The global through glass vias substrate market is expected to reach USD 130.49 million by 2025. Biotechnology/medical application segment accounted for the largest share of the global through glass vias substrate market in 2018 and is expected to grow at a CAGR of 8% during the forecast period from 2021-2030. In terms of region, North America accounted for the largest share of the global through glass vias substrate market in 2018 and is expected to grow at a CAGR of 7% during forecast period from 2021-2030 owing to increasing demand for high-end electronics products such as smartphones and tablets among others which are driving demand for this product type across various applications such as consumer electronics, automotive etc, Latin America followed North America with its contribution accounting for 27%.
Some Of The Growth Factors Of This Market:
- The increasing demand for high-speed data transmission and the need for higher bandwidth in wireless communication networks are driving the growth of through glass vias substrate market.
- The growing number of mobile devices is also a major factor that is fueling the growth of this market, as these devices require more power to transmit signals over longer distances, which requires more power to transmit signals over longer distances, which requires more power to transmit signals over longer distances, which requires more power to transmit signals over longer distances, which requires more power to transmit signals over longer distances, which requires more power to transmit signals over longer distances, which requires more power to transmit signals over long distance.
Industry Growth Insights published a new data on “Through Glass Vias Substrate Market”. The research report is titled “Through Glass Vias Substrate Market research by Types (300 mm Wafer, 200 mm Wafer, Below 150 mm Wafer, In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018., Through Glass Vias Substrat), By Applications (Biotechnology/Medical, Consumer Electronics, Automotive, Others), By Players/Companies Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, Through Glass Vias Substrat”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Through Glass Vias Substrate Market Research Report
By Type
300 mm Wafer, 200 mm Wafer, Below 150 mm Wafer, In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018., Through Glass Vias Substrat
By Application
Biotechnology/Medical, Consumer Electronics, Automotive, Others
By Companies
Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, Through Glass Vias Substrat
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
238
Number of Tables & Figures
167
Customization Available
Yes, the report can be customized as per your need.
Global Through Glass Vias Substrate Market Report Segments:
The global Through Glass Vias Substrate market is segmented on the basis of:
Types
300 mm Wafer, 200 mm Wafer, Below 150 mm Wafer, In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018., Through Glass Vias Substrat
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Biotechnology/Medical, Consumer Electronics, Automotive, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Corning
- LPKF
- Samtec
- Kiso Micro Co.LTD
- Tecnisco
- Microplex
- Plan Optik
- NSG Group
- Allvia
- Through Glass Vias Substrat
Highlights of The Through Glass Vias Substrate Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 300 mm Wafer
- 200 mm Wafer
- Below 150 mm Wafer
- In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018.
- Through Glass Vias Substrat
- By Application:
- Biotechnology/Medical
- Consumer Electronics
- Automotive
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Through Glass Vias Substrate Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Through glass vias are a type of electronic component that allow electrical signals to travel through a transparent material. This type of substrate is often used in electronics because it allows for easy connection and communication between different parts of the device.
Some of the key players operating in the through glass vias substrate market are Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, Through Glass Vias Substrat.
The through glass vias substrate market is expected to grow at a compound annual growth rate of 8%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Through Glass Vias Substrate Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Through Glass Vias Substrate Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Through Glass Vias Substrate Market - Supply Chain
4.5. Global Through Glass Vias Substrate Market Forecast
4.5.1. Through Glass Vias Substrate Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Through Glass Vias Substrate Market Size (000 Units) and Y-o-Y Growth
4.5.3. Through Glass Vias Substrate Market Absolute $ Opportunity
5. Global Through Glass Vias Substrate Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Through Glass Vias Substrate Market Size and Volume Forecast by Type
