The global thermosetting moulding materials for electronics market is expected to grow at a CAGR of 4.5% during the forecast period, to reach USD 3.2 billion by 2030. The growth of this market is driven by the increasing demand for electronic devices and their components, such as smartphones, tablets, laptops and televisions. The demand for these devices has increased due to the growing number of internet users globally and the increasing penetration of mobile phones in developing countries. The global thermosetting moulding materials for electronics market is segmented on the basis of type into epoxy, polyester, polyurethane, polyimide and bakelite; on application into automotive industry (automotive), consumer electronics industry (consumer electronics) and aerospace industry (aerospace); and on region into North America (NA), Latin America (LA), Europe (EU), Asia Pacific excluding Japan (APeJ) and Middle East & Africa (MEA).
Some Of The Growth Factors Of This Market:
- Thermosetting moulding materials for electronics are used in the production of electronic components such as printed circuit boards, semiconductors, and other electronic devices.
- The demand for thermosetting moulding materials for electronics is driven by the increasing demand from the consumer electronics industry.
- The growth of this market is also driven by the increasing use of thermosetting moulding materials in automotive applications such as engine blocks and fuel tanks which require high-temperature resistance to withstand extreme heat conditions during operation.
- Increasing use of thermosetting moulding materials in aerospace applications such as aircraft engines and fuselages which require high-temperature resistance to withstand extreme heat conditions during operation is also driving this market's growth.
- Increasing use of thermosetting moulding materials in medical applications such as pacemakers, stents, and other implantable devices which require high-temperature resistance to withstand extreme heat conditions during operation is also driving this market's growth.
Industry Growth Insights published a new data on “Thermosetting Moulding Materials for Electronics Market”. The research report is titled “Thermosetting Moulding Materials for Electronics Market research by Types (Epoxy, Polyester, Polyurethane, Polyimide, Bakelite, Formaldehyde, Others), By Applications (Automotive, Consumer Electronics, Aerospace, Other), By Players/Companies BASF, Cosmic Plastics, Eastman, Hitachi, Huntsman, Evonik, Momentive, Kolon industries, Plastics Engineering Company (Plenco), KYOCERA”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Thermosetting Moulding Materials for Electronics Market Research Report
By Type
Epoxy, Polyester, Polyurethane, Polyimide, Bakelite, Formaldehyde, Others
By Application
Automotive, Consumer Electronics, Aerospace, Other
By Companies
BASF, Cosmic Plastics, Eastman, Hitachi, Huntsman, Evonik, Momentive, Kolon industries, Plastics Engineering Company (Plenco), KYOCERA
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
245
Number of Tables & Figures
172
Customization Available
Yes, the report can be customized as per your need.
Global Thermosetting Moulding Materials for Electronics Market Report Segments:
The global Thermosetting Moulding Materials for Electronics market is segmented on the basis of:
Types
Epoxy, Polyester, Polyurethane, Polyimide, Bakelite, Formaldehyde, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive, Consumer Electronics, Aerospace, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- BASF
- Cosmic Plastics
- Eastman
- Hitachi
- Huntsman
- Evonik
- Momentive
- Kolon industries
- Plastics Engineering Company (Plenco)
- KYOCERA
Highlights of The Thermosetting Moulding Materials for Electronics Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Epoxy
- Polyester
- Polyurethane
- Polyimide
- Bakelite
- Formaldehyde
- Others
- By Application:
- Automotive
- Consumer Electronics
- Aerospace
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thermosetting Moulding Materials for Electronics Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thermosetting molding materials are used in the manufacturing of electronics. These materials are often used to create parts that need to be heat-resistant, such as circuit boards and connectors.
Some of the key players operating in the thermosetting moulding materials for electronics market are BASF, Cosmic Plastics, Eastman, Hitachi, Huntsman, Evonik, Momentive, Kolon industries, Plastics Engineering Company (Plenco), KYOCERA.
