The global solder preform market is expected to grow at a CAGR of 4.5% during the forecast period, from 2021 to 2030. The growth of this market is attributed to the increasing demand for lead-free solder preforms in various applications such as military and aerospace, medical, semiconductor, and electronics. The increasing demand for lead-free solder preforms in these applications is due to the stringent environmental regulations that are being imposed on various industries across the globe. The global leaded solder preform market size was valued at USD 1.2 billion in 2018 and is expected to reach USD 1.6 billion by 2030, growing at a CAGR of 4.5% during the forecast period from 2021 to 2030.
Some Of The Growth Factors Of This Market:
- The increasing demand for solder preforms is a major factor in the growth of the market.
- The increasing use of solder preforms in various industries such as automotive, electronics, and construction is also a major factor in the growth of the market.
- The growing need for high-quality solder preforms to meet stringent quality standards is another factor that will drive the market's growth over the forecast period.
- Increasing investments by key players in research and development activities to develop new products with improved features will also fuel this market's growth over the forecast period.
- Increasing awareness about environmental issues among consumers has led to an increased demand for lead-free solder preforms which are considered more environmentally friendly than leaded ones.
Industry Growth Insights published a new data on “Solder Preform Market”. The research report is titled “Solder Preform Market research by Types (Lead Free, Leaded), By Applications (Military & Aerospace, Medical, Semiconductor, Electronics, Others), By Players/Companies Ametek, Alpha, Kester, Indium Corporation, Pfarr, Nihon Handa, SMIC, Harris Products, AIM, Nihon Superior, Fromosol, Guangzhou Xianyi, Shanghai Huaqing, Solderwell Advanced Materials, SIGMA Tin Alloy”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Solder Preform Market Research Report
By Type
Lead Free, Leaded
By Application
Military & Aerospace, Medical, Semiconductor, Electronics, Others
By Companies
Ametek, Alpha, Kester, Indium Corporation, Pfarr, Nihon Handa, SMIC, Harris Products, AIM, Nihon Superior, Fromosol, Guangzhou Xianyi, Shanghai Huaqing, Solderwell Advanced Materials, SIGMA Tin Alloy
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
240
Number of Tables & Figures
168
Customization Available
Yes, the report can be customized as per your need.
Global Solder Preform Market Report Segments:
The global Solder Preform market is segmented on the basis of:
Types
Lead Free, Leaded
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Military & Aerospace, Medical, Semiconductor, Electronics, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Ametek
- Alpha
- Kester
- Indium Corporation
- Pfarr
- Nihon Handa
- SMIC
- Harris Products
- AIM
- Nihon Superior
- Fromosol
- Guangzhou Xianyi
- Shanghai Huaqing
- Solderwell Advanced Materials
- SIGMA Tin Alloy
Highlights of The Solder Preform Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead Free
- Leaded
- By Application:
- Military & Aerospace
- Medical
- Semiconductor
- Electronics
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Solder Preform Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Solder preform is a type of solder paste that is used to create joints between electronic components. Solder preform comes in a variety of shapes and sizes, and it is usually filled with fluxes and other chemicals.
Some of the major players in the solder preform market are Ametek, Alpha, Kester, Indium Corporation, Pfarr, Nihon Handa, SMIC, Harris Products, AIM, Nihon Superior, Fromosol, Guangzhou Xianyi, Shanghai Huaqing, Solderwell Advanced Materials, SIGMA Tin Alloy.
The solder preform market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Solder Preform Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Solder Preform Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Solder Preform Market - Supply Chain
4.5. Global Solder Preform Market Forecast
4.5.1. Solder Preform Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Solder Preform Market Size (000 Units) and Y-o-Y Growth
4.5.3. Solder Preform Market Absolute $ Opportunity
5. Global Solder Preform Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Solder Preform Market Size and Volume Forecast by Type
5.3.1. Lead Free
5.3.2. Leaded
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Solder Preform Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Solder Preform Market Size and Volume Forecast by Application
6.3.1. Military & Aerospace
6.3.2. Medical
6.3.3. Semiconductor
6.3.4. Electronics
6.3.5. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Solder Preform Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Solder Preform Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Solder Preform Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Solder Preform Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Solder Preform Demand Share Forecast, 2019-2026
9. North America Solder Preform Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Solder Preform Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Solder Preform Market Size and Volume Forecast by Application
9.4.1. Military & Aerospace
9.4.2. Medical
9.4.3. Semiconductor
9.4.4. Electronics
9.4.5. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Solder Preform Market Size and Volume Forecast by Type
9.7.1. Lead Free
9.7.2. Leaded
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Solder Preform Demand Share Forecast, 2019-2026
10. Latin America Solder Preform Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Solder Preform Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Solder Preform Market Size and Volume Forecast by Application
10.4.1. Military & Aerospace
10.4.2. Medical
10.4.3. Semiconductor
10.4.4. Electronics
10.4.5. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Solder Preform Market Size and Volume Forecast by Type
10.7.1. Lead Free
10.7.2. Leaded
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Solder Preform Demand Share Forecast, 2019-2026
11. Europe Solder Preform Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Solder Preform Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Solder Preform Market Size and Volume Forecast by Application
11.4.1. Military & Aerospace
11.4.2. Medical
11.4.3. Semiconductor
11.4.4. Electronics
11.4.5. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Solder Preform Market Size and Volume Forecast by Type
11.7.1. Lead Free
11.7.2. Leaded
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attrativeness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Solder Preform Demand Share, 2019-2026
12. Asia Pacific Solder Preform Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Solder Preform Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Solder Preform Market Size and Volume Forecast by Application
12.4.1. Military & Aerospace
12.4.2. Medical
12.4.3. Semiconductor
12.4.4. Electronics
12.4.5. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Solder Preform Market Size and Volume Forecast by Type
12.7.1. Lead Free
12.7.2. Leaded
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Solder Preform Demand Share, 2019-2026
13. Middle East & Africa Solder Preform Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Solder Preform Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Solder Preform Market Size and Volume Forecast by Application
13.4.1. Military & Aerospace
13.4.2. Medical
13.4.3. Semiconductor
13.4.4. Electronics
13.4.5. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Solder Preform Market Size and Volume Forecast by Type
13.7.1. Lead Free
13.7.2. Leaded
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Solder Preform Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Solder Preform Market: Market Share Analysis
14.2. Solder Preform Distributors and Customers
14.3. Solder Preform Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Ametek
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Alpha
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Kester
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Indium Corporation
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Pfarr
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Nihon Handa
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. SMIC
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Harris Products
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. AIM
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Nihon Superior
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Fromosol
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Guangzhou Xianyi
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Shanghai Huaqing
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Solderwell Advanced Materials
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. SIGMA Tin Alloy
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook