Market Overview:
The global baseband processor packaging market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth of this market can be attributed to the increasing demand for baseband processors in consumer electronics, communications, automotive & transportation, industrial, aerospace & defense and healthcare applications. Additionally, the growing demand for miniaturized and low-power consuming devices is also contributing to the growth of this market. Based on type, the ball grid array (BGA) segment is expected to account for a major share of the global baseband processor packaging market during the forecast period. This can be attributed to its advantages such as high packing density and reduced manufacturing costs as compared with other types of packages.
Product Definition:
Baseband Processor Packaging is the technology used to protect and connect the baseband processor to other components in a mobile device. Baseband Processor Packaging is important because it helps ensure that the baseband processor can communicate with other parts of the device, allowing for proper function.
Ball Grid Array:
Ball Grid Array (BGA) is a type of integrated circuit packaging in which the circuit balls are placed in an array on a substrate. The term “array” is used to refer both to the ball grid array as well as the circuits formed by interconnecting these balls. BGA offers several benefits over other types of IC packaging, such as low cost and high performance, owing to its ability to pack numerous components into small spaces while maintaining good thermal management.
Surface Mount Package:
The surface mount package is a method of mounting semiconductor devices on an integrated circuit or printed circuit board. The surface mount technology has been around for many years and is still used by some manufacturers, especially in low-end products. However, the technology has several drawbacks that have led to its replacement by other packaging methods such as through-hole mounting and flip chip packaging.
Application Insights:
The communications application segment led the market in 2017 and is projected to witness significant growth over the forecast period. This can be attributed to increasing demand for wireless communication devices, such as smartphones, across various regions of the world. Furthermore, growing demand for high-speed data transfer services and 4G/LTE connectivity is expected to boost product penetration in this segment over the next seven years.
The automotive & transportation sector accounted for a share of 15% in terms of volume in 2017 owing to rising adoption of advanced safety systems such as airbags and anti-lock braking systems (ABS). In addition, growing use of processors with embedded software that controls various vehicle functions is further expected to drive industry growth over the coming years.
Regional Analysis:
North America dominated the global baseband processor packaging market in 2016 with a revenue share of over 35%. The regional market will expand further at a steady CAGR from 2017 to 2030 owing to the presence of key players such as Broadcom, Intel Corporation, Qualcomm Technologies Inc., and Texas Instruments. These companies are actively engaged in developing and launching new products that incorporate baseband processors. This is expected to drive the growth of this region.
The Asia Pacific region is anticipated to witness significant growth over the forecast period owing to increasing demand for digital devices coupled with rising penetration of smartphones, tablets, wireless infrastructure components (routers & access points), laptops/desktops, mobile phones etc. Furthermore, advancements in networking technologies along with increased adoption rate for 3G & 4G networks are also driving industry expansion across this region.
Growth Factors:
- Increasing demand for smartphones and other mobile devices
- Proliferation of 4G and 5G networks
- Growing demand for miniaturization in electronic devices
- Rising trend of system-in-package (SiP) technology
- Emergence of new applications such as the Internet of Things (IoT)
Scope Of The Report
Report Attributes
Report Details
Report Title
Baseband Processor Packaging Market Research Report
By Type
Ball Grid Array, Surface Mount Package, Pin Grid Array, Flat Package, Small Outline Package
By Application
Consumer Electronics, Communications, Automotive & Transportation, Industrial, Aerospace & Defense, Healthcare, Others
By Companies
ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), Signetics (South Korea)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
239
Number of Tables & Figures
168
Customization Available
Yes, the report can be customized as per your need.
Global Baseband Processor Packaging Market Report Segments:
The global Baseband Processor Packaging market is segmented on the basis of:
Types
Ball Grid Array, Surface Mount Package, Pin Grid Array, Flat Package, Small Outline Package
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Communications, Automotive & Transportation, Industrial, Aerospace & Defense, Healthcare, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASE Group (Taiwan)
- Amkor Technology (US)
- JCET (China)
- Chipmos Technologies (Taiwan)
- Chipbond Technology (Taiwan)
- KYEC (Taiwan)
- Intel (US)
- Samsung Electronics (South Korea)
- Texas Instruments (US)
- Signetics (South Korea)
Highlights of The Baseband Processor Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Ball Grid Array
- Surface Mount Package
- Pin Grid Array
- Flat Package
- Small Outline Package
- By Application:
- Consumer Electronics
- Communications
- Automotive & Transportation
- Industrial
- Aerospace & Defense
- Healthcare
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Baseband Processor Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Baseband Processor Packaging is a packaging method for mobile devices that includes the baseband processor and other system components.
Some of the key players operating in the baseband processor packaging market are ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), Signetics (South Korea).
The baseband processor packaging market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Baseband Processor Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Baseband Processor Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Baseband Processor Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Baseband Processor Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Baseband Processor Packaging Market Size & Forecast, 2020-2028
4.5.1 Baseband Processor Packaging Market Size and Y-o-Y Growth
4.5.2 Baseband Processor Packaging Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Ball Grid Array
5.2.2 Surface Mount Package
5.2.3 Pin Grid Array
5.2.4 Flat Package
5.2.5 Small Outline Package
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Communications
6.2.3 Automotive & Transportation
6.2.4 Industrial
6.2.5 Aerospace & Defense
6.2.6 Healthcare
6.2.7 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Baseband Processor Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Baseband Processor Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Ball Grid Array
9.6.2 Surface Mount Package
9.6.3 Pin Grid Array
9.6.4 Flat Package
9.6.5 Small Outline Package
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Communications
9.10.3 Automotive & Transportation
9.10.4 Industrial
9.10.5 Aerospace & Defense
9.10.6 Healthcare
9.10.7 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Ball Grid Array
10.6.2 Surface Mount Package
10.6.3 Pin Grid Array
10.6.4 Flat Package
10.6.5 Small Outline Package
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Communications
10.10.3 Automotive & Transportation
10.10.4 Industrial
10.10.5 Aerospace & Defense
10.10.6 Healthcare
10.10.7 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Ball Grid Array
11.6.2 Surface Mount Package
11.6.3 Pin Grid Array
11.6.4 Flat Package
11.6.5 Small Outline Package
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Communications
11.10.3 Automotive & Transportation
11.10.4 Industrial
11.10.5 Aerospace & Defense
11.10.6 Healthcare
11.10.7 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Ball Grid Array
12.6.2 Surface Mount Package
12.6.3 Pin Grid Array
12.6.4 Flat Package
12.6.5 Small Outline Package
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Communications
12.10.3 Automotive & Transportation
12.10.4 Industrial
12.10.5 Aerospace & Defense
12.10.6 Healthcare
12.10.7 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Ball Grid Array
13.6.2 Surface Mount Package
13.6.3 Pin Grid Array
13.6.4 Flat Package
13.6.5 Small Outline Package
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Communications
13.10.3 Automotive & Transportation
13.10.4 Industrial
13.10.5 Aerospace & Defense
13.10.6 Healthcare
13.10.7 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Baseband Processor Packaging Market: Competitive Dashboard
14.2 Global Baseband Processor Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASE Group (Taiwan)
14.3.2 Amkor Technology (US)
14.3.3 JCET (China)
14.3.4 Chipmos Technologies (Taiwan)
14.3.5 Chipbond Technology (Taiwan)
14.3.6 KYEC (Taiwan)
14.3.7 Intel (US)
14.3.8 Samsung Electronics (South Korea)
14.3.9 Texas Instruments (US)
14.3.10 Signetics (South Korea)
