The global unlead solder paste market is expected to grow at a CAGR of 4.5% during the forecast period, to reach USD 1.2 billion by 2030. The growth of this market can be attributed to the increasing demand for lead-free products in various industries such as automotive, electronics, and construction. The increasing demand for lead-free products is due to the environmental concerns associated with lead-based solder pastes and their hazardous effects on human health and environment.
The global unlead solder paste market has been segmented on the basis of type into lotemperature unlead solder paste, middltemperature unlead solder paste, higtemperature unlead solder paste; application into SMT (surface mount technology), wire board (WB), PCB board; and region into North America, Latin America, Europe, Asia Pacific (APAC) and Middle East & Africa (MEA).
- The global Unlead Solder Paste market is expected to grow at a CAGR of 3.5% during the forecast period, 2018-2025.
- The increasing demand for electronic devices and the need for high-quality products are some of the factors driving the growth of this market.
- The increasing demand for lead-free solder paste is also driving this market's growth as it helps in reducing environmental pollution and health hazards caused by lead exposure from soldering fumes and dusts, which are harmful to humans and animals alike.
- However, stringent regulations on lead content in electronics products may hamper the growth of this market.
- Increasing awareness about environmental pollution due to use of lead in solder paste may also hinder the growth of this market.
Industry Growth Insights published a new data on “Unlead Solder Paste Market”. The research report is titled “Unlead Solder Paste Market research by Types (Low-temperature Unlead Solder Paste, Middle-temperature Unlead Solder Paste, High-temperature Unlead Solder Paste), By Applications (SMT, Wire Board, PCB Board, Others), By Players/Companies Senju Metal Industry, Tamura, Weiteou, Alpha, KOKI, Kester, Tongfang Tech, Yashida, Henkel AG & Co., Huaqing Solder, Chengxing Group, AMTECH, Union Soltek Group, Indium Corporation, Nihon Superior, Shenzhen Bright, Qualitek, Nihon Genma Mfg, AIM Solder, Nordson, Interflux Electronics, Balver Zinn Josef Jost, MG Chemicals, Uchihashi Estec, Guangchen Metal Products, DongGuan Legret Metal, Nihon Almit, Zhongya Electronic Solder, Yanktai Microelectronic Material, Tianjin Songben”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Unlead Solder Paste Market Research Report
By Type
Low-temperature Unlead Solder Paste, Middle-temperature Unlead Solder Paste, High-temperature Unlead Solder Paste
By Application
SMT, Wire Board, PCB Board, Others
By Companies
Senju Metal Industry, Tamura, Weiteou, Alpha, KOKI, Kester, Tongfang Tech, Yashida, Henkel AG & Co., Huaqing Solder, Chengxing Group, AMTECH, Union Soltek Group, Indium Corporation, Nihon Superior, Shenzhen Bright, Qualitek, Nihon Genma Mfg, AIM Solder, Nordson, Interflux Electronics, Balver Zinn Josef Jost, MG Chemicals, Uchihashi Estec, Guangchen Metal Products, DongGuan Legret Metal, Nihon Almit, Zhongya Electronic Solder, Yanktai Microelectronic Material, Tianjin Songben
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
235
Number of Tables & Figures
165
Customization Available
Yes, the report can be customized as per your need.
Global Unlead Solder Paste Market Report Segments:
The global Unlead Solder Paste market is segmented on the basis of:
Types
Low-temperature Unlead Solder Paste, Middle-temperature Unlead Solder Paste, High-temperature Unlead Solder Paste
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT, Wire Board, PCB Board, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Senju Metal Industry
- Tamura
- Weiteou
- Alpha
- KOKI
- Kester
- Tongfang Tech
- Yashida
- Henkel AG & Co.
- Huaqing Solder
- Chengxing Group
- AMTECH
- Union Soltek Group
- Indium Corporation
- Nihon Superior
- Shenzhen Bright
- Qualitek
- Nihon Genma Mfg
- AIM Solder
- Nordson
- Interflux Electronics
- Balver Zinn Josef Jost
- MG Chemicals
- Uchihashi Estec
- Guangchen Metal Products
- DongGuan Legret Metal
- Nihon Almit
- Zhongya Electronic Solder
- Yanktai Microelectronic Material
- Tianjin Songben
Highlights of The Unlead Solder Paste Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Low-temperature Unlead Solder Paste
- Middle-temperature Unlead Solder Paste
- High-temperature Unlead Solder Paste
- By Application:
- SMT
- Wire Board
- PCB Board
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Unlead Solder Paste Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Unlead solder paste is a type of solder that does not contain lead. It is made from a mixture of tin and copper, and it is used to join metal pieces together.
