The global thicfilm hybrid integrated circuits market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The growth of this market is attributed to the increasing demand for high-performance and low-power devices in various applications such as avionics and defense, automotive, telecoms and computer industry, consumer electronics applications.
The 96% Al2O3 ceramic substrate segment accounted for the largest share of the global thicfilm hybrid integrated circuits market in 2018. This can be attributed to its high performance and low power consumption properties which are suitable for various applications such as avionics and defense, automotive, telecoms and computer industry, consumer electronics applications. The BeO ceramic substrate segment accounted for the second largest share of this market in 2018 due to its high thermal conductivity property which makes it suitable for use in high power devices such as avionics and defense systems or automotive systems with higher heat dissipation requirements.
Some Of The Growth Factors Of This Market:
- The growth of the market is attributed to the increasing demand for high-performance and low-power integrated circuits in various applications such as automotive, industrial, and consumer electronics industries.
- The increasing demand for high-performance and low-power integrated circuits in various applications such as automotive, industrial, and consumer electronics industries is expected to drive the growth of the market during the forecast period.
- Increasing adoption of IoT devices across various sectors including healthcare, transportation & logistics, retail & ecommerce are also driving the growth of this market.
- Increasing investments by key players in R&D activities are also driving this market.
Industry Growth Insights published a new data on “Thick-Film Hybrid Integrated Circuits Market”. The research report is titled “Thick-Film Hybrid Integrated Circuits Market research by Types (96% Al2O3 Ceramic Substrate, BeO Ceramic Substrate, AIN Based, Other Substrates), By Applications (Avionics and Defense, Automotive, Telecoms and Computer Industry, Consumer Electrons, Other Applications), By Players/Companies Crane Interpoint, VPT(HEICO), MDI, MSK(Anaren), IR(Infineon), GE, Techngraph, AUREL s.p.a., Cermetek, JRM, Siegert, ISSI, Custom Interconnect, Midas, ACT, E-TekNet, Integrated Technology Lab, CSIMC, Zhenhua, JEC, Sevenstar, Fenghua, CETC”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Thick-Film Hybrid Integrated Circuits Market Research Report
By Type
96% Al2O3 Ceramic Substrate, BeO Ceramic Substrate, AIN Based, Other Substrates
By Application
Avionics and Defense, Automotive, Telecoms and Computer Industry, Consumer Electrons, Other Applications
By Companies
Crane Interpoint, VPT(HEICO), MDI, MSK(Anaren), IR(Infineon), GE, Techngraph, AUREL s.p.a., Cermetek, JRM, Siegert, ISSI, Custom Interconnect, Midas, ACT, E-TekNet, Integrated Technology Lab, CSIMC, Zhenhua, JEC, Sevenstar, Fenghua, CETC
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
230
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Thick-Film Hybrid Integrated Circuits Market Report Segments:
The global Thick-Film Hybrid Integrated Circuits market is segmented on the basis of:
Types
96% Al2O3 Ceramic Substrate, BeO Ceramic Substrate, AIN Based, Other Substrates
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Avionics and Defense, Automotive, Telecoms and Computer Industry, Consumer Electrons, Other Applications
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Crane Interpoint
- VPT(HEICO)
- MDI
- MSK(Anaren)
- IR(Infineon)
- GE
- Techngraph
- AUREL s.p.a.
- Cermetek
- JRM
- Siegert
- ISSI
- Custom Interconnect
- Midas
- ACT
- E-TekNet
- Integrated Technology Lab
- CSIMC
- Zhenhua
- JEC
- Sevenstar
- Fenghua
- CETC
Highlights of The Thick-Film Hybrid Integrated Circuits Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 96% Al2O3 Ceramic Substrate
- BeO Ceramic Substrate
- AIN Based
- Other Substrates
- By Application:
- Avionics and Defense
- Automotive
- Telecoms and Computer Industry
- Consumer Electrons
- Other Applications
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thick-Film Hybrid Integrated Circuits Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thick-film hybrid integrated circuits (TFHICs) are a type of integrated circuit that combines the benefits of both thin-film and bulk semiconductor technologies. TFHICs are made up of a number of layers, each with its own function, that are bonded together using heat and pressure. This allows for more complex circuitry than either thin film or bulk semiconductor technology can offer on their own.
Some of the major companies in the thick-film hybrid integrated circuits market are Crane Interpoint, VPT(HEICO), MDI, MSK(Anaren), IR(Infineon), GE, Techngraph, AUREL s.p.a., Cermetek, JRM, Siegert, ISSI, Custom Interconnect, Midas, ACT, E-TekNet, Integrated Technology Lab, CSIMC, Zhenhua, JEC, Sevenstar, Fenghua, CETC.
