Market Overview:
The global e-glue market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in the market can be attributed to the increasing demand for electronic devices and rising trend of miniaturization in electronics industry. In terms of type, electrically conductive segment is expected to hold major share in global e-glue market during forecast period. This can be attributed to its properties such as low thermal resistance and high thermal conductivity that make it suitable for use in various applications including printed circuit board, semiconductor & IC, and others.
Product Definition:
E-glue is a type of adhesive that is used to attach two surfaces together. It is important because it allows two surfaces to be attached without the use of screws or nails, which can damage the surface.
Electrically Conductive:
Electrically conductive polymers are a special class of materials that exhibit an electric current when exposed to magnetic fields. The most common electrically conductive polymers used in E-glue applications include Polyvinyl Chloride (PVC), Polypropylene (PP), and Polystyrene (PS). These three majorly used plastics have been gaining traction in the construction industry owing to their ability to be easily processed, molded, and recycled.
Thermally Conductive:
Thermally conductive glues are materials that allow heat to flow through them more easily than other materials. They have applications in electronics, automotive and construction industries. Thermally conductive e-glue is used for joining two or more dissimilar metals, which helps in increasing the efficiency of heat transfer from one metal to another during soldering operations.
Application Insights:
The printed circuit board segment accounted for the largest revenue share in 2017 and is anticipated to continue its dominance over the forecast period. The product is used in electronic assembly as a replacement for solder, which has several disadvantages such as low thermal conductivity, high melting point and toxicity. Therefore, using e-glue instead of conventional methods of joining PCBs helps overcome these limitations while ensuring strong electrical connectivity between components on the PCB.
E-glue finds application in semiconductor & integrated circuits packaging as it offers excellent thermal management properties along with high strength and reliability required by modern microelectronics devices. These products are used to pack various chips including processors, flash memory devices, programmable timer units etc into small spaces on a single chip or multiple chips within an IC package thereby enabling higher density packing resulting in cost reduction per unit area among other advantages such as improved yield and shorter production time among others.
Regional Analysis:
North America dominated the global e-glue market in terms of revenue share in 2017. The region is expected to continue its dominance over the forecast period owing to increasing demand for electronic products and growing semiconductor industry. Europe accounted for a significant share of global e-glue consumption, which can be attributed to high manufacturing activities within the automotive, aerospace & defense, electronics and medical sectors.
Asia Pacific is anticipated to witness substantial growth over the next eight years due to rapid industrialization along with rising investments from foreign players looking at lucrative opportunities offered by this region.
Growth Factors:
- Increasing demand from the electronics and electrical industry for adhesives and sealants
- Rising demand for E-glue from the automotive sector as a result of increasing production of electric and hybrid vehicles
- Growing use of E-glue in medical applications to seal wounds and prevent infection
- Increasing popularity of 3D printing, which requires adhesives for bonding different parts together
- Technological advancements that have led to the development of new types of E-glue with better performance characteristics
Scope Of The Report
Report Attributes
Report Details
Report Title
E-glue Market Research Report
By Type
Electrically Conductive, Thermally Conductive, UV Curing, Others
By Application
Printed Circuit Board, Semiconductor & IC, Others
By Companies
BASF SE, Covestro, 3M Company, Bostik Sa, Avery Dennison Corporation, Dow Chemical Company, Royal Adhesives and Sealants, Sika Ag, Ashland Inc., ITW Performance Polymers (Illinois Tool Works Inc.), BASF SE, RPM International Inc., Adhesives Research Inc., Beardow & Adams (Adhesives) Ltd., Chemence Inc., Henkel, Huntsman Corporation, Pidilite Industries, Mapei Spa, Super Glue Corporation, Heng Ying Adhesive Co., Ltd., Ninghai Dingcheng Adhesive Co., Ltd., American Biltrite, Inc.
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
143
Number of Tables & Figures
101
Customization Available
Yes, the report can be customized as per your need.
Global E-glue Market Report Segments:
The global E-glue market is segmented on the basis of:
Types
Electrically Conductive, Thermally Conductive, UV Curing, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Printed Circuit Board, Semiconductor & IC, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- BASF SE
- Covestro
- 3M Company
- Bostik Sa
- Avery Dennison Corporation
- Dow Chemical Company
- Royal Adhesives and Sealants
- Sika Ag
- Ashland Inc.
- ITW Performance Polymers (Illinois Tool Works Inc.)
- BASF SE
- RPM International Inc.
- Adhesives Research Inc.
- Beardow & Adams (Adhesives) Ltd.
- Chemence Inc.
- Henkel
- Huntsman Corporation
- Pidilite Industries
- Mapei Spa
- Super Glue Corporation
- Heng Ying Adhesive Co., Ltd.
