The global thermal interface materials for electronics cooling market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The growth of this market can be attributed to the increasing demand for electronic devices and their components, which in turn is driving the demand for thermal interface materials. The increasing adoption of these materials in various applications such as power devices and electronics is also contributing to the growth of this market.
The global thermal interface materials for electronics cooling market by type includes greases, elastomeric pads, thermal tapes, and phase change materials. Greases are expected to account for a major share in this market due to their low cost and ease of application on surfaces with high heat fluxes. Elastomeric pads are also expected to account for a significant share in this market due to their ability to provide good contact between surfaces with different coefficients of expansion while maintaining low contact resistance between them. Thermal tapes are also expected have a significant share in this market due primarily because they offer an easy way of applying heat transfer material on surfaces with high heat fluxes without any need for surface preparation or cleaning before application.
Some Of The Growth Factors Of This Market:
- The demand for thermal interface materials for electronics cooling is driven by the need to reduce the heat generated by electronic devices.
- The demand for thermal interface materials for electronics cooling is also driven by the need to improve performance of electronic devices and reduce their power consumption.
- The demand for thermal interface materials for electronics cooling is also driven by the need to increase reliability of electronic devices and extend their life span.
- The demand for thermal interface materials for electronics cooling is also driven by the need to improve performance of electronic devices in harsh environments, such as high altitude or high temperature environments, where air circulation may be limited or non-existent, respectively.
- Increasing use of mobile computing devices such as laptops and tablets will drive growth in this market.
Industry Growth Insights published a new data on “Thermal Interface Materials For Electronics Cooling Market”. The research report is titled “Thermal Interface Materials For Electronics Cooling Market research by Types (Greases, Elastomeric Pads, Thermal Tapes, Phase Change Materials, Other), By Applications (Electronics, Power Devices, Others), By Players/Companies DowDuPont, Shin-Etsu, Btech, Laird Performance Materials, Henkel, Honeywell, Laird Technologies, 3M, SEMIKRON”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Thermal Interface Materials For Electronics Cooling Market Research Report
By Type
Greases, Elastomeric Pads, Thermal Tapes, Phase Change Materials, Other
By Application
Electronics, Power Devices, Others
By Companies
DowDuPont, Shin-Etsu, Btech, Laird Performance Materials, Henkel, Honeywell, Laird Technologies, 3M, SEMIKRON
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
245
Number of Tables & Figures
172
Customization Available
Yes, the report can be customized as per your need.
Global Thermal Interface Materials For Electronics Cooling Market Report Segments:
The global Thermal Interface Materials For Electronics Cooling market is segmented on the basis of:
Types
Greases, Elastomeric Pads, Thermal Tapes, Phase Change Materials, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronics, Power Devices, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DowDuPont
- Shin-Etsu
- Btech
- Laird Performance Materials
- Henkel
- Honeywell
- Laird Technologies
- 3M
- SEMIKRON
Highlights of The Thermal Interface Materials For Electronics Cooling Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Greases
- Elastomeric Pads
- Thermal Tapes
- Phase Change Materials
- Other
- By Application:
- Electronics
- Power Devices
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thermal Interface Materials For Electronics Cooling Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thermal interface materials (TIMs) are used to improve the cooling performance of electronic devices. TIMs are often made from a variety of materials, including copper, aluminum, and silicone. They are placed between the device's heat-generating components and its cooler parts to reduce thermal transfer between them.
Some of the key players operating in the thermal interface materials for electronics cooling market are DowDuPont, Shin-Etsu, Btech, Laird Performance Materials, Henkel, Honeywell, Laird Technologies, 3M, SEMIKRON.
The thermal interface materials for electronics cooling market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Thermal Interface Materials For Electronics Cooling Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Thermal Interface Materials For Electronics Cooling Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Thermal Interface Materials For Electronics Cooling Market - Supply Chain
4.5. Global Thermal Interface Materials For Electronics Cooling Market Forecast
4.5.1. Thermal Interface Materials For Electronics Cooling Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Thermal Interface Materials For Electronics Cooling Market Size (000 Units) and Y-o-Y Growth
4.5.3. Thermal Interface Materials For Electronics Cooling Market Absolute $ Opportunity
5. Global Thermal Interface Materials For Electronics Cooling Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Type
5.3.1. Greases
5.3.2. Elastomeric Pads
5.3.3. Thermal Tapes
5.3.4. Phase Change Materials
5.3.5. Other
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Thermal Interface Materials For Electronics Cooling Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Application
6.3.1. Electronics
6.3.2. Power Devices
6.3.3. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Thermal Interface Materials For Electronics Cooling Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Thermal Interface Materials For Electronics Cooling Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Thermal Interface Materials For Electronics Cooling Demand Share Forecast, 2019-2026
9. North America Thermal Interface Materials For Electronics Cooling Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Application
9.4.1. Electronics
9.4.2. Power Devices
9.4.3. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Type
9.7.1. Greases
9.7.2. Elastomeric Pads
9.7.3. Thermal Tapes
9.7.4. Phase Change Materials
9.7.5. Other
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Thermal Interface Materials For Electronics Cooling Demand Share Forecast, 2019-2026
10. Latin America Thermal Interface Materials For Electronics Cooling Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Application
10.4.1. Electronics
10.4.2. Power Devices
10.4.3. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Type
10.7.1. Greases
10.7.2. Elastomeric Pads
10.7.3. Thermal Tapes
10.7.4. Phase Change Materials
10.7.5. Other
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Thermal Interface Materials For Electronics Cooling Demand Share Forecast, 2019-2026
11. Europe Thermal Interface Materials For Electronics Cooling Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Application
11.4.1. Electronics
11.4.2. Power Devices
11.4.3. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Theral Interface Materials For Electronics Cooling Market Size and Volume Forecast by Type
11.7.1. Greases
11.7.2. Elastomeric Pads
11.7.3. Thermal Tapes
11.7.4. Phase Change Materials
11.7.5. Other
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Thermal Interface Materials For Electronics Cooling Demand Share, 2019-2026
12. Asia Pacific Thermal Interface Materials For Electronics Cooling Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Application
12.4.1. Electronics
12.4.2. Power Devices
12.4.3. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Type
12.7.1. Greases
12.7.2. Elastomeric Pads
12.7.3. Thermal Tapes
12.7.4. Phase Change Materials
12.7.5. Other
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Thermal Interface Materials For Electronics Cooling Demand Share, 2019-2026
13. Middle East & Africa Thermal Interface Materials For Electronics Cooling Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Application
13.4.1. Electronics
13.4.2. Power Devices
13.4.3. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Thermal Interface Materials For Electronics Cooling Market Size and Volume Forecast by Type
13.7.1. Greases
13.7.2. Elastomeric Pads
13.7.3. Thermal Tapes
13.7.4. Phase Change Materials
13.7.5. Other
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Thermal Interface Materials For Electronics Cooling Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Thermal Interface Materials For Electronics Cooling Market: Market Share Analysis
14.2. Thermal Interface Materials For Electronics Cooling Distributors and Customers
14.3. Thermal Interface Materials For Electronics Cooling Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. DowDuPont
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Shin-Etsu
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Btech
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Laird Performance Materials
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Henkel
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Honeywell
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Laird Technologies
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. 3M
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. SEMIKRON
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
