The global wafer bonding system market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The growth of this market can be attributed to the increasing demand for semiconductor and optoelectronic devices in various industries such as automotive, aerospace and defense, consumer electronics, healthcare and medical devices, industrial automation and robotics. The semiconductor industry is one of the major end-users of wafer bonding systems. In addition, the increasing demand for solar energy products has also led to an increase in demand for wafer bonding systems in this region.
The direct bonding segment accounted for a share of over 50% in 2017 owing to its high adoption rate among manufacturers due to its low cost per unit area compared with other types such as solder or adhesive bonding methods. Direct bonding is also preferred by manufacturers because it does not require any additional equipment or consumables apart from those used during manufacturing process such as photoresist film or solder paste which are already available on site at manufacturing facilities.
Some Of The Growth Factors Of This Market:
- The increasing demand for semiconductor devices in the global market is one of the major factors driving the growth of this market.
- The increasing demand for high-performance and low-power devices in the global market is also driving this market's growth, as these devices require wafer bonding systems for manufacturing purposes.
- Increasing investments by key players in R&D activities are also contributing to this market's growth, as they are developing new technologies and products that can be used by manufacturers in their production processes, which will help them improve their product quality and reduce production costs over time.
- Increasing adoption of wafer bonding systems across various industries such as automotive, aerospace & defense, medical equipment & supplies, consumer electronics & appliances among others is also driving this market's growth.
Industry Growth Insights published a new data on “Wafer Bonding System Market”. The research report is titled “Wafer Bonding System Market research by Types (Direct Bonding, Anodic Bonding, Solder Bonding, Glass-Frit Bonding, Adhesive Bonding, Others), By Applications (Semiconductor, Solar Energy, Opto-electronic, MEMS, Others), By Players/Companies Tokyo Electron(JP), EV Group(AT), SuSS MICROTEC SE(DE), NxQ(US), AYUMI INDUSTRY(JP), Palomar Technologies(US), Dynatex International(US), Applied Microengineering(UK), 3M(US)”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Bonding System Market Research Report
By Type
Direct Bonding, Anodic Bonding, Solder Bonding, Glass-Frit Bonding, Adhesive Bonding, Others
By Application
Semiconductor, Solar Energy, Opto-electronic, MEMS, Others
By Companies
Tokyo Electron(JP), EV Group(AT), SuSS MICROTEC SE(DE), NxQ(US), AYUMI INDUSTRY(JP), Palomar Technologies(US), Dynatex International(US), Applied Microengineering(UK), 3M(US)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
243
Number of Tables & Figures
171
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Bonding System Market Report Segments:
The global Wafer Bonding System market is segmented on the basis of:
Types
Direct Bonding, Anodic Bonding, Solder Bonding, Glass-Frit Bonding, Adhesive Bonding, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor, Solar Energy, Opto-electronic, MEMS, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Tokyo Electron(JP)
- EV Group(AT)
- SuSS MICROTEC SE(DE)
- NxQ(US)
- AYUMI INDUSTRY(JP)
- Palomar Technologies(US)
- Dynatex International(US)
- Applied Microengineering(UK)
- 3M(US)
Highlights of The Wafer Bonding System Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Direct Bonding
- Anodic Bonding
- Solder Bonding
- Glass-Frit Bonding
- Adhesive Bonding
- Others
- By Application:
- Semiconductor
- Solar Energy
- Opto-electronic
- MEMS
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Bonding System Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Wafer Bonding System is a manufacturing process that uses heat and pressure to bond two or more semiconductor wafers together. The system creates a strong, durable connection between the wafers, which can be used in various electronic devices.
Some of the major players in the wafer bonding system market are Tokyo Electron(JP), EV Group(AT), SuSS MICROTEC SE(DE), NxQ(US), AYUMI INDUSTRY(JP), Palomar Technologies(US), Dynatex International(US), Applied Microengineering(UK), 3M(US).
