Market Overview:
The global aluminum silicon carbide (AlSiC) packaging material market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market was valued at US$ 1,362.8 Mn in 2017 and is projected to reach US$ 2,442.4 Mn by 2030. The growth of the global aluminum silicon carbide (AlSiC) packaging material market can be attributed to the increasing demand for power amplifiers, microwave electronics and thyristors in various applications such as consumer electronics, automotive and industrial sectors across the globe. Based on type, the global aluminum silicon carbide (AlSiC) packaging material market has been segmented into SiC (15-30), SiC (30-40), SiC(40-60), others).
 Packaging Material Industry Outlook.svg)
Product Definition:
Aluminum Silicon Carbide (AlSiC) packaging material is a ceramic material used for packaging integrated circuits. It has a very low coefficient of thermal expansion, which helps to prevent the chips from warping or cracking when exposed to changes in temperature.
SiC (15-30):
The global SiC (15-30) market size was valued at USD 6.5 million in 2016 and is expected to grow at a CAGR of XX% from 2017 to 2025 due to the increasing demand for aluminum silicon carbide (AlSiC) packaging material in the electronics industry.
SiC (30-40):
SiC is a type of ceramic material that has high thermal conductivity and low electrical conductivity. It is used in the manufacturing of ceramics for electronic products such as substrates, circuit carriers, capacitors, and others. SiC particles are small in size with a particle size distribution between 1-10 µm.
Application Insights:
The power amplifier application segment led the market and accounted for more than 35.0% share of the global revenue in 2017. The rising demand for high-performance products with low noise, low power consumption and high efficiency is expected to drive the product demand over the forecast period.
Power amplifiers are used in a wide range of applications including consumer electronics, telecommunication, data communication, automotive & transportation and medical equipment among others. They are also widely used in military & defense applications owing to their enhanced performance capabilities required by demanding customers worldwide.
AlSiC packaging material is utilized as an alternative to traditional metal housing systems due to its superior properties such as excellent thermal management ability coupled with electrical insulation that eliminates any form of EMI/RFI interference which results into improved signal reception leading towards increased adoption across various end-use segments globally over the coming years.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rising demand from key application segments such as power amplifiers, thyristor, IGBTs, MOSFETs and microwave electronics. China is one of the largest consumers of aluminum silicon carbide in this region owing to high production volume coupled with low cost labor.
The Asia Pacific market was followed by Europe which accounted for a revenue share of 24% in 2017 on account of growing demand from key application segments such as thyristor, IGBTs and MOSFETs along with increasing use in industrial applications such as motor drives and transformers.
Growth Factors:
- Increasing demand from the automotive and electronics industries for high-performance AlSiC packaging materials that can withstand high temperatures and harsh environments.
- Growing popularity of AlSiC packaging among consumers due to its superior thermal conductivity, electrical insulation, and heat dissipation properties.
- Rising R&D investments by leading players to develop innovative AlSiC packaging materials that can meet the specific needs of various end-use applications.
- Proliferation of advanced manufacturing technologies that are helping reduce the production costs of AlSiC packaging materials significantly.
- increasing demand for lightweight and energy-efficient vehicles which is fueling the growth of aluminum silicon carbide (AlSiC) Packaging Material market
Scope Of The Report
Report Attributes
Report Details
Report Title
Aluminum Silicon Carbide (AlSiC) Packaging Material Market Research Report
By Type
SiC (15-30), SiC (30-40), SiC (40-60), Others
By Application
Power Amplifier, Microwave Electronics, Thyristor, IGBT, MOSFET, Others
By Companies
Denka, CPS Technologies, Hunan Harvest Technology Development Company, Ltd, Beijing Baohang Advanced Material Co., Ltd., Xi'an Mingke, Hunan Everrich Composite Corp., Ceramtec, DWA Aluminum Composite, Thermal Transfer Composites, Japan Fine Ceramic, Sumitomo Electric
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
189
Number of Tables & Figures
133
Customization Available
Yes, the report can be customized as per your need.
Global Aluminum Silicon Carbide (AlSiC) Packaging Material Market Report Segments:
The global Aluminum Silicon Carbide (AlSiC) Packaging Material market is segmented on the basis of:
Types
SiC (15-30), SiC (30-40), SiC (40-60), Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Power Amplifier, Microwave Electronics, Thyristor, IGBT, MOSFET, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Denka
- CPS Technologies
- Hunan Harvest Technology Development Company, Ltd
- Beijing Baohang Advanced Material Co., Ltd.
- Xi'an Mingke
- Hunan Everrich Composite Corp.