5.3.1. 300 mm Wafer
5.3.2. 200 mm Wafer
5.3.3. Below 150 mm Wafer
5.3.4. In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018.
5.3.5. Through Glass Vias Substrat
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Through Glass Vias Substrate Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Through Glass Vias Substrate Market Size and Volume Forecast by Application
6.3.1. Biotechnology/Medical
6.3.2. Consumer Electronics
6.3.3. Automotive
6.3.4. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Through Glass Vias Substrate Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Through Glass Vias Substrate Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Through Glass Vias Substrate Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Through Glass Vias Substrate Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Through Glass Vias Substrate Demand Share Forecast, 2019-2026
9. North America Through Glass Vias Substrate Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Through Glass Vias Substrate Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Through Glass Vias Substrate Market Size and Volume Forecast by Application
9.4.1. Biotechnology/Medical
9.4.2. Consumer Electronics
9.4.3. Automotive
9.4.4. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Through Glass Vias Substrate Market Size and Volume Forecast by Type
9.7.1. 300 mm Wafer
9.7.2. 200 mm Wafer
9.7.3. Below 150 mm Wafer
9.7.4. In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018.
9.7.5. Through Glass Vias Substrat
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Through Glass Vias Substrate Demand Share Forecast, 2019-2026
10. Latin America Through Glass Vias Substrate Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Through Glass Vias Substrate Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Through Glass Vias Substrate Market Size and Volume Forecast by Application
10.4.1. Biotechnology/Medical
10.4.2. Consumer Electronics
10.4.3. Automotive
10.4.4. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Through Glass Vias Substrate Market Size and Volume Forecast by Type
10.7.1. 300 mm Wafer
10.7.2. 200 mm Wafer
10.7.3. Below 150 mm Wafer
10.7.4. In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018.
10.7.5. Through Glass Vias Substrat
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Through Glass Vias Substrate Demand Share Forecast, 2019-2026
11. Europe Through Glass Vias Substrate Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Through Glass Vias Substrate Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Through Glass Vias Substrate Market Size and Volume Forecast by Application
11.4.1. Biotechnology/Medical
11.4.2. Consumer Electronics
11.4.3. Automotive
11.4.4. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Through Glass Vias Substrate Market Size and Volume Forecast by Type
11.7.1. 300 mm Wafer
11.7.2. 200 mm Wafer
11.7.3. Below 150 mm Wafer
11.7.4. In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018.
11.7.5. Through Glass Vias Substrat
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Through Glass Vias Substrate Demand Share, 2019-2026
12. Asia Pacific Through Glass Vias Substrate Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Through Glass Vias Substrate Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Through Glass Vias Substrate Market Size and Volume Forecast by Application
12.4.1. Biotechnology/Medical
12.4.2. Consumer Electronics
12.4.3. Automotive
12.4.4. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Through Glass Vias Substrate Market Size and Volume Forecast by Type
12.7.1. 300 mm Wafer
12.7.2. 200 mm Wafer
12.7.3. Below 150 mm Wafer
12.7.4. In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018.
12.7.5. Through Glass Vias Substrat
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Through Glass Vias Substrate Demand Share, 2019-2026
13. Middle East & Africa Through Glass Vias Substrate Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Through Glass Vias Substrate Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Through Glass Vias Substrate Market Size and Volume Forecast by Application
13.4.1. Biotechnology/Medical
13.4.2. Consumer Electronics
13.4.3. Automotive
13.4.4. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Through Glass Vias Substrate Market Size and Volume Forecast by Type
13.7.1. 300 mm Wafer
13.7.2. 200 mm Wafer
13.7.3. Below 150 mm Wafer
13.7.4. In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018.
13.7.5. Through Glass Vias Substrat
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Through Glass Vias Substrate Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Through Glass Vias Substrate Market: Market Share Analysis
14.2. Through Glass Vias Substrate Distributors and Customers
14.3. Through Glass Vias Substrate Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Corning
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. LPKF
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Samtec
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Kiso Micro Co.LTD
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Tecnisco
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Microplex
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Plan Optik
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. NSG Group
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Allvia
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Through Glass Vias Substrat
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook<