Market Overview:
The global wafer level packaging inspection systems market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced semiconductor devices and rising adoption of wafer-level packaging technology across various applications. In terms of type, the global market is segmented into fully automatic and semi-automatic systems. The fully automatic segment is expected to account for a larger share of the global market in 2018, owing to its high efficiency and accuracy levels as compared to semi-automatic systems. In terms of application, communication devices accounted for the largest share of the global wafer level packaging inspection systems market in 2017; this trend is expected to continue during the forecast period. Wafer-level packaging technology offers several advantages over traditional package types such as reduced size, weight and manufacturing time; these benefits are driving its adoption in communication devices such as smartphones and tablets.
Product Definition:
Wafer Level Packaging Inspection Systems are used to inspect the quality of products being packaged at the wafer level. This is important because it ensures that all products being packaged meet quality standards and that no defective products make it to market.
Fully Automatic:
Fully automatic wafer level packaging inspection systems are used for the detection of surface defects on semiconductor wafers during the manufacturing process. The fully automatic system is a significant improvement over semi-automatic systems as it offers more flexibility, accuracy and efficiency in detecting surface defects.
The global fully automatic, it's usage and growth factor in WLPIS market size was valued at USD 1,849.7 million in 2016.
Semi Automatic:
Semi-automatic wafer level packaging inspection systems are used for the inspection of wafers at various stages during the manufacturing process. These systems can be used to detect defects in semiconductor devices such as silicon chips and solar cells. The system includes a camera, light source, color filter, and a CCD or CMOS image sensor which is an analog to digital converter that converts the image formed by the camera into digital format for analysis.
Application Insights:
The communication devices application segment accounted for the largest revenue share in 2017 and is projected to witness significant growth over the forecast period. The growth can be attributed to increasing demand for high-speed data transfer products across the globe. The level of integration plays a key role in determining product acceptance. Fully automatic systems are preferred as they offer flexibility and accuracy while inspecting level packages, along with ease of operation and maintenance.
Automotive products are expected to be one of the fastest growing segments during the forecast period owing to rising demand for energy-efficient vehicles across various regions on account of stringent government regulations regarding pollution control. Level packaging helps enhance aesthetic appeal as well as protects electronic components from damage due to vibration or impact forces caused by accidents or road debris, thereby enhancing product durability over a longer period of time.
Regional Analysis:
Asia Pacific region accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand from end-use industries such as communication, automotive, computing, consumer electronics and industrial. China is projected to emerge as a major contributor in terms of revenue owing to rapid urbanization coupled with government support for manufacturing activities within the country.
The Asia Pacific wafer level packaging inspection systems market is also likely witness high growth due to rising labor costs in developed countries such as North America and Europe which are anticipated result into higher demand from developing regions over the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand for high-reliability and low-cost electronics assemblies
- Proliferation of 3D integrated circuits (ICs) and wafer level packaging (WLP) technologies
- Growing need for advanced process control and yield management solutions in semiconductor manufacturing industry
- Emergence of new applications areas such as automotive, medical, and industrial
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Level Packaging Inspection Systems Market Research Report
By Type
Fully Automatic, Semi Automatic
By Application
Communication Devices, Consumer Electronic Equipment, Automotive Products, Industrial, Other
By Companies
Rudolph Technologies, KLA-Tencor, Topcon Technohouse, Camtek Ltd., Intel Corp., Hitachi Ltd., Samsung Semiconductor, Semiconductor Manufacturing International, Taiwan Semiconductor Manufacturing, GlobalFoundries Inc., Toray Engineering, Nidec Tosok, United Microelectronics Corp, Dainippon Screen Manufacturing
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
250
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Level Packaging Inspection Systems Market Report Segments:
The global Wafer Level Packaging Inspection Systems market is segmented on the basis of:
Types
Fully Automatic, Semi Automatic
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Communication Devices, Consumer Electronic Equipment, Automotive Products, Industrial, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Rudolph Technologies
- KLA-Tencor
- Topcon Technohouse
- Camtek Ltd.
- Intel Corp.
- Hitachi Ltd.
- Samsung Semiconductor
- Semiconductor Manufacturing International
- Taiwan Semiconductor Manufacturing
- GlobalFoundries Inc.