The wafer bonding system market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Wafer Bonding System Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Wafer Bonding System Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Wafer Bonding System Market - Supply Chain
4.5. Global Wafer Bonding System Market Forecast
4.5.1. Wafer Bonding System Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Wafer Bonding System Market Size (000 Units) and Y-o-Y Growth
4.5.3. Wafer Bonding System Market Absolute $ Opportunity
5. Global Wafer Bonding System Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Wafer Bonding System Market Size and Volume Forecast by Type
5.3.1. Direct Bonding
5.3.2. Anodic Bonding
5.3.3. Solder Bonding
5.3.4. Glass-Frit Bonding
5.3.5. Adhesive Bonding
5.3.6. Others
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Wafer Bonding System Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Wafer Bonding System Market Size and Volume Forecast by Application
6.3.1. Semiconductor
6.3.2. Solar Energy
6.3.3. Opto-electronic
6.3.4. MEMS
6.3.5. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Wafer Bonding System Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Wafer Bonding System Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Wafer Bonding System Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Wafer Bonding System Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Wafer Bonding System Demand Share Forecast, 2019-2026
9. North America Wafer Bonding System Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Wafer Bonding System Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Wafer Bonding System Market Size and Volume Forecast by Application
9.4.1. Semiconductor
9.4.2. Solar Energy
9.4.3. Opto-electronic
9.4.4. MEMS
9.4.5. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Wafer Bonding System Market Size and Volume Forecast by Type
9.7.1. Direct Bonding
9.7.2. Anodic Bonding
9.7.3. Solder Bonding
9.7.4. Glass-Frit Bonding
9.7.5. Adhesive Bonding
9.7.6. Others
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Wafer Bonding System Demand Share Forecast, 2019-2026
10. Latin America Wafer Bonding System Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Wafer Bonding System Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Wafer Bonding System Market Size and Volume Forecast by Application
10.4.1. Semiconductor
10.4.2. Solar Energy
10.4.3. Opto-electronic
10.4.4. MEMS
10.4.5. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Wafer Bonding System Market Size and Volume Forecast by Type
10.7.1. Direct Bonding
10.7.2. Anodic Bonding
10.7.3. Solder Bonding
10.7.4. Glass-Frit Bonding
10.7.5. Adhesive Bonding
10.7.6. Others
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Wafer Bonding System Demand Share Forecast, 2019-2026
11. Europe Wafer Bonding System Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Wafer Bonding System Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Wafer Bonding System Market Size and Volume Forecast by Application
11.4.1. Semiconductor
11.4.2. Solar Energy
11.4.3. Opto-electronic
11.4.4. MEMS
11.4.5. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Wafer Bonding System Market Size and Volume Forecast by Type
11.7.1. Direct Bonding
11.7.2. Anodic Bonding
11.7.3. Solder Bonding
11.7.4. Glass-Frit Bonding
11.7.5. Adhesive Bonding
11.7.6. Others
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Wafer Bonding System Demand Share, 2019-2026
12. Asia Pacific Wafer Bonding System Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Wafer Bonding System Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Wafer Bonding System Market Size and Volume Forecast by Application
12.4.1. Semiconductor
12.4.2. Solar Energy
12.4.3. Opto-electronic
12.4.4. MEMS
12.4.5. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Wafer Bonding System Market Size and Volume Forecast by Type
12.7.1. Direct Bonding
12.7.2. Anodic Bonding
12.7.3. Solder Bonding
12.7.4. Glass-Frit Bonding
12.7.5. Adhesive Bonding
12.7.6. Others
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Wafer Bonding System Demand Share, 2019-2026
13. Middle East & Africa Wafer Bonding System Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Wafer Bonding System Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Wafer Bonding System Market Size and Volume Forecast by Application
13.4.1. Semiconductor
13.4.2. Solar Energy
13.4.3. Opto-electronic
13.4.4. MEMS
13.4.5. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Wafer Bonding System Market Size and Volume Forecast by Type
13.7.1. Direct Bonding
13.7.2. Anodic Bonding
13.7.3. Solder Bonding
13.7.4. Glass-Frit Bonding
13.7.5. Adhesive Bonding
13.7.6. Others
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Wafer Bonding System Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Wafer Bonding System Market: Market Share Analysis
14.2. Wafer Bonding System Distributors and Customers
14.3. Wafer Bonding System Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Tokyo Electron(JP)
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. EV Group(AT)
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. SuSS MICROTEC SE(DE)
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. NxQ(US)
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. AYUMI INDUSTRY(JP)
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Palomar Technologies(US)
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Dynatex International(US)
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Applied Microengineering(UK)
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. 3M(US)
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
