The global wafer level package market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The market is driven by the increasing demand for 3D TSV and 3D wire bonding packages in consumer electronics, industrial, automotive & transport and IT & telecommunication applications. The growth of this market is also attributed to the increasing demand for wafer level packaging in semiconductor industry due to its advantages such as low cost, high reliability and small size.
The global wafer level package market has been segmented on the basis of type into 3D wire bonding, 3D TSV and WLP; on the basis of application into consumer electronics, industrial, automotive & transport and IT & telecommunication; and on the basis of region into North America (NA), Latin America (LA), Europe (EU), Asia Pacific (APAC) and Middle East & Africa (MEA).
Some Of The Growth Factors Of This Market:
- The growth of the Wafer Level Package market is driven by the increasing demand for high-performance and low power consumption devices.
- Increasing demand for smartphones and tablets with high performance and low power consumption features will drive the growth of the Wafer Level Package market.
- Increasing adoption of wafer level packaging in semiconductor industry will drive the growth of this market.
- Growing need for miniaturization in electronics industry will fuel the growth of this market.
Industry Growth Insights published a new data on “Wafer Level Package Market”. The research report is titled “Wafer Level Package Market research by Types (3D Wire Bonding, 3D TSV, Others, Wafer Level Packag), By Applications (Consumer Electronics, Industrial, Automotive & Transport, IT & Telecommunication, Others), By Players/Companies lASE, Amkor, Intel, Samsung, AT&S, Toshiba, JCET, Qualcomm, IBM, SK Hynix, UTAC, TSMC, China Wafer Level CSP, Interconnect Systems, Wafer Level Packag”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Level Package Market Research Report
By Type
3D Wire Bonding, 3D TSV, Others, Wafer Level Packag
By Application
Consumer Electronics, Industrial, Automotive & Transport, IT & Telecommunication, Others
By Companies
lASE, Amkor, Intel, Samsung, AT&S, Toshiba, JCET, Qualcomm, IBM, SK Hynix, UTAC, TSMC, China Wafer Level CSP, Interconnect Systems, Wafer Level Packag
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
250
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Level Package Market Report Segments:
The global Wafer Level Package market is segmented on the basis of:
Types
3D Wire Bonding, 3D TSV, Others, Wafer Level Packag
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Industrial, Automotive & Transport, IT & Telecommunication, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- lASE
- Amkor
- Intel
- Samsung
- AT&S
- Toshiba
- JCET
- Qualcomm
- IBM
- SK Hynix
- UTAC
- TSMC
- China Wafer Level CSP
- Interconnect Systems
- Wafer Level Packag
Highlights of The Wafer Level Package Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 3D Wire Bonding
- 3D TSV
- Others
- Wafer Level Packag
- By Application:
- Consumer Electronics
- Industrial
- Automotive & Transport
- IT & Telecommunication
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Level Package Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer level package (WLP) is a packaging technology for semiconductor devices that uses very thin, uniform wafers of silicon. WLP allows the device to be mounted on a single substrate and provides better thermal dissipation than traditional chip packaging methods.
Some of the key players operating in the wafer level package market are lASE, Amkor, Intel, Samsung, AT&S, Toshiba, JCET, Qualcomm, IBM, SK Hynix, UTAC, TSMC, China Wafer Level CSP, Interconnect Systems, Wafer Level Packag.
The wafer level package market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Wafer Level Package Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Wafer Level Package Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Wafer Level Package Market - Supply Chain
4.5. Global Wafer Level Package Market Forecast
4.5.1. Wafer Level Package Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Wafer Level Package Market Size (000 Units) and Y-o-Y Growth
4.5.3. Wafer Level Package Market Absolute $ Opportunity
5. Global Wafer Level Package Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Wafer Level Package Market Size and Volume Forecast by Type
5.3.1. 3D Wire Bonding
5.3.2. 3D TSV
5.3.3. Others
5.3.4. Wafer Level Packag
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Wafer Level Package Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Wafer Level Package Market Size and Volume Forecast by Application
6.3.1. Consumer Electronics
6.3.2. Industrial
6.3.3. Automotive & Transport
6.3.4. IT & Telecommunication
6.3.5. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Wafer Level Package Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Wafer Level Package Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Wafer Level Package Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Wafer Level Package Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Wafer Level Package Demand Share Forecast, 2019-2026
9. North America Wafer Level Package Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Wafer Level Package Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Wafer Level Package Market Size and Volume Forecast by Application
9.4.1. Consumer Electronics
9.4.2. Industrial
9.4.3. Automotive & Transport
9.4.4. IT & Telecommunication
9.4.5. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Wafer Level Package Market Size and Volume Forecast by Type
9.7.1. 3D Wire Bonding
9.7.2. 3D TSV
9.7.3. Others
9.7.4. Wafer Level Packag
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Wafer Level Package Demand Share Forecast, 2019-2026
10. Latin America Wafer Level Package Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Wafer Level Package Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Wafer Level Package Market Size and Volume Forecast by Application
10.4.1. Consumer Electronics
10.4.2. Industrial
10.4.3. Automotive & Transport
10.4.4. IT & Telecommunication
10.4.5. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Wafer Level Package Market Size and Volume Forecast by Type
10.7.1. 3D Wire Bonding
10.7.2. 3D TSV
10.7.3. Others
10.7.4. Wafer Level Packag
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Wafer Level Package Demand Share Forecast, 2019-2026
11. Europe Wafer Level Package Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Wafer Level Package Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Wafer Level Package Market Size and Volume Forecast by Application
11.4.1. Consumer Electronics
11.4.2. Industrial
11.4.3. Automotive & Transport
11.4.4. IT & Telecommunication
11.4.5. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Wafer Level Package Market Size and Volume Forecast by Type
11.7.1. 3D Wire Bonding
11.7.2. 3D TSV
11.7.3. Others
11.7.4. Wafer Level Packag
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Wafer Level Package Demand Share, 2019-2026
12. Asia Pacific Wafer Level Package Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Wafer Level Package Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Wafer Level Package Market Size and Volume Forecast by Application
12.4.1. Consumer Electronics
12.4.2. Industrial
12.4.3. Automotive & Transport
12.4.4. IT & Telecommunication
12.4.5. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Wafer Level Package Market Size and Volume Forecast by Type
12.7.1. 3D Wire Bonding
12.7.2. 3D TSV
12.7.3. Others
12.7.4. Wafer Level Packag
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Wafer Level Package Demand Share, 2019-2026
13. Middle East & Africa Wafer Level Package Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Wafer Level Package Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Wafer Level Package Market Size and Volume Forecast by Application
13.4.1. Consumer Electronics
13.4.2. Industrial
13.4.3. Automotive & Transport
13.4.4. IT & Telecommunication
13.4.5. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Wafer Level Package Market Size and Volume Forecast by Type
13.7.1. 3D Wire Bonding
13.7.2. 3D TSV
13.7.3. Others
13.7.4. Wafer Level Packag
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Wafer Level Package Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Wafer Level Package Market: Market Share Analysis
14.2. Wafer Level Package Distributors and Customers
14.3. Wafer Level Package Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. lASE
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. Amkor
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Intel
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Samsung
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. AT&S
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Toshiba
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. JCET
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Qualcomm
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. IBM
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. SK Hynix
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. UTAC
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. TSMC
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. China Wafer Level CSP
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Interconnect Systems
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Wafer Level Packag
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
