The global wire bonders market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The growth of this market can be attributed to the increasing demand for wire bonders in the semiconductor industry and rising adoption of wire bonding technology in various industries such as automotive, aerospace, and medical devices.
The global wire bonders market is segmented on the basis of type into manual wire bonders, semiautomatic wire bonders, and full-automatic wire bonders. The manual type segment accounted for a major share in 2018 owing to its low cost and ease of use. However, with advancements in technology and automation features being incorporated into these machines over time, it is expected that semiautomatic type will witness significant growth during the forecast period due to its high productivity rates coupled with low cost per unit production.
On the basis of application, this market is divided into integrated device manufacturers (IDMs) and outsourced semiconductor assembly & test (OSAT). IDMs are witnessing higher demand owing to their ability to produce large volumes at lower costs than OSATs which are more focused on producing small batches at higher costs per unit production.
- The increasing demand for wire bonders in the semiconductor industry is a major factor driving the growth of this market.
- The increasing number of electronic devices and their complexity are also driving the growth of this market.
- The need to reduce manufacturing costs is another factor that is driving the growth of this market.
- Increasing demand for wire bonders from emerging markets such as China, India, and Brazil are also contributing to the growth of this market.
- Increasing investments in research and development activities by key players in this industry are also fueling the growth of this market.
Industry Growth Insights published a new data on “Wire Bonders Market”. The research report is titled “Wire Bonders Market research by Types (Manual Wire Bonders, Semi-Automatic Wire Bonders, Fully-Automatic Wire Bonders), By Applications (Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)), By Players/Companies Kulicke & Soffa (K&S), ASM Pacific Technology, TPT, Hesse Mechatronics, West•Bond, Hybond, Shibuya, Questar Products, Anza Technology, F&K Delvotec Bondtechnik, Shinkawa, Palomar Technologies, Micro Point Pro Ltd (MPP), Planar Corporation, Mech-El Industries Inc., Ultrasonic Engineering, DIAS Automation”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Wire Bonders Market Research Report
By Type
Manual Wire Bonders, Semi-Automatic Wire Bonders, Fully-Automatic Wire Bonders
By Application
Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)
By Companies
Kulicke & Soffa (K&S), ASM Pacific Technology, TPT, Hesse Mechatronics, West•Bond, Hybond, Shibuya, Questar Products, Anza Technology, F&K Delvotec Bondtechnik, Shinkawa, Palomar Technologies, Micro Point Pro Ltd (MPP), Planar Corporation, Mech-El Industries Inc., Ultrasonic Engineering, DIAS Automation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
238
Number of Tables & Figures
167
Customization Available
Yes, the report can be customized as per your need.
Global Wire Bonders Market Report Segments:
The global Wire Bonders market is segmented on the basis of:
Types
Manual Wire Bonders, Semi-Automatic Wire Bonders, Fully-Automatic Wire Bonders
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Kulicke & Soffa (K&S)
- ASM Pacific Technology
- TPT
- Hesse Mechatronics
- West•Bond
- Hybond
- Shibuya
- Questar Products
- Anza Technology
- F&K Delvotec Bondtechnik
- Shinkawa
- Palomar Technologies
- Micro Point Pro Ltd (MPP)
- Planar Corporation
- Mech-El Industries Inc.
- Ultrasonic Engineering
- DIAS Automation
Highlights of The Wire Bonders Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Manual Wire Bonders
- Semi-Automatic Wire Bonders
- Fully-Automatic Wire Bonders
- By Application:
- Integrated Device Manufacturers (IDMs)
- Outsourced Semiconductor Assembly and Test (OSAT)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wire Bonders Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wire bonders are a type of electrical connector that is used to join wires together. They are made up of two or more thin metal wires that are twisted around each other to create a strong connection.
Some of the key players operating in the wire bonders market are Kulicke & Soffa (K&S), ASM Pacific Technology, TPT, Hesse Mechatronics, West¢â‚¬Â¢Bond, Hybond, Shibuya, Questar Products, Anza Technology, F&K Delvotec Bondtechnik, Shinkawa, Palomar Technologies, Micro Point Pro Ltd (MPP), Planar Corporation, Mech-El Industries Inc., Ultrasonic Engineering, DIAS Automation.
