Market Overview:
The global tape for semiconductor process market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductors in various applications, such as automotive, consumer electronics, and industrial. In addition, the growing demand for miniaturization of electronic devices is also contributing to the growth of this market. The global tape for semiconductor process market can be segmented on the basis of type and application. On the basis of type, it can be divided into UV type and non-UV type. The UV type segment is expected to grow at a higher CAGR during the forecast period owing to its superior properties such as high adhesion strength and chemical resistance as compared with other types of tapes available in the market. On the basis of application, it can be classified into backgrinding and dicing applications.
Product Definition:
Tape for Semiconductor Process is a material used in the fabrication of semiconductor devices. It is a thin, flexible material that can be easily cut to size and shape. Tape is used to create electrical connections between components on a semiconductor device.
UV Type:
UV type is used for cleaning and purifying the gas stream in semiconductor manufacturing processes. It helps remove particulates, dissolved gases & other contaminants from the process air. The removal of these contaminants not only improves the quality of air entering into downstream processing but also reduces energy consumption by reducing downtime due to contamination issues.
Non-UV Type:
Non-UV type is used in tape for semiconductor process to separate the front and rear wafers during the manufacturing of semiconductors. The non-uv type can be further classified into a thermal belt, trolley, and shoe. In this process, a high temperature is generated on one side of the wafer which helps to melt the bond between two layers thus allowing separation.
Application Insights:
The market is segmented into multiple applications, including for backgrinding, for dicing and other processes. The other processes application segment held the largest share of over 40% in 2017. This can be attributed to the growing demand from various end-use industries such as electronics and semiconductors.
For backgrinding applications are used to remove scale from both sides of a wafer before it goes into an exposure machine or a pick-and-place machine.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rapid industrialization, availability of low-cost labor, and high demand from end-use industries such as telecommunication and electronics. China is projected to remain a key player in this regional market owing to its large semiconductor industry.
The European region accounted for a significant share in terms of revenue due to presence of major electronic manufacturers such as Siemens AG, Alstom Grid Ltd., General Electric Company; however; it is expected that within next eight years Europe would lose its share due lack old technology process using CVD method which has less advantage over other newer technologies like ALD or EUV so it would lose out compared with others who are adopting these newer technologies hence losing out on potential business opportunities thus making it one of the slowest growing regions globally.
Growth Factors:
- Increasing demand for semiconductor devices from the consumer electronics sector
- Proliferation of 3D NAND flash technology
- Growing popularity of wearable electronics and the Internet of Things (IoT)
- Rising demand for semiconductor packaging and testing services
- Emergence of new applications such as automotive, industrial, and medical
Scope Of The Report
Report Attributes
Report Details
Report Title
Tape for Semiconductor Process Market Research Report
By Type
UV Type, Non-UV Type
By Application
For Backgrinding, For Dicing
By Companies
Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
235
Number of Tables & Figures
165
Customization Available
Yes, the report can be customized as per your need.
Global Tape for Semiconductor Process Market Report Segments:
The global Tape for Semiconductor Process market is segmented on the basis of:
Types
UV Type, Non-UV Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
For Backgrinding, For Dicing
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Mitsui Chemicals Tohcello
- Nitto
- LINTEC
- Furukawa Electric
- Denka
- D&X
- AI Technology
Highlights of The Tape for Semiconductor Process Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- UV Type
- Non-UV Type
- By Application:
- For Backgrinding
- For Dicing
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Tape for Semiconductor Process Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Tape for semiconductor process is a material that is used to create a protective layer on the surface of wafers during various stages of manufacturing. The tape helps to prevent contamination and oxidation, which can affect the quality of the semiconductor product.
Some of the major companies in the tape for semiconductor process market are Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology.
The tape for semiconductor process market is expected to grow at a compound annual growth rate of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Tape for Semiconductor Process Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Tape for Semiconductor Process Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Tape for Semiconductor Process Market - Supply Chain
4.5. Global Tape for Semiconductor Process Market Forecast
4.5.1. Tape for Semiconductor Process Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Tape for Semiconductor Process Market Size (000 Units) and Y-o-Y Growth
4.5.3. Tape for Semiconductor Process Market Absolute $ Opportunity
5. Global Tape for Semiconductor Process Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Tape for Semiconductor Process Market Size and Volume Forecast by Type
5.3.1. UV Type
5.3.2. Non-UV Type
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Tape for Semiconductor Process Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Tape for Semiconductor Process Market Size and Volume Forecast by Application
6.3.1. For Backgrinding
6.3.2. For Dicing
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Tape for Semiconductor Process Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Tape for Semiconductor Process Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Tape for Semiconductor Process Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Tape for Semiconductor Process Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Tape for Semiconductor Process Demand Share Forecast, 2019-2026
9. North America Tape for Semiconductor Process Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Tape for Semiconductor Process Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Tape for Semiconductor Process Market Size and Volume Forecast by Application
9.4.1. For Backgrinding
9.4.2. For Dicing
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Tape for Semiconductor Process Market Size and Volume Forecast by Type
9.7.1. UV Type
9.7.2. Non-UV Type
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Tape for Semiconductor Process Demand Share Forecast, 2019-2026
10. Latin America Tape for Semiconductor Process Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Tape for Semiconductor Process Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Tape for Semiconductor Process Market Size and Volume Forecast by Application
10.4.1. For Backgrinding
10.4.2. For Dicing
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Tape for Semiconductor Process Market Size and Volume Forecast by Type
10.7.1. UV Type
10.7.2. Non-UV Type
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Tape for Semiconductor Process Demand Share Forecast, 2019-2026
11. Europe Tape for Semiconductor Process Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Tape for Semiconductor Process Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Tape for Semiconductor Process Market Size and Volume Forecast by Application
11.4.1. For Backgrinding
11.4.2. For Dicing
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Tape for Semiconductor Process Market Size and Volume Forecast by Type
11.7.1. UV Type
11.7.2. Non-UV Type
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Tape for Semiconductor Process Demand Share, 2019-2026
12. Asia Pacific Tape for Semiconductor Process Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Tape for Semiconductor Process Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Tape for Semiconductor Process Market Size and Volume Forecast by Application
12.4.1. For Backgrinding
12.4.2. For Dicing
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Tape for Semiconductor Process Market Size and Volume Forecast by Type
12.7.1. UV Type
12.7.2. Non-UV Type
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Tape for Semiconductor Process Demand Share, 2019-2026
13. Middle East & Africa Tape for Semiconductor Process Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Tape for Semiconductor Process Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Tape for Semiconductor Process Market Size and Volume Forecast by Application
13.4.1. For Backgrinding
13.4.2. For Dicing
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Tape for Semiconductor Process Market Size and Volume Forecast by Type
13.7.1. UV Type
13.7.2. Non-UV Type
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Tape for Semiconductor Process Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Tape for Semiconductor Process Market: Market Share Analysis
14.2. Tape for Semiconductor Process Distributors and Customers
14.3. Tape for Semiconductor Process Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Mitsui Chemicals Tohcello
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Nitto
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. LINTEC
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Furukawa Electric
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Denka
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. D&X
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. AI Technology
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. COMPANY8
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
