The global wafer bonding machines market is expected to grow at a CAGR of 5.5% during the forecast period, to reach USD 1.2 billion by 2030. The growth of this market can be attributed to the increasing demand for MEMS, power devices, LED, RF components and CMOS sensors in various applications such as automotive electronics and medical devices.
The wafer size segment is expected to grow at a CAGR of 4% during the forecast period due to the increasing demand for 300mm wafers in various applications such as solar panels and advanced packaging. The application segment is expected to grow at a CAGR of 6% during the forecast period due to increased demand for MEMS in automotive electronics and medical devices; power device in consumer electronics; LED in lighting industry; RF components in wireless communication industry; CMOS sensor in security cameras and automotive industry among others.
Some Of The Growth Factors Of This Market:
- The growth of the wafer bonding machines market is driven by the increasing demand for semiconductor devices in various industries such as automotive, aerospace and defense, and consumer electronics among others.
- Increasing demand for high-performance semiconductors in various industries such as automotive, aerospace and defense, and consumer electronics among others are driving the growth of the wafer bonding machines market.
- The increasing adoption of advanced technologies such as IoT (Internet of Things) is also driving the growth of this market.
- However, factors such as lack of skilled workforce may hamper the growth rate.
Industry Growth Insights published a new data on “Wafer Bonding Machines Market”. The research report is titled “Wafer Bonding Machines Market research by Types (Wafer Size: 200mm, Wafer Size: 300mm), By Applications (MEMS, Power Device, LED, RF Components, CMOS Sensor, Solar Panel, Advanced Packaging, Others), By Players/Companies EV Group, SUSS MicroTec, Dynatex International, AML, Mitsubishi Heavy Industries, Ayumi Industries Company Limited, Tokyo Electron Limited, SMEE, U-Precision”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Bonding Machines Market Research Report
By Type
Wafer Size: 200mm, Wafer Size: 300mm
By Application
MEMS, Power Device, LED, RF Components, CMOS Sensor, Solar Panel, Advanced Packaging, Others
By Companies
EV Group, SUSS MicroTec, Dynatex International, AML, Mitsubishi Heavy Industries, Ayumi Industries Company Limited, Tokyo Electron Limited, SMEE, U-Precision
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
243
Number of Tables & Figures
171
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Bonding Machines Market Report Segments:
The global Wafer Bonding Machines market is segmented on the basis of:
Types
Wafer Size: 200mm, Wafer Size: 300mm
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
MEMS, Power Device, LED, RF Components, CMOS Sensor, Solar Panel, Advanced Packaging, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- EV Group
- SUSS MicroTec
- Dynatex International
- AML
- Mitsubishi Heavy Industries
- Ayumi Industries Company Limited
- Tokyo Electron Limited
- SMEE
- U-Precision
Highlights of The Wafer Bonding Machines Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Wafer Size: 200mm
- Wafer Size: 300mm
- By Application:
- MEMS
- Power Device
- LED
- RF Components
- CMOS Sensor
- Solar Panel
- Advanced Packaging
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Bonding Machines Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
- Market Entry Strategies
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer bonding machines are used to bond semiconductor wafers together. They use a high-frequency electric field to create a strong, permanent bond between the two wafers.
Some of the major companies in the wafer bonding machines market are EV Group, SUSS MicroTec, Dynatex International, AML, Mitsubishi Heavy Industries, Ayumi Industries Company Limited, Tokyo Electron Limited, SMEE, U-Precision.