- Toray Engineering
- Nidec Tosok
- United Microelectronics Corp
- Dainippon Screen Manufacturing
Highlights of The Wafer Level Packaging Inspection Systems Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Fully Automatic
- Semi Automatic
- By Application:
- Communication Devices
- Consumer Electronic Equipment
- Automotive Products
- Industrial
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Level Packaging Inspection Systems Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer level packaging inspection systems are used to inspect semiconductor wafers for defects and quality. These systems use a variety of optical and scanning technologies to detect defects on the surface of the wafers.
Some of the key players operating in the wafer level packaging inspection systems market are Rudolph Technologies, KLA-Tencor, Topcon Technohouse, Camtek Ltd., Intel Corp., Hitachi Ltd., Samsung Semiconductor, Semiconductor Manufacturing International, Taiwan Semiconductor Manufacturing, GlobalFoundries Inc., Toray Engineering, Nidec Tosok, United Microelectronics Corp, Dainippon Screen Manufacturing.
The wafer level packaging inspection systems market is expected to register a CAGR of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Wafer Level Packaging Inspection Systems Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Wafer Level Packaging Inspection Systems Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Wafer Level Packaging Inspection Systems Market - Supply Chain
4.5. Global Wafer Level Packaging Inspection Systems Market Forecast
4.5.1. Wafer Level Packaging Inspection Systems Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Wafer Level Packaging Inspection Systems Market Size (000 Units) and Y-o-Y Growth
4.5.3. Wafer Level Packaging Inspection Systems Market Absolute $ Opportunity
5. Global Wafer Level Packaging Inspection Systems Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Type
5.3.1. Fully Automatic
5.3.2. Semi Automatic
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Wafer Level Packaging Inspection Systems Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Application
6.3.1. Communication Devices
6.3.2. Consumer Electronic Equipment
6.3.3. Automotive Products
6.3.4. Industrial
6.3.5. Other
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Wafer Level Packaging Inspection Systems Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Wafer Level Packaging Inspection Systems Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Wafer Level Packaging Inspection Systems Demand Share Forecast, 2019-2026
9. North America Wafer Level Packaging Inspection Systems Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Application
9.4.1. Communication Devices
9.4.2. Consumer Electronic Equipment
9.4.3. Automotive Products
9.4.4. Industrial
9.4.5. Other
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Type
9.7.1. Fully Automatic
9.7.2. Semi Automatic
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Wafer Level Packaging Inspection Systems Demand Share Forecast, 2019-2026
10. Latin America Wafer Level Packaging Inspection Systems Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Application
10.4.1. Communication Devices
10.4.2. Consumer Electronic Equipment
10.4.3. Automotive Products
10.4.4. Industrial
10.4.5. Other
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Type
10.7.1. Fully Automatic
10.7.2. Semi Automatic
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Wafer Level Packaging Inspection Systems Demand Share Forecast, 2019-2026
11. Europe Wafer Level Packaging Inspection Systems Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Application
11.4.1. Communication Devices
11.4.2. Consumer Electronic Equipment
11.4.3. Automotive Products
11.4.4. Industrial
11.4.5. Other
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Type
11.7.1. Fully Automatic
11.7.2. Semi Automatic
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Wafer Level Packaging Inspection Systems Demand Share, 2019-2026
12. Asia Pacific Wafer Level Packaging Inspection Systems Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Application
12.4.1. Communication Devices
12.4.2. Consumer Electronic Equipment
12.4.3. Automotive Products
12.4.4. Industrial
12.4.5. Other
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Type
12.7.1. Fully Automatic
12.7.2. Semi Automatic
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Wafer Level Packaging Inspection Systems Demand Share, 2019-2026
13. Middle East & Africa Wafer Level Packaging Inspection Systems Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Application
13.4.1. Communication Devices
13.4.2. Consumer Electronic Equipment
13.4.3. Automotive Products
13.4.4. Industrial
13.4.5. Other
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Wafer Level Packaging Inspection Systems Market Size and Volume Forecast by Type
13.7.1. Fully Automatic
13.7.2. Semi Automatic
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Wafer Level Packaging Inspection Systems Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Wafer Level Packaging Inspection Systems Market: Market Share Analysis
14.2. Wafer Level Packaging Inspection Systems Distributors and Customers
14.3. Wafer Level Packaging Inspection Systems Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Rudolph Technologies
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. KLA-Tencor
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Topcon Technohouse
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Camtek Ltd.
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Intel Corp.
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Hitachi Ltd.
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Samsung Semiconductor
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Semiconductor Manufacturing International
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Taiwan Semiconductor Manufacturing
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. GlobalFoundries Inc.
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Toray Engineering
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Nidec Tosok
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. United Microelectronics Corp
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Dainippon Screen Manufacturing
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
