middle East & Africa (MEA). In terms of type, inline SPI systems accounted for a larger share in 2018 owing to their ability to inspect solder joints quickly without any interruption or downtime. In terms of application segmentation, automotive electronics accounted for a larger share in 2018 due to its high demand across various regions such as North America and Europe owing to stringent quality standards set by regulatory bodies such as US Department of Transportation (DOT) or European Union’s Automotive Directive 2002/24/EC respectively.
- The SPI system market is expected to grow at a CAGR of 6.5% from 2017 to 2025.
- The SPI system market is driven by the increasing demand for high-quality PCBs and the need for better quality control in manufacturing.
- The SPI system market is also driven by the increasing demand for automation in manufacturing processes, which reduces labor costs and improves efficiency.
- Increasing investments in research and development activities are expected to drive growth of the SPI system market.
- Increasing adoption of 3D printing technology will also drive growth of the SPI system market.
Industry Growth Insights published a new data on “Solder Paste Inspection (SPI) System Market”. The research report is titled “Solder Paste Inspection (SPI) System Market research by Types (In-line SPI System, Off-line SPI System), By Applications (Automotive Electronics, Consumer Electronics, Industrials, Others), By Players/Companies Koh Young (Korea), CyberOptics Corporation, Test Research, Inc (TRI) (Taiwan), MirTec Ltd (Korea), PARMI Corp (Korea), Viscom AG (Germany), ViTrox (Malaysia), Vi TECHNOLOGY (France), Mek (Marantz Electronics) (Japan), CKD Corporation (Japan), Pemtron (Korea), SAKI Corporation (Japan), Machine Vision Products (MVP) (US), Caltex Scientific (US), ASC International (US), Sinic-Tek Vision Technology (China), Shenzhen JT Automation Equipment (China), Jet Technology (Taiwan)”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Solder Paste Inspection (SPI) System Market Research Report
By Type
In-line SPI System, Off-line SPI System
By Application
Automotive Electronics, Consumer Electronics, Industrials, Others
By Companies
Koh Young (Korea), CyberOptics Corporation, Test Research, Inc (TRI) (Taiwan), MirTec Ltd (Korea), PARMI Corp (Korea), Viscom AG (Germany), ViTrox (Malaysia), Vi TECHNOLOGY (France), Mek (Marantz Electronics) (Japan), CKD Corporation (Japan), Pemtron (Korea), SAKI Corporation (Japan), Machine Vision Products (MVP) (US), Caltex Scientific (US), ASC International (US), Sinic-Tek Vision Technology (China), Shenzhen JT Automation Equipment (China), Jet Technology (Taiwan)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
249
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
 System Industry Outlook.svg)
Global Solder Paste Inspection (SPI) System Market Report Segments:
The global Solder Paste Inspection (SPI) System market is segmented on the basis of:
Types
In-line SPI System, Off-line SPI System
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive Electronics, Consumer Electronics, Industrials, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Koh Young (Korea)
- CyberOptics Corporation
- Test Research, Inc (TRI) (Taiwan)
- MirTec Ltd (Korea)
- PARMI Corp (Korea)
- Viscom AG (Germany)
- ViTrox (Malaysia)
- Vi TECHNOLOGY (France)
- Mek (Marantz Electronics) (Japan)
- CKD Corporation (Japan)
- Pemtron (Korea)
- SAKI Corporation (Japan)
- Machine Vision Products (MVP) (US)
- Caltex Scientific (US)
- ASC International (US)
- Sinic-Tek Vision Technology (China)
- Shenzhen JT Automation Equipment (China)
- Jet Technology (Taiwan)
 System Market Overview.svg)
Highlights of The Solder Paste Inspection (SPI) System Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- In-line SPI System
- Off-line SPI System
- By Application:
- Automotive Electronics
- Consumer Electronics
- Industrials
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Solder Paste Inspection (SPI) System Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 System Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
The solder paste inspection system is a type of automated inspection equipment that uses a microscope to inspect solder joints for defects.