The wafer bonding machines market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Wafer Bonding Machines Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Wafer Bonding Machines Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Wafer Bonding Machines Market - Supply Chain
4.5. Global Wafer Bonding Machines Market Forecast
4.5.1. Wafer Bonding Machines Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Wafer Bonding Machines Market Size (000 Units) and Y-o-Y Growth
4.5.3. Wafer Bonding Machines Market Absolute $ Opportunity
5. Global Wafer Bonding Machines Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Wafer Bonding Machines Market Size and Volume Forecast by Type
5.3.1. Wafer Size: 200mm
5.3.2. Wafer Size: 300mm
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Wafer Bonding Machines Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Wafer Bonding Machines Market Size and Volume Forecast by Application
6.3.1. MEMS
6.3.2. Power Device
6.3.3. LED
6.3.4. RF Components
6.3.5. CMOS Sensor
6.3.6. Solar Panel
6.3.7. Advanced Packaging
6.3.8. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Wafer Bonding Machines Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Wafer Bonding Machines Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Wafer Bonding Machines Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Wafer Bonding Machines Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Wafer Bonding Machines Demand Share Forecast, 2019-2026
9. North America Wafer Bonding Machines Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Wafer Bonding Machines Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Wafer Bonding Machines Market Size and Volume Forecast by Application
9.4.1. MEMS
9.4.2. Power Device
9.4.3. LED
9.4.4. RF Components
9.4.5. CMOS Sensor
9.4.6. Solar Panel
9.4.7. Advanced Packaging
9.4.8. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Wafer Bonding Machines Market Size and Volume Forecast by Type
9.7.1. Wafer Size: 200mm
9.7.2. Wafer Size: 300mm
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Wafer Bonding Machines Demand Share Forecast, 2019-2026
10. Latin America Wafer Bonding Machines Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Wafer Bonding Machines Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Wafer Bonding Machines Market Size and Volume Forecast by Application
10.4.1. MEMS
10.4.2. Power Device
10.4.3. LED
10.4.4. RF Components
10.4.5. CMOS Sensor
10.4.6. Solar Panel
10.4.7. Advanced Packaging
10.4.8. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Wafer Bonding Machines Market Size and Volume Forecast by Type
10.7.1. Wafer Size: 200mm
10.7.2. Wafer Size: 300mm
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Wafer Bonding Machines Demand Share Forecast, 2019-2026
11. Europe Wafer Bonding Machines Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Wafer Bonding Machines Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Wafer Bonding Machines Market Size and Volume Forecast by Application
11.4.1. MEMS
11.4.2. Power Device
11.4.3. LED
11.4.4. RF Components
11.4.5. CMOS Sensor
11.4.6. Solar Panel
11.4.7. Advanced Packaging
11.4.8. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Wafer Bonding Machines Market Size and Volume Forecast by Type
11.7.1. Wafer Size: 200mm
11.7.2. Wfer Size: 300mm
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Wafer Bonding Machines Demand Share, 2019-2026
12. Asia Pacific Wafer Bonding Machines Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Wafer Bonding Machines Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Wafer Bonding Machines Market Size and Volume Forecast by Application
12.4.1. MEMS
12.4.2. Power Device
12.4.3. LED
12.4.4. RF Components
12.4.5. CMOS Sensor
12.4.6. Solar Panel
12.4.7. Advanced Packaging
12.4.8. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Wafer Bonding Machines Market Size and Volume Forecast by Type
12.7.1. Wafer Size: 200mm
12.7.2. Wafer Size: 300mm
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Wafer Bonding Machines Demand Share, 2019-2026
13. Middle East & Africa Wafer Bonding Machines Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Wafer Bonding Machines Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Wafer Bonding Machines Market Size and Volume Forecast by Application
13.4.1. MEMS
13.4.2. Power Device
13.4.3. LED
13.4.4. RF Components
13.4.5. CMOS Sensor
13.4.6. Solar Panel
13.4.7. Advanced Packaging
13.4.8. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Wafer Bonding Machines Market Size and Volume Forecast by Type
13.7.1. Wafer Size: 200mm
13.7.2. Wafer Size: 300mm
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Wafer Bonding Machines Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Wafer Bonding Machines Market: Market Share Analysis
14.2. Wafer Bonding Machines Distributors and Customers
14.3. Wafer Bonding Machines Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. EV Group
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. SUSS MicroTec
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Dynatex International
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. AML
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Mitsubishi Heavy Industries
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Ayumi Industries Company Limited
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Tokyo Electron Limited
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. SMEE
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. U-Precision
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
