Market Overview:
The global adhesive for electronics market is expected to grow at a CAGR of 5.8% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for adhesives in surface mounting, conformal coatings, potting and encapsulation, and other applications. In terms of type, the non-electrically conductive segment is expected to dominate the market during the forecast period. However, the electrically conductive segment is projected to grow at a higher CAGR owing to its growing demand in automotive and aerospace applications. Geographically, Asia Pacific is estimated to be the fastest-growing region during the forecast period.
Product Definition:
An adhesive is a material that physically binds two surfaces together. The importance of adhesives in electronics is to create a secure connection between electronic components and the circuit board on which they are mounted. Adhesive can also be used to affix labels and other identification markings on circuit boards and other components.
Non-Electrically Conductive:
Non-electrically conductive materials are widely used in the electronics industry for various applications such as soldering, bonding, and insulation. The growing demand for non-electrically conductive materials in packaging of electronic devices is expected to drive market growth over the forecast period.
The major application segments include printed circuit boards (PCB), wire/cable insulation, and surface mount device (SMD) assembly.
Electrically Conductive:
Electrically conductive and it's usage in adhesive for electronics market is expected to witness significant growth over the forecast period. The major factor that propels the growth of this industry includes growing demand from packaging industry, which in turn will propel demand for electrically conductive adhesives.
Packaging plays a vital role as it protects the product that attracts a lot of attention, thus increasing its sales.
Application Insights:
The other application segment includes mechanical assembly, thermal management, and encapsulation. The demand for the product in conformal coatings was the highest at 478.6 kilotons in 2017 and is expected to grow at a CAGR of XX% from 2018 to 2030 due to its superior properties including high strength, excellent adhesion on a variety of substrates including plastic, glass fiber reinforced plastics (GFRP), metal foils and non-metallic materials such as polyethylene terephthalate (PET) and polycarbonate over others types of adhesives used in electronics applications such as hot Melt Adhesives (HMA).
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period. The growth can be attributed to increasing demand for electronic products in countries such as China and India. In addition, rising disposable income coupled with a growing population will drive adhesives market further.
The Asia Pacific region accounted for more than 30% of global revenue in 2017 and is anticipated to continue its dominance over the next eight years owing to high product utilization in various applications including surface mounting, conformal coatings, potting & encapsulation, etc.
Growth Factors:
- Increasing demand for smart and portable devices
- Rising trend of miniaturization in electronic devices
- Growing popularity of wearable electronics
- Proliferation of Internet of Things (IoT) and connected devices
- Emergence of new adhesive technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
Adhesive for Electronics Market Research Report
By Type
Non-Electrically Conductive, Electrically Conductive
By Application
Surface Mounting, Conformal Coatings, Potting and Encapsulation, Other
By Companies
Henkel, Permabond, H.B.Fuller, Bostik, M, Master Bond, Protavic, Heartland Adhesives, Panacol, LORD Corporation, Heraeus, Kohesi Bond, Tex Year Group, Hexion, Jowat, Mactac
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
217
Number of Tables & Figures
152
Customization Available
Yes, the report can be customized as per your need.
Global Adhesive for Electronics Market Report Segments:
The global Adhesive for Electronics market is segmented on the basis of:
Types
Non-Electrically Conductive, Electrically Conductive
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Surface Mounting, Conformal Coatings, Potting and Encapsulation, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Henkel
- Permabond
- H.B.Fuller
- Bostik
- M
- Master Bond
- Protavic
- Heartland Adhesives
- Panacol
- LORD Corporation
- Heraeus
- Kohesi Bond
- Tex Year Group
- Hexion
- Jowat
- Mactac
Highlights of The Adhesive for Electronics Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Non-Electrically Conductive
- Electrically Conductive
- By Application:
- Surface Mounting
- Conformal Coatings
- Potting and Encapsulation
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Adhesive for Electronics Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Adhesive for electronics is a type of adhesive that is used to attach electronic components or devices to other surfaces. It can be used in a variety of applications, such as attaching circuit boards to walls or using it as the glue between two pieces of plastic.
Some of the major companies in the adhesive for electronics market are Henkel, Permabond, H.B.Fuller, Bostik, M, Master Bond, Protavic, Heartland Adhesives, Panacol, LORD Corporation, Heraeus, Kohesi Bond, Tex Year Group, Hexion, Jowat, Mactac.
The adhesive for electronics market is expected to grow at a compound annual growth rate of 5.8%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Adhesive for Electronics Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Adhesive for Electronics Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Adhesive for Electronics Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Adhesive for Electronics Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Adhesive for Electronics Market Size & Forecast, 2020-2028
4.5.1 Adhesive for Electronics Market Size and Y-o-Y Growth
4.5.2 Adhesive for Electronics Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Non-Electrically Conductive
5.2.2 Electrically Conductive
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Surface Mounting
6.2.2 Conformal Coatings
6.2.3 Potting and Encapsulation
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Adhesive for Electronics Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Adhesive for Electronics Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Non-Electrically Conductive
9.6.2 Electrically Conductive
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Surface Mounting
9.10.2 Conformal Coatings
9.10.3 Potting and Encapsulation
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Non-Electrically Conductive
10.6.2 Electrically Conductive
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Surface Mounting
10.10.2 Conformal Coatings
10.10.3 Potting and Encapsulation
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Non-Electrically Conductive
11.6.2 Electrically Conductive
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Surface Mounting
11.10.2 Conformal Coatings
11.10.3 Potting and Encapsulation
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Non-Electrically Conductive
12.6.2 Electrically Conductive
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Surface Mounting
12.10.2 Conformal Coatings
12.10.3 Potting and Encapsulation
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Non-Electrically Conductive
13.6.2 Electrically Conductive
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Surface Mounting
13.10.2 Conformal Coatings
13.10.3 Potting and Encapsulation
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Adhesive for Electronics Market: Competitive Dashboard
14.2 Global Adhesive for Electronics Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Henkel
14.3.2 Permabond
14.3.3 H.B.Fuller
14.3.4 Bostik
14.3.5 M
14.3.6 Master Bond
14.3.7 Protavic
14.3.8 Heartland Adhesives
14.3.9 Panacol
14.3.10 LORD Corporation
14.3.11 Heraeus
14.3.12 Kohesi Bond
14.3.13 Tex Year Group
14.3.14 Hexion
14.3.15 Jowat
14.3.16 Mactac