Some of the major companies in the solder paste inspection (spi) system market are Koh Young (Korea), CyberOptics Corporation, Test Research, Inc (TRI) (Taiwan), MirTec Ltd (Korea), PARMI Corp (Korea), Viscom AG (Germany), ViTrox (Malaysia), Vi TECHNOLOGY (France), Mek (Marantz Electronics) (Japan), CKD Corporation (Japan), Pemtron (Korea), SAKI Corporation (Japan), Machine Vision Products (MVP) (US), Caltex Scientific (US), ASC International (US), Sinic-Tek Vision Technology (China), Shenzhen JT Automation Equipment (China), Jet Technology (Taiwan).
The solder paste inspection (spi) system market is expected to register a CAGR of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Solder Paste Inspection (SPI) System Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Solder Paste Inspection (SPI) System Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Solder Paste Inspection (SPI) System Market - Supply Chain
4.5. Global Solder Paste Inspection (SPI) System Market Forecast
4.5.1. Solder Paste Inspection (SPI) System Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Solder Paste Inspection (SPI) System Market Size (000 Units) and Y-o-Y Growth
4.5.3. Solder Paste Inspection (SPI) System Market Absolute $ Opportunity
5. Global Solder Paste Inspection (SPI) System Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Type
5.3.1. In-line SPI System
5.3.2. Off-line SPI System
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Solder Paste Inspection (SPI) System Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Application
6.3.1. Automotive Electronics
6.3.2. Consumer Electronics
6.3.3. Industrials
6.3.4. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Solder Paste Inspection (SPI) System Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Solder Paste Inspection (SPI) System Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Solder Paste Inspection (SPI) System Demand Share Forecast, 2019-2026
9. North America Solder Paste Inspection (SPI) System Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Application
9.4.1. Automotive Electronics
9.4.2. Consumer Electronics
9.4.3. Industrials
9.4.4. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Type
9.7.1. In-line SPI System
9.7.2. Off-line SPI System
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Solder Paste Inspection (SPI) System Demand Share Forecast, 2019-2026
10. Latin America Solder Paste Inspection (SPI) System Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Application
10.4.1. Automotive Electronics
10.4.2. Consumer Electronics
10.4.3. Industrials
10.4.4. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Type
10.7.1. In-line SPI System
10.7.2. Off-line SPI System
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Solder Paste Inspection (SPI) System Demand Share Forecast, 2019-2026
11. Europe Solder Paste Inspection (SPI) System Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Application
11.4.1. Automotive Electronics
11.4.2. Consumer Electronics
11.4.3. Industrials
11.4.4. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Type
11.7.1. In-line SPI System
11.7.2. Off-line SPI System
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Solder Paste Inspection (SPI) System Demand Share, 2019-2026
12. Asia Pacific Solder Paste Inspection (SPI) System Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Application
12.4.1. Automotive Electronics
12.4.2. Consumer Electronics
12.4.3. Industrials
12.4.4. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Type
12.7.1. In-line SPI System
12.7.2. Off-line SPI System
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Solder Paste Inspection (SPI) System Demand Share, 2019-2026
13. Middle East & Africa Solder Paste Inspection (SPI) System Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Application
13.4.1. Automotive Electronics
13.4.2. Consumer Electronics
13.4.3. Industrials
13.4.4. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Solder Paste Inspection (SPI) System Market Size and Volume Forecast by Type
13.7.1. In-line SPI System
13.7.2. Off-line SPI System
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Solder Paste Inspection (SPI) System Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Solder Paste Inspection (SPI) System Market: Market Share Analysis
14.2. Solder Paste Inspection (SPI) System Distributors and Customers
14.3. Solder Paste Inspection (SPI) System Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Koh Young (Korea)
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. CyberOptics Corporation
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Test Research, Inc (TRI) (Taiwan)
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. MirTec Ltd (Korea)
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. PARMI Corp (Korea)
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Viscom AG (Germany)
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. ViTrox (Malaysia)
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Vi TECHNOLOGY (France)
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Mek (Marantz Electronics) (Japan)
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. CKD Corporation (Japan)
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Pemtron (Korea)
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. SAKI Corporation (Japan)
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Machine Vision Products (MVP) (US)
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Caltex Scientific (US)
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. ASC International (US)
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Sinic-Tek Vision Technology (China)
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Shenzhen JT Automation Equipment (China)
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Jet Technology (Taiwan)
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
