The global solder spheres market is expected to grow at a CAGR of 4.5% during the forecast period, from 2021 to 2030. The growth of this market can be attributed to the increasing demand for solder spheres in various applications such as BGA, CSP & WLCSP, FliChip and others. The lead-free solder spheres segment is expected to grow at a higher rate than the lead solder spheres segment during the forecast period due to its environmental friendliness and cost effectiveness.
Some Of The Growth Factors Of This Market:
- The increasing demand for solder spheres is a major factor in the growth of the market.
- The increasing use of solder spheres in various industries such as automotive, electronics, and construction is also a major factor in the growth of the market.
- The growing need for high-quality solder spheres with low impurities is another factor that will drive the market's growth over time.
- The rising demand for lead-free solder spheres due to environmental concerns will also be a key driver of this market's growth over time.
- Increasing investments by companies into research and development activities related to new technologies and innovations will also be an important driver of this market's growth over time.
Industry Growth Insights published a new data on “Solder Spheres Market”. The research report is titled “Solder Spheres Market research by Types (Lead Solder Spheres, Lead Free Solder Spheres), By Applications (BGA, CSP & WLCSP, Flip-Chip & Others), By Players/Companies Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Indium Corporation, Jovy Systems”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Solder Spheres Market Research Report
By Type
Lead Solder Spheres, Lead Free Solder Spheres
By Application
BGA, CSP & WLCSP, Flip-Chip & Others
By Companies
Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Indium Corporation, Jovy Systems
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
247
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
Global Solder Spheres Market Report Segments:
The global Solder Spheres market is segmented on the basis of:
Types
Lead Solder Spheres, Lead Free Solder Spheres
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
BGA, CSP & WLCSP, Flip-Chip & Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Senju Metal
- DS HiMetal
- MKE
- YCTC
- Nippon Micrometal
- Accurus
- PMTC
- Shanghai hiking solder material
- Shenmao Technology
- Indium Corporation
- Jovy Systems
Highlights of The Solder Spheres Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead Solder Spheres
- Lead Free Solder Spheres
- By Application:
- BGA
- CSP & WLCSP
- Flip-Chip & Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Solder Spheres Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Solder spheres are a type of solder that is made up of a metal core and an outer shell. The metal core is typically lead, while the shell can be any number of different metals. This allows for a variety of soldering applications, as well as improved heat transfer and reliability.
Some of the key players operating in the solder spheres market are Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Indium Corporation, Jovy Systems.
The solder spheres market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Solder Spheres Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Solder Spheres Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Solder Spheres Market - Supply Chain
4.5. Global Solder Spheres Market Forecast
4.5.1. Solder Spheres Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Solder Spheres Market Size (000 Units) and Y-o-Y Growth
4.5.3. Solder Spheres Market Absolute $ Opportunity
5. Global Solder Spheres Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Solder Spheres Market Size and Volume Forecast by Type
5.3.1. Lead Solder Spheres
5.3.2. Lead Free Solder Spheres
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Solder Spheres Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Solder Spheres Market Size and Volume Forecast by Application
6.3.1. BGA
6.3.2. CSP & WLCSP
6.3.3. Flip-Chip & Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Solder Spheres Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Solder Spheres Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Solder Spheres Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Solder Spheres Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Solder Spheres Demand Share Forecast, 2019-2029
9. North America Solder Spheres Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Solder Spheres Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Solder Spheres Market Size and Volume Forecast by Application
9.4.1. BGA
9.4.2. CSP & WLCSP
9.4.3. Flip-Chip & Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Solder Spheres Market Size and Volume Forecast by Type
9.7.1. Lead Solder Spheres
9.7.2. Lead Free Solder Spheres
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Solder Spheres Demand Share Forecast, 2019-2029
10. Latin America Solder Spheres Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Solder Spheres Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Solder Spheres Market Size and Volume Forecast by Application
10.4.1. BGA
10.4.2. CSP & WLCSP
10.4.3. Flip-Chip & Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Solder Spheres Market Size and Volume Forecast by Type
10.7.1. Lead Solder Spheres
10.7.2. Lead Free Solder Spheres
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Solder Spheres Demand Share Forecast, 2019-2029
11. Europe Solder Spheres Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Solder Spheres Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Solder Spheres Market Size and Volume Forecast by Application
11.4.1. BGA
11.4.2. CSP & WLCSP
11.4.3. Flip-Chip & Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Solder Spheres Market Size and Volume Forecast by Type
11.7.1. Lead Solder Spheres
11.7.2. Lead Free Solder Spheres
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential nalysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Solder Spheres Demand Share, 2019-2029
12. Asia Pacific Solder Spheres Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Solder Spheres Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Solder Spheres Market Size and Volume Forecast by Application
12.4.1. BGA
12.4.2. CSP & WLCSP
12.4.3. Flip-Chip & Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Solder Spheres Market Size and Volume Forecast by Type
12.7.1. Lead Solder Spheres
12.7.2. Lead Free Solder Spheres
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Solder Spheres Demand Share, 2019-2029
13. Middle East & Africa Solder Spheres Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Solder Spheres Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Solder Spheres Market Size and Volume Forecast by Application
13.4.1. BGA
13.4.2. CSP & WLCSP
13.4.3. Flip-Chip & Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Solder Spheres Market Size and Volume Forecast by Type
13.7.1. Lead Solder Spheres
13.7.2. Lead Free Solder Spheres
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Solder Spheres Demand Share, 2019-2029
14. Competition Landscape
14.1. Global Solder Spheres Market: Market Share Analysis
14.2. Solder Spheres Distributors and Customers
14.3. Solder Spheres Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Senju Metal
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. DS HiMetal
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. MKE
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. YCTC
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Nippon Micrometal
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Accurus
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. PMTC
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Shanghai hiking solder material
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Shenmao Technology
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Indium Corporation
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Jovy Systems
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