Some of the major players in the unlead solder paste market are Senju Metal Industry, Tamura, Weiteou, Alpha, KOKI, Kester, Tongfang Tech, Yashida, Henkel AG & Co., Huaqing Solder, Chengxing Group, AMTECH, Union Soltek Group, Indium Corporation, Nihon Superior, Shenzhen Bright, Qualitek, Nihon Genma Mfg, AIM Solder, Nordson, Interflux Electronics, Balver Zinn Josef Jost, MG Chemicals, Uchihashi Estec, Guangchen Metal Products, DongGuan Legret Metal, Nihon Almit, Zhongya Electronic Solder, Yanktai Microelectronic Material, Tianjin Songben.
The unlead solder paste market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Unlead Solder Paste Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Unlead Solder Paste Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Unlead Solder Paste Market - Supply Chain
4.5. Global Unlead Solder Paste Market Forecast
4.5.1. Unlead Solder Paste Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Unlead Solder Paste Market Size (000 Units) and Y-o-Y Growth
4.5.3. Unlead Solder Paste Market Absolute $ Opportunity
5. Global Unlead Solder Paste Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Unlead Solder Paste Market Size and Volume Forecast by Type
5.3.1. Low-temperature Unlead Solder Paste
5.3.2. Middle-temperature Unlead Solder Paste
5.3.3. High-temperature Unlead Solder Paste
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Unlead Solder Paste Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Unlead Solder Paste Market Size and Volume Forecast by Application
6.3.1. SMT
6.3.2. Wire Board
6.3.3. PCB Board
6.3.4. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Unlead Solder Paste Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Unlead Solder Paste Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Unlead Solder Paste Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Unlead Solder Paste Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Unlead Solder Paste Demand Share Forecast, 2019-2026
9. North America Unlead Solder Paste Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Unlead Solder Paste Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Unlead Solder Paste Market Size and Volume Forecast by Application
9.4.1. SMT
9.4.2. Wire Board
9.4.3. PCB Board
9.4.4. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Unlead Solder Paste Market Size and Volume Forecast by Type
9.7.1. Low-temperature Unlead Solder Paste
9.7.2. Middle-temperature Unlead Solder Paste
9.7.3. High-temperature Unlead Solder Paste
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Unlead Solder Paste Demand Share Forecast, 2019-2026
10. Latin America Unlead Solder Paste Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Unlead Solder Paste Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Unlead Solder Paste Market Size and Volume Forecast by Application
10.4.1. SMT
10.4.2. Wire Board
10.4.3. PCB Board
10.4.4. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Unlead Solder Paste Market Size and Volume Forecast by Type
10.7.1. Low-temperature Unlead Solder Paste
10.7.2. Middle-temperature Unlead Solder Paste
10.7.3. High-temperature Unlead Solder Paste
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Unlead Solder Paste Demand Share Forecast, 2019-2026
11. Europe Unlead Solder Paste Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Unlead Solder Paste Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Unlead Solder Paste Market Size and Volume Forecast by Application
11.4.1. SMT
11.4.2. Wire Board
11.4.3. PCB Board
11.4.4. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Unlead Solder Paste Market Size and Volume Forecast by Type
11.7.1. Low-temperature Unlead Solder Paste
11.7.2. Middle-temperature Unlead Solder Paste
11.7.3. High-temperature Unlead Solder Paste
11.8. Bsis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Unlead Solder Paste Demand Share, 2019-2026
12. Asia Pacific Unlead Solder Paste Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Unlead Solder Paste Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Unlead Solder Paste Market Size and Volume Forecast by Application
12.4.1. SMT
12.4.2. Wire Board
12.4.3. PCB Board
12.4.4. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Unlead Solder Paste Market Size and Volume Forecast by Type
12.7.1. Low-temperature Unlead Solder Paste
12.7.2. Middle-temperature Unlead Solder Paste
12.7.3. High-temperature Unlead Solder Paste
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Unlead Solder Paste Demand Share, 2019-2026
13. Middle East & Africa Unlead Solder Paste Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Unlead Solder Paste Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Unlead Solder Paste Market Size and Volume Forecast by Application
13.4.1. SMT
13.4.2. Wire Board
13.4.3. PCB Board
13.4.4. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Unlead Solder Paste Market Size and Volume Forecast by Type
13.7.1. Low-temperature Unlead Solder Paste
13.7.2. Middle-temperature Unlead Solder Paste
13.7.3. High-temperature Unlead Solder Paste
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Unlead Solder Paste Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Unlead Solder Paste Market: Market Share Analysis
14.2. Unlead Solder Paste Distributors and Customers
14.3. Unlead Solder Paste Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Senju Metal Industry
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Tamura
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Weiteou
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Alpha
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. KOKI
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Kester
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Tongfang Tech
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Yashida
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Henkel AG & Co.
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Huaqing Solder
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Chengxing Group
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. AMTECH
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Union Soltek Group
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Indium Corporation
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Nihon Superior
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Shenzhen Bright
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. Qualitek
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. Nihon Genma Mfg
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. AIM Solder
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. Nordson
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