The thick-film hybrid integrated circuits market is expected to grow at a compound annual growth rate of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Thick-Film Hybrid Integrated Circuits Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Thick-Film Hybrid Integrated Circuits Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Thick-Film Hybrid Integrated Circuits Market - Supply Chain
4.5. Global Thick-Film Hybrid Integrated Circuits Market Forecast
4.5.1. Thick-Film Hybrid Integrated Circuits Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Thick-Film Hybrid Integrated Circuits Market Size (000 Units) and Y-o-Y Growth
4.5.3. Thick-Film Hybrid Integrated Circuits Market Absolute $ Opportunity
5. Global Thick-Film Hybrid Integrated Circuits Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Type
5.3.1. 96% Al2O3 Ceramic Substrate
5.3.2. BeO Ceramic Substrate
5.3.3. AIN Based
5.3.4. Other Substrates
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Thick-Film Hybrid Integrated Circuits Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Application
6.3.1. Avionics and Defense
6.3.2. Automotive
6.3.3. Telecoms and Computer Industry
6.3.4. Consumer Electrons
6.3.5. Other Applications
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Thick-Film Hybrid Integrated Circuits Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Thick-Film Hybrid Integrated Circuits Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Thick-Film Hybrid Integrated Circuits Demand Share Forecast, 2019-2026
9. North America Thick-Film Hybrid Integrated Circuits Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Application
9.4.1. Avionics and Defense
9.4.2. Automotive
9.4.3. Telecoms and Computer Industry
9.4.4. Consumer Electrons
9.4.5. Other Applications
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Type
9.7.1. 96% Al2O3 Ceramic Substrate
9.7.2. BeO Ceramic Substrate
9.7.3. AIN Based
9.7.4. Other Substrates
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Thick-Film Hybrid Integrated Circuits Demand Share Forecast, 2019-2026
10. Latin America Thick-Film Hybrid Integrated Circuits Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Application
10.4.1. Avionics and Defense
10.4.2. Automotive
10.4.3. Telecoms and Computer Industry
10.4.4. Consumer Electrons
10.4.5. Other Applications
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Type
10.7.1. 96% Al2O3 Ceramic Substrate
10.7.2. BeO Ceramic Substrate
10.7.3. AIN Based
10.7.4. Other Substrates
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Thick-Film Hybrid Integrated Circuits Demand Share Forecast, 2019-2026
11. Europe Thick-Film Hybrid Integrated Circuits Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Application
11.4.1. Avionics and Defense
11.4.2. Automotive
11.4.3. Telecoms and Computer Industry
11.4.4. Consumer Electrons
11.4.5. Other Applications
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7.Europe Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Type
11.7.1. 96% Al2O3 Ceramic Substrate
11.7.2. BeO Ceramic Substrate
11.7.3. AIN Based
11.7.4. Other Substrates
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Thick-Film Hybrid Integrated Circuits Demand Share, 2019-2026
12. Asia Pacific Thick-Film Hybrid Integrated Circuits Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Application
12.4.1. Avionics and Defense
12.4.2. Automotive
12.4.3. Telecoms and Computer Industry
12.4.4. Consumer Electrons
12.4.5. Other Applications
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Type
12.7.1. 96% Al2O3 Ceramic Substrate
12.7.2. BeO Ceramic Substrate
12.7.3. AIN Based
12.7.4. Other Substrates
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Thick-Film Hybrid Integrated Circuits Demand Share, 2019-2026
13. Middle East & Africa Thick-Film Hybrid Integrated Circuits Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Application
13.4.1. Avionics and Defense
13.4.2. Automotive
13.4.3. Telecoms and Computer Industry
13.4.4. Consumer Electrons
13.4.5. Other Applications
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Thick-Film Hybrid Integrated Circuits Market Size and Volume Forecast by Type
13.7.1. 96% Al2O3 Ceramic Substrate
13.7.2. BeO Ceramic Substrate
13.7.3. AIN Based
13.7.4. Other Substrates
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Thick-Film Hybrid Integrated Circuits Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Thick-Film Hybrid Integrated Circuits Market: Market Share Analysis
14.2. Thick-Film Hybrid Integrated Circuits Distributors and Customers
14.3. Thick-Film Hybrid Integrated Circuits Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Crane Interpoint
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. VPT(HEICO)
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. MDI
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. MSK(Anaren)
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. IR(Infineon)
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. GE
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Techngraph
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. AUREL s.p.a.
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Cermetek
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. JRM
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Siegert
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. ISSI
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Custom Interconnect
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Midas
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. ACT
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. E-TekNet
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Integrated Technology Lab
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. CSIMC
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. Zhenhua
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. JEC
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