- Ceramtec
- DWA Aluminum Composite
- Thermal Transfer Composites
- Japan Fine Ceramic
- Sumitomo Electric
 Packaging Material Market Overview.svg)
Highlights of The Aluminum Silicon Carbide (AlSiC) Packaging Material Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- SiC (15-30)
- SiC (30-40)
- SiC (40-60)
- Others
- By Application:
- Power Amplifier
- Microwave Electronics
- Thyristor
- IGBT
- MOSFET
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Aluminum Silicon Carbide (AlSiC) Packaging Material Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Packaging Material Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Aluminum Silicon Carbide (AlSiC) is a type of packaging material that is made from aluminum and silicon carbide. It is often used to create hard, durable products that can resist damage from moisture and other elements.
Some of the major players in the aluminum silicon carbide (alsic) packaging material market are Denka, CPS Technologies, Hunan Harvest Technology Development Company, Ltd, Beijing Baohang Advanced Material Co., Ltd., Xi'an Mingke, Hunan Everrich Composite Corp., Ceramtec, DWA Aluminum Composite, Thermal Transfer Composites, Japan Fine Ceramic, Sumitomo Electric.
The aluminum silicon carbide (alsic) packaging material market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Aluminum Silicon Carbide (AlSiC) Packaging Material Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Aluminum Silicon Carbide (AlSiC) Packaging Material Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Aluminum Silicon Carbide (AlSiC) Packaging Material Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Aluminum Silicon Carbide (AlSiC) Packaging Material Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size & Forecast, 2018-2028
4.5.1 Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size and Y-o-Y Growth
4.5.2 Aluminum Silicon Carbide (AlSiC) Packaging Material Market Absolute $ Opportunity
Chapter 5 Global Aluminum Silicon Carbide (AlSiC) Packaging Material Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Type
5.2.1 SiC (15-30)
5.2.2 SiC (30-40)
5.2.3 SiC (40-60)
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Aluminum Silicon Carbide (AlSiC) Packaging Material Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Applications
6.2.1 Power Amplifier
6.2.2 Microwave Electronics
6.2.3 Thyristor
6.2.4 IGBT
6.2.5 MOSFET
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Aluminum Silicon Carbide (AlSiC) Packaging Material Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Aluminum Silicon Carbide (AlSiC) Packaging Material Analysis and Forecast
9.1 Introduction
9.2 North America Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Type
9.6.1 SiC (15-30)
9.6.2 SiC (30-40)
9.6.3 SiC (40-60)
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Applications
9.10.1 Power Amplifier
9.10.2 Microwave Electronics
9.10.3 Thyristor
9.10.4 IGBT
9.10.5 MOSFET
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Aluminum Silicon Carbide (AlSiC) Packaging Material Analysis and Forecast
10.1 Introduction
10.2 Europe Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Type
10.6.1 SiC (15-30)
10.6.2 SiC (30-40)
10.6.3 SiC (40-60)
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Applications
10.10.1 Power Amplifier
10.10.2 Microwave Electronics
10.10.3 Thyristor
10.10.4 IGBT
10.10.5 MOSFET
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Aluminum Silicon Carbide (AlSiC) Packaging Material Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Type
11.6.1 SiC (15-30)
11.6.2 SiC (30-40)
11.6.3 SiC (40-60)
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Applications
11.10.1 Power Amplifier
11.10.2 Microwave Electronics
11.10.3 Thyristor
11.10.4 IGBT
11.10.5 MOSFET
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Aluminum Silicon Carbide (AlSiC) Packaging Material Analysis and Forecast
12.1 Introduction
12.2 Latin America Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Type
12.6.1 SiC (15-30)
12.6.2 SiC (30-40)
12.6.3 SiC (40-60)
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Applications
12.10.1 Power Amplifier
12.10.2 Microwave Electronics
12.10.3 Thyristor
12.10.4 IGBT
12.10.5 MOSFET
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Aluminum Silicon Carbide (AlSiC) Packaging Material Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Type
13.6.1 SiC (15-30)
13.6.2 SiC (30-40)
13.6.3 SiC (40-60)
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Aluminum Silicon Carbide (AlSiC) Packaging Material Market Size Forecast by Applications
13.10.1 Power Amplifier
13.10.2 Microwave Electronics
13.10.3 Thyristor
13.10.4 IGBT
13.10.5 MOSFET
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Aluminum Silicon Carbide (AlSiC) Packaging Material Market: Competitive Dashboard
14.2 Global Aluminum Silicon Carbide (AlSiC) Packaging Material Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Denka
14.3.2 CPS Technologies
14.3.3 Hunan Harvest Technology Development Company, Ltd
14.3.4 Beijing Baohang Advanced Material Co., Ltd.
14.3.5 Xi'an Mingke
14.3.6 Hunan Everrich Composite Corp.
14.3.7 Ceramtec
14.3.8 DWA Aluminum Composite
14.3.9 Thermal Transfer Composites
14.3.10 Japan Fine Ceramic
14.3.11 Sumitomo Electric