The wire bonders market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Wire Bonders Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Wire Bonders Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Wire Bonders Market - Supply Chain
4.5. Global Wire Bonders Market Forecast
4.5.1. Wire Bonders Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Wire Bonders Market Size (000 Units) and Y-o-Y Growth
4.5.3. Wire Bonders Market Absolute $ Opportunity
5. Global Wire Bonders Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Wire Bonders Market Size and Volume Forecast by Type
5.3.1. Manual Wire Bonders
5.3.2. Semi-Automatic Wire Bonders
5.3.3. Fully-Automatic Wire Bonders
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Wire Bonders Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Wire Bonders Market Size and Volume Forecast by Application
6.3.1. Integrated Device Manufacturers (IDMs)
6.3.2. Outsourced Semiconductor Assembly and Test (OSAT)
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Wire Bonders Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Wire Bonders Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Wire Bonders Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Wire Bonders Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Wire Bonders Demand Share Forecast, 2019-2026
9. North America Wire Bonders Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Wire Bonders Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Wire Bonders Market Size and Volume Forecast by Application
9.4.1. Integrated Device Manufacturers (IDMs)
9.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Wire Bonders Market Size and Volume Forecast by Type
9.7.1. Manual Wire Bonders
9.7.2. Semi-Automatic Wire Bonders
9.7.3. Fully-Automatic Wire Bonders
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Wire Bonders Demand Share Forecast, 2019-2026
10. Latin America Wire Bonders Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Wire Bonders Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Wire Bonders Market Size and Volume Forecast by Application
10.4.1. Integrated Device Manufacturers (IDMs)
10.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Wire Bonders Market Size and Volume Forecast by Type
10.7.1. Manual Wire Bonders
10.7.2. Semi-Automatic Wire Bonders
10.7.3. Fully-Automatic Wire Bonders
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Wire Bonders Demand Share Forecast, 2019-2026
11. Europe Wire Bonders Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Wire Bonders Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Wire Bonders Market Size and Volume Forecast by Application
11.4.1. Integrated Device Manufacturers (IDMs)
11.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Wire Bonders Market Size and Volume Forecast by Type
11.7.1. Manual Wire Bonders
11.7.2. Semi-Automatic Wire Bonders
11.7.3. Fully-Automatic Wire Bonders
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Wire Bonders Demand Share, 2019-2026
12. Asia Pacific Wire Bonders Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Wire Bonders Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Wire Bonders Market Size and Volume Forecast by Application
12.4.1. Integrated Device Manufacturers (IDMs)
12.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Wire Bonders Market Size and Volume Forecast by Type
12.7.1. Manual Wire Bonders
12.7.2. Semi-Automatic Wire Bonders
12.7.3. Fully-Automatic Wire Bonders
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Wire Bonders Demand Share, 2019-2026
13. Middle East & Africa Wire Bonders Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Wire Bonders Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Wire Bonders Market Size and Volume Forecast by Application
13.4.1. Integrated Device Manufacturers (IDMs)
13.4.2. Outsourced Semiconductor Assembly and Test (OSAT)
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Wire Bonders Market Size and Volume Forecast by Type
13.7.1. Manual Wire Bonders
13.7.2. Semi-Automatic Wire Bonders
13.7.3. Fully-Automatic Wire Bonders
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Wire Bonders Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Wire Bonders Market: Market Share Analysis
14.2. Wire Bonders Distributors and Customers
14.3. Wire Bonders Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Kulicke & Soffa (K&S)
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. ASM Pacific Technology
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. TPT
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Hesse Mechatronics
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. WestBond
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Hybond
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Shibuya
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Questar Products
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. Anza Technology
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. F&K Delvotec Bondtechnik
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Shinkawa
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. Palomar Technologies
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. Micro Point Pro Ltd (MPP)
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. Planar Corporation
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. Mech-El Industries Inc.
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. Ultrasonic Engineering
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. DIAS Automation
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
