The global wafer grinding tapes market is expected to grow at a CAGR of 4.5% during the forecast period, to reach USD 1.2 billion by 2030. The growth of this market can be attributed to the increasing demand for wafer grinding tapes in various applications such as standard, standard thin die, (S)DBG(GAL), and bump.
UV type segment is expected to dominate the global wafer grinding tapes market during the forecast period due to its high performance and low cost compared with other types of wafer grinding tapes. UV type segment accounted for more than 50% share in 2017 and is expected to maintain its dominance throughout the forecast period owing to its high performance and low cost compared with other types of wafer grinding tapes.
Some Of The Growth Factors Of This Market:
- The demand for wafer grinding tapes is expected to increase in the near future due to the increasing demand for semiconductors and other electronic devices.
- The growth of the global economy has led to an increased demand for electronics, which in turn has led to an increased demand for wafer grinding tapes.
- Wafer grinding tapes are used in a variety of industries, including semiconductor manufacturing, solar energy, and aerospace engineering.
- Wafer grinding tape manufacturers are investing heavily in research and development activities that will lead to new products with improved performance characteristics such as higher durability or lower cost per unit area of coverage.
- The use of wafer grinding tape is expected to grow as more companies adopt advanced manufacturing processes.
Industry Growth Insights published a new data on “Wafer Grinding Tapes Market”. The research report is titled “Wafer Grinding Tapes Market research by Types (UV Type, Non-UV Type), By Applications (Standard, Standard Thin Die, (S)DBG(GAL), Bump), By Players/Companies Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Grinding Tapes Market Research Report
By Type
UV Type, Non-UV Type
By Application
Standard, Standard Thin Die, (S)DBG(GAL), Bump
By Companies
Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
241
Number of Tables & Figures
169
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Grinding Tapes Market Report Segments:
The global Wafer Grinding Tapes market is segmented on the basis of:
Types
UV Type, Non-UV Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Standard, Standard Thin Die, (S)DBG(GAL), Bump
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Mitsui Chemicals Tohcello
- Nitto
- LINTEC
- Furukawa Electric
- Denka
- D&X
- AI Technology
Highlights of The Wafer Grinding Tapes Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- UV Type
- Non-UV Type
- By Application:
- Standard
- Standard Thin Die
- (S)DBG(GAL)
- Bump
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Grinding Tapes Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer grinding tapes are a type of abrasive tape used in the semiconductor and electronic manufacturing industries. They are typically made from a paper or plastic substrate that is coated with an abrasive material. The tapes are then cut into desired shapes and used to grind wafers, chips, or other small pieces of metal.
Some of the key players operating in the wafer grinding tapes market are Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology.
The wafer grinding tapes market is expected to register a CAGR of 4.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Wafer Grinding Tapes Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Wafer Grinding Tapes Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Wafer Grinding Tapes Market - Supply Chain
4.5. Global Wafer Grinding Tapes Market Forecast
4.5.1. Wafer Grinding Tapes Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Wafer Grinding Tapes Market Size (000 Units) and Y-o-Y Growth
4.5.3. Wafer Grinding Tapes Market Absolute $ Opportunity
5. Global Wafer Grinding Tapes Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Wafer Grinding Tapes Market Size and Volume Forecast by Type
5.3.1. UV Type
5.3.2. Non-UV Type
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Wafer Grinding Tapes Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Wafer Grinding Tapes Market Size and Volume Forecast by Application
6.3.1. Standard
6.3.2. Standard Thin Die
6.3.3. (S)DBG(GAL)
6.3.4. Bump
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Wafer Grinding Tapes Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Wafer Grinding Tapes Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Wafer Grinding Tapes Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Wafer Grinding Tapes Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Wafer Grinding Tapes Demand Share Forecast, 2019-2026
9. North America Wafer Grinding Tapes Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Wafer Grinding Tapes Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Wafer Grinding Tapes Market Size and Volume Forecast by Application
9.4.1. Standard
9.4.2. Standard Thin Die
9.4.3. (S)DBG(GAL)
9.4.4. Bump
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Wafer Grinding Tapes Market Size and Volume Forecast by Type
9.7.1. UV Type
9.7.2. Non-UV Type
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Wafer Grinding Tapes Demand Share Forecast, 2019-2026
10. Latin America Wafer Grinding Tapes Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Wafer Grinding Tapes Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Wafer Grinding Tapes Market Size and Volume Forecast by Application
10.4.1. Standard
10.4.2. Standard Thin Die
10.4.3. (S)DBG(GAL)
10.4.4. Bump
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Wafer Grinding Tapes Market Size and Volume Forecast by Type
10.7.1. UV Type
10.7.2. Non-UV Type
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Wafer Grinding Tapes Demand Share Forecast, 2019-2026
11. Europe Wafer Grinding Tapes Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Wafer Grinding Tapes Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Wafer Grinding Tapes Market Size and Volume Forecast by Application
11.4.1. Standard
11.4.2. Standard Thin Die
11.4.3. (S)DBG(GAL)
11.4.4. Bump
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Wafer Grinding Tapes Market Size and Volume Forecast by Type
11.7.1. UV Type
11.7.2. Non-UV Type
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Wafer Grinding Tapes Demand Share, 2019-2026
12. Asia Pacific Wafer Grinding Tapes Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Wafer Grinding Tapes Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Wafer Grinding Tapes Market Size and Volume Forecast by Application
12.4.1. Standard
12.4.2. Standard Thin Die
12.4.3. (S)DBG(GAL)
12.4.4. Bump
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Wafer Grinding Tapes Market Size and Volume Forecast by Type
12.7.1. UV Type
12.7.2. Non-UV Type
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Wafer Grinding Tapes Demand Share, 2019-2026
13. Middle East & Africa Wafer Grinding Tapes Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Wafer Grinding Tapes Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Wafer Grinding Tapes Market Size and Volume Forecast by Application
13.4.1. Standard
13.4.2. Standard Thin Die
13.4.3. (S)DBG(GAL)
13.4.4. Bump
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Wafer Grinding Tapes Market Size and Volume Forecast by Type
13.7.1. UV Type
13.7.2. Non-UV Type
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Wafer Grinding Tapes Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Wafer Grinding Tapes Market: Market Share Analysis
14.2. Wafer Grinding Tapes Distributors and Customers
14.3. Wafer Grinding Tapes Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Mitsui Chemicals Tohcello
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Nitto
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. LINTEC
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Furukawa Electric
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Denka
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. D&X
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. AI Technology
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. COMPANY8
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. COMPANY9
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