- Ninghai Dingcheng Adhesive Co., Ltd.
- American Biltrite, Inc.
Highlights of The E-glue Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Electrically Conductive
- Thermally Conductive
- UV Curing
- Others
- By Application:
- Printed Circuit Board
- Semiconductor & IC
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the E-glue Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
E-glue is a type of adhesive that can be used to attach pieces of paper or other materials together. It is made up of small particles that are suspended in a liquid, and it dries quickly so that it can be attached to surfaces. E-glue is often used in the construction industry because it is strong and durable, and it can be easily removed if necessary.
Some of the key players operating in the e-glue market are BASF SE, Covestro, 3M Company, Bostik Sa, Avery Dennison Corporation, Dow Chemical Company, Royal Adhesives and Sealants, Sika Ag, Ashland Inc., ITW Performance Polymers (Illinois Tool Works Inc.), BASF SE, RPM International Inc., Adhesives Research Inc., Beardow & Adams (Adhesives) Ltd., Chemence Inc., Henkel, Huntsman Corporation, Pidilite Industries, Mapei Spa, Super Glue Corporation, Heng Ying Adhesive Co., Ltd., Ninghai Dingcheng Adhesive Co., Ltd., American Biltrite, Inc..
The e-glue market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 E-glue Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 E-glue Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 E-glue Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the E-glue Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global E-glue Market Size & Forecast, 2018-2028
4.5.1 E-glue Market Size and Y-o-Y Growth
4.5.2 E-glue Market Absolute $ Opportunity
Chapter 5 Global E-glue Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 E-glue Market Size Forecast by Type
5.2.1 Electrically Conductive
5.2.2 Thermally Conductive
5.2.3 UV Curing
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global E-glue Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 E-glue Market Size Forecast by Applications
6.2.1 Printed Circuit Board
6.2.2 Semiconductor & IC
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global E-glue Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 E-glue Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America E-glue Analysis and Forecast
9.1 Introduction
9.2 North America E-glue Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America E-glue Market Size Forecast by Type
9.6.1 Electrically Conductive
9.6.2 Thermally Conductive
9.6.3 UV Curing
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America E-glue Market Size Forecast by Applications
9.10.1 Printed Circuit Board
9.10.2 Semiconductor & IC
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe E-glue Analysis and Forecast
10.1 Introduction
10.2 Europe E-glue Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe E-glue Market Size Forecast by Type
10.6.1 Electrically Conductive
10.6.2 Thermally Conductive
10.6.3 UV Curing
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe E-glue Market Size Forecast by Applications
10.10.1 Printed Circuit Board
10.10.2 Semiconductor & IC
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific E-glue Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific E-glue Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific E-glue Market Size Forecast by Type
11.6.1 Electrically Conductive
11.6.2 Thermally Conductive
11.6.3 UV Curing
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific E-glue Market Size Forecast by Applications
11.10.1 Printed Circuit Board
11.10.2 Semiconductor & IC
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America E-glue Analysis and Forecast
12.1 Introduction
12.2 Latin America E-glue Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America E-glue Market Size Forecast by Type
12.6.1 Electrically Conductive
12.6.2 Thermally Conductive
12.6.3 UV Curing
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America E-glue Market Size Forecast by Applications
12.10.1 Printed Circuit Board
12.10.2 Semiconductor & IC
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) E-glue Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) E-glue Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) E-glue Market Size Forecast by Type
13.6.1 Electrically Conductive
13.6.2 Thermally Conductive
13.6.3 UV Curing
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) E-glue Market Size Forecast by Applications
13.10.1 Printed Circuit Board
13.10.2 Semiconductor & IC
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 E-glue Market: Competitive Dashboard
14.2 Global E-glue Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 BASF SE
14.3.2 Covestro
14.3.3 3M Company
14.3.4 Bostik Sa
14.3.5 Avery Dennison Corporation
14.3.6 Dow Chemical Company
14.3.7 Royal Adhesives and Sealants
14.3.8 Sika Ag
14.3.9 Ashland Inc.
14.3.10 ITW Performance Polymers (Illinois Tool Works Inc.)
14.3.11 BASF SE
14.3.12 RPM International Inc.
14.3.13 Adhesives Research Inc.
14.3.14 Beardow & Adams (Adhesives) Ltd.
14.3.15 Chemence Inc.
14.3.16 Henkel
14.3.17 Huntsman Corporation
14.3.18 Pidilite Industries
14.3.19 Mapei Spa
14.3.20 Super Glue Corporation
14.3.21 Heng Ying Adhesive Co., Ltd.
14.3.22 Ninghai Dingcheng Adhesive Co., Ltd.
14.3.23 American Biltrite, Inc.