The thermosetting moulding materials for electronics market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Thermosetting Moulding Materials for Electronics Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Thermosetting Moulding Materials for Electronics Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Thermosetting Moulding Materials for Electronics Market - Supply Chain
4.5. Global Thermosetting Moulding Materials for Electronics Market Forecast
4.5.1. Thermosetting Moulding Materials for Electronics Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Thermosetting Moulding Materials for Electronics Market Size (000 Units) and Y-o-Y Growth
4.5.3. Thermosetting Moulding Materials for Electronics Market Absolute $ Opportunity
5. Global Thermosetting Moulding Materials for Electronics Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Type
5.3.1. Epoxy
5.3.2. Polyester
5.3.3. Polyurethane
5.3.4. Polyimide
5.3.5. Bakelite
5.3.6. Formaldehyde
5.3.7. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Thermosetting Moulding Materials for Electronics Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Application
6.3.1. Automotive
6.3.2. Consumer Electronics
6.3.3. Aerospace
6.3.4. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Thermosetting Moulding Materials for Electronics Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Thermosetting Moulding Materials for Electronics Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Thermosetting Moulding Materials for Electronics Demand Share Forecast, 2019-2029
9. North America Thermosetting Moulding Materials for Electronics Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Application
9.4.1. Automotive
9.4.2. Consumer Electronics
9.4.3. Aerospace
9.4.4. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Type
9.7.1. Epoxy
9.7.2. Polyester
9.7.3. Polyurethane
9.7.4. Polyimide
9.7.5. Bakelite
9.7.6. Formaldehyde
9.7.7. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Thermosetting Moulding Materials for Electronics Demand Share Forecast, 2019-2029
10. Latin America Thermosetting Moulding Materials for Electronics Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Application
10.4.1. Automotive
10.4.2. Consumer Electronics
10.4.3. Aerospace
10.4.4. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Type
10.7.1. Epoxy
10.7.2. Polyester
10.7.3. Polyurethane
10.7.4. Polyimide
10.7.5. Bakelite
10.7.6. Formaldehyde
10.7.7. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Thermosetting Moulding Materials for Electronics Demand Share Forecast, 2019-2029
11. Europe Thermosetting Moulding Materials for Electronics Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Application
11.4.1. Automotive
11.4.2. Consumer Electronics
11.4.3. Aerospace
11.4.4. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Type
11.7.1. Epoxy
11.7.2. Polyester
11.7.3. Polyurethane
11.7.4. Polyimide
11.7.5. Bakelite
11.7.6. Formaldehyde
11.7.7. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Thermosetting Moulding Materials for Electronics Demand Share, 2019-2029
12. Asia Pacific Thermosetting Moulding Materials for Electronics Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Application
12.4.1. Automotive
12.4.2. Consumer Electronics
12.4.3. Aerospace
12.4.4. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Type
12.7.1. Epoxy
12.7.2. Polyester
12.7.3. Polyurethane
12.7.4. Polyimide
12.7.5. Bakelite
12.7.6. Formaldehyde
12.7.7. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Thermosetting Moulding Materials for Electronics Demand Share, 2019-2029
13. Middle East & Africa Thermosetting Moulding Materials for Electronics Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Application
13.4.1. Automotive
13.4.2. Consumer Electronics
13.4.3. Aerospace
13.4.4. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Thermosetting Moulding Materials for Electronics Market Size and Volume Forecast by Type
13.7.1. Epoxy
13.7.2. Polyester
13.7.3. Polyurethane
13.7.4. Polyimide
13.7.5. Bakelite
13.7.6. Formaldehyde
13.7.7. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Thermosetting Moulding Materials for Electronics Demand Share, 2019-2029
14. Competition Landscape
14.1. Global Thermosetting Moulding Materials for Electronics Market: Market Share Analysis
14.2. Thermosetting Moulding Materials for Electronics Distributors and Customers
14.3. Thermosetting Moulding Materials for Electronics Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. BASF
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Cosmic Plastics
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Eastman
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Hitachi
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Huntsman
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Evonik
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Momentive
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Kolon industries
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Plastics Engineering Company (Plenco)
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. KYOCERA
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview<