Market Overview:
The global ultra-thin copper foils market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for ultra-thin copper foils from various applications, such as IC boards, coreless substrates, and others. In terms of type, the market is segmented into up to 2?m, 2-5?m, 5-9?m and other segments. The up to 2?m segment is expected to hold the largest share of the global ultra-thin copper foil market during the forecast period. This can be attributed to its growing demand from various end users across different regions.
Product Definition:
Ultra-thin copper foils are used as the electrode material of choice in many printed electronics applications. They have a very low resistance and are therefore able to carry a high current density. Additionally, they are very thin and lightweight, which makes them ideal for use in portable devices.
Up to 2?m:
Up to 2?m is the thinnest copper foil type. It has a thickness of 0.2 - 0.3 ?m and is used in applications such as adhesives, paper coating, inks & coatings, plastics & polymers and electronic devices among others.
2-5?m:
2-5?m is the thinnest copper foil type available in the market. It has a thickness of 5 ?m or 2-5 mils. It is also known as thin gauge metal sheet and it's mainly used for packaging and printing applications.
It has high demand from food & beverage, cosmetics, pharmaceuticals,.
Application Insights:
The industry has been segmented on the basis of application into integrated circuit board, coreless substrate, and others. The IC Board segment accounted for a major share in 2017 and is expected to witness significant growth over the forecast period. Ultra-thin copper foil is used as an interconnect material in various electronic products such as mobile phones, laptops, tablets among others.
Ultra-thin copper foils are also used for heat transfer applications where low thermal conductivity is required such as air conditioning systems and refrigerators among others. They are increasingly being utilized in solar panels where high efficiency is required along with high production rates owing to their low cost compared to other materials like silver or gold which have higher thermal conductivity ratings respectively. In automobiles ultra-thin copper foils are widely utilized for powertrain components that require extreme thinness due to its excellent electrical properties including resistance against corrosion caused by acids present in vehicle fluids among other factors that contribute towards product demand globally.
Regional Analysis:
Asia Pacific was the largest market in 2017 and accounted for a revenue share of over 40%. The region is expected to continue its dominance over the forecast period. This can be attributed to increasing demand from various end-use industries, such as electronics, solar energy, medical equipment & devices among others.
The growth of end-use markets in Asia Pacific is also supported by rapid economic development taking place in countries like China and India. In addition, rising investments by governments across these countries are anticipated to boost industry expansion rates during the forecast period. For instance; according to Asian Development Bank (ADB), between 2010 and 2014 China invested USD X billion while India invested USD X billion into renewable energy infrastructure projects thereby boosting ultra-thin copper foil demand from solar panels manufacturing applications across both these economies significantly.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and transportation sector
- Growing popularity of flexible displays and circuits
- Proliferation of Internet of Things (IoT) devices
- Emerging applications in medical implants and energy storage
Scope Of The Report
Report Attributes
Report Details
Report Title
Ultra-thin Copper Foils Market Research Report
By Type
Up to 2?m, 2-5?m, 5-9?m, Other
By Application
IC Board, Coreless Substrate, Other
By Companies
Fukuda Metal Foil & Powder, Nan Ya Plastics, Mitsui Mining & Smelting, Furukawa Electric, JX Nippon Mining & Metal, Hitachi Metals, LS Mtron, Iljin Materials, HuiZhou United Copper Foil Electronic Material, Advanced Copper Foil i, Tongling Huifengke Electronic Material, LCY Technology, Kingboard Chemical
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
233
Number of Tables & Figures
164
Customization Available
Yes, the report can be customized as per your need.
Global Ultra-thin Copper Foils Market Report Segments:
The global Ultra-thin Copper Foils market is segmented on the basis of:
Types
Up to 2?m, 2-5?m, 5-9?m, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IC Board, Coreless Substrate, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Fukuda Metal Foil & Powder
- Nan Ya Plastics
- Mitsui Mining & Smelting
- Furukawa Electric
- JX Nippon Mining & Metal
- Hitachi Metals
- LS Mtron
- Iljin Materials
- HuiZhou United Copper Foil Electronic Material
- Advanced Copper Foil i
- Tongling Huifengke Electronic Material
- LCY Technology
- Kingboard Chemical
Highlights of The Ultra-thin Copper Foils Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Up to 2?m
- 2-5?m
- 5-9?m
- Other
- By Application:
- IC Board
- Coreless Substrate
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Ultra-thin Copper Foils Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Ultra-thin copper foils are made from a very thin sheet of copper that is less than 1/32 inch thick. These foils are used in a variety of applications, including solar energy, electronics and medical devices.
Some of the key players operating in the ultra-thin copper foils market are Fukuda Metal Foil & Powder, Nan Ya Plastics, Mitsui Mining & Smelting, Furukawa Electric, JX Nippon Mining & Metal, Hitachi Metals, LS Mtron, Iljin Materials, HuiZhou United Copper Foil Electronic Material, Advanced Copper Foil i, Tongling Huifengke Electronic Material, LCY Technology, Kingboard Chemical.
The ultra-thin copper foils market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Ultra-thin Copper Foils Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Ultra-thin Copper Foils Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Ultra-thin Copper Foils Market - Supply Chain
4.5. Global Ultra-thin Copper Foils Market Forecast
4.5.1. Ultra-thin Copper Foils Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Ultra-thin Copper Foils Market Size (000 Units) and Y-o-Y Growth
4.5.3. Ultra-thin Copper Foils Market Absolute $ Opportunity
5. Global Ultra-thin Copper Foils Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Ultra-thin Copper Foils Market Size and Volume Forecast by Type
5.3.1. Up to 2?m
5.3.2. 2-5?m
5.3.3. 5-9?m
5.3.4. Other
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Ultra-thin Copper Foils Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Ultra-thin Copper Foils Market Size and Volume Forecast by Application
6.3.1. IC Board
6.3.2. Coreless Substrate
6.3.3. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Ultra-thin Copper Foils Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Ultra-thin Copper Foils Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Ultra-thin Copper Foils Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Ultra-thin Copper Foils Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Ultra-thin Copper Foils Demand Share Forecast, 2019-2026
9. North America Ultra-thin Copper Foils Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Ultra-thin Copper Foils Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Ultra-thin Copper Foils Market Size and Volume Forecast by Application
9.4.1. IC Board
9.4.2. Coreless Substrate
9.4.3. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Ultra-thin Copper Foils Market Size and Volume Forecast by Type
9.7.1. Up to 2?m
9.7.2. 2-5?m
9.7.3. 5-9?m
9.7.4. Other
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Ultra-thin Copper Foils Demand Share Forecast, 2019-2026
10. Latin America Ultra-thin Copper Foils Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Ultra-thin Copper Foils Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Ultra-thin Copper Foils Market Size and Volume Forecast by Application
10.4.1. IC Board
10.4.2. Coreless Substrate
10.4.3. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Ultra-thin Copper Foils Market Size and Volume Forecast by Type
10.7.1. Up to 2?m
10.7.2. 2-5?m
10.7.3. 5-9?m
10.7.4. Other
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Ultra-thin Copper Foils Demand Share Forecast, 2019-2026
11. Europe Ultra-thin Copper Foils Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Ultra-thin Copper Foils Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Ultra-thin Copper Foils Market Size and Volume Forecast by Application
11.4.1. IC Board
11.4.2. Coreless Substrate
11.4.3. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Ultra-thin Copper Foils Market Size and Volume Forecast by Type
11.7.1. Up to 2?m
11.7.2. 2-5?m
11.7.3. 5-9?m
11.7.4. Other
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/rowth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Ultra-thin Copper Foils Demand Share, 2019-2026
12. Asia Pacific Ultra-thin Copper Foils Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Ultra-thin Copper Foils Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Ultra-thin Copper Foils Market Size and Volume Forecast by Application
12.4.1. IC Board
12.4.2. Coreless Substrate
12.4.3. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Ultra-thin Copper Foils Market Size and Volume Forecast by Type
12.7.1. Up to 2?m
12.7.2. 2-5?m
12.7.3. 5-9?m
12.7.4. Other
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Ultra-thin Copper Foils Demand Share, 2019-2026
13. Middle East & Africa Ultra-thin Copper Foils Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Ultra-thin Copper Foils Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Ultra-thin Copper Foils Market Size and Volume Forecast by Application
13.4.1. IC Board
13.4.2. Coreless Substrate
13.4.3. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Ultra-thin Copper Foils Market Size and Volume Forecast by Type
13.7.1. Up to 2?m
13.7.2. 2-5?m
13.7.3. 5-9?m
13.7.4. Other
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Ultra-thin Copper Foils Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Ultra-thin Copper Foils Market: Market Share Analysis
14.2. Ultra-thin Copper Foils Distributors and Customers
14.3. Ultra-thin Copper Foils Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Fukuda Metal Foil & Powder
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Nan Ya Plastics
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Mitsui Mining & Smelting
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Furukawa Electric
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. JX Nippon Mining & Metal
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Hitachi Metals
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. LS Mtron
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Iljin Materials
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. HuiZhou United Copper Foil Electronic Material
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Advanced Copper Foil i
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Tongling Huifengke Electronic Material
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. LCY Technology
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Kingboard Chemical
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook