Market Overview:
The global embedded die packaging market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and higher performance in electronic devices, rising trend of IoT and connected devices, and growing demand for advanced packaging solutions in automotive and healthcare applications. Based on type, the embedded die packaging market can be segmented into embedded die in rigid board, embedded die in flexible board, and embedded die in IC package substrate.
Product Definition:
Embedded Die Packaging is a technology where integrated circuits are packaged within the same substrate as the passive components. This is done to reduce manufacturing time and cost.
Embedded Die in Rigid Board:
Embedded die in rigid board is a packaging technique used to embed the electronic component such as microprocessor or Field Programmable Gate Arrays (FPGAs) on a printed circuit board. The Embedded Die In Rigid Board (EDIRIGB) was initially developed for high-volume manufacturing of semiconductors and has been gaining popularity among other industries as well due to benefits such as low cost, better performance, and higher yield.
Embedded Die in Flexible Board:
Embedded die in flexible board is a packaging solution for high-value semiconductor products. It protects the integrated circuits (IC) from Electrostatic Dissipation (ESD), Electro Magnetic Dissipation (EMD), and vibration, among others, by employing an appropriate combination of conductive materials and insulation. The product offers reliable performance with low power consumption in portable devices such as smartphones & tablets along with other consumer electronics equipment.
Application Insights:
The consumer electronics segment accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. The growth of this application can be attributed to increasing demand for electronic devices across the globe. Moreover, technological advancements such as die shrink technology are further driving embedded die packaging solutions in consumer electronics industry.
The healthcare segment is also expected to witness significant growth during the forecast period owing to rising demand from medical equipment manufacturers. Embedded dies offer various benefits including improved thermal management and enhanced performance which makes them ideal for use in medical equipment applications. Furthermore, growing preference towards miniaturized devices due to increased disposable income levels coupled with technological advancements will drive this end-use industry over the coming years (see Healthcare below).
Regional Analysis:
Asia Pacific regional market accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand for embedded die from various end-use industries, such as consumer electronics, automotive, industrial applications and others. The region is estimated to account for a significant market share by 2030 owing to rapid developments in technology adoption across several sectors coupled with increased spending on defense & aerospace equipment by countries like China and India.
The Asia Pacific region has witnessed an increase in investments from major players looking at high growth opportunities across the developing markets of India and China. For instance, In January 2018; Qualcomm Inc., a multinational telecommunications equipment manufacturer based in California announced about expanding its operations into the Chinese mobile phone industry through an investment of USD X billion over next four years which will enable it to manufacture 30 million phones per year capacity at its new plant located in Xianning city (Central Province).
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of smart devices and the Internet of Things (IoT)
- Growing trend of system-in-package (SiP) integration
- Emergence of 3D packaging technologies
- Rising demand for advanced packaging solutions in automotive and aerospace applications
Scope Of The Report
Report Attributes
Report Details
Report Title
Embedded Die Packaging Market Research Report
By Type
Embedded Die in Rigid Board, Embedded Die in Flexible Board, Embedded Die in IC Package Substrate
By Application
Consumer Electronics, IT & Telecommunications, Automotive, Healthcare, Others
By Companies
ASE Group, AT & S, General Electric, Amkor Technology, TDK-Epcos, Schweizer, Fujikura, Microchip Technology, Infineon, Toshiba Corporation, Fujitsu Limited, STMICROELECTRONICS
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
197
Number of Tables & Figures
138
Customization Available
Yes, the report can be customized as per your need.
Global Embedded Die Packaging Market Report Segments:
The global Embedded Die Packaging market is segmented on the basis of:
Types
Embedded Die in Rigid Board, Embedded Die in Flexible Board, Embedded Die in IC Package Substrate
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, IT & Telecommunications, Automotive, Healthcare, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASE Group
- AT & S
- General Electric
- Amkor Technology
- TDK-Epcos
- Schweizer
- Fujikura
- Microchip Technology
- Infineon
- Toshiba Corporation
- Fujitsu Limited
- STMICROELECTRONICS
Highlights of The Embedded Die Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
- Embedded Die in IC Package Substrate
- By Application:
- Consumer Electronics
- IT & Telecommunications
- Automotive
- Healthcare
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Embedded Die Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Embedded die packaging is a type of chip packaging in which the chips are embedded within a single piece of plastic or other material. This makes it easier to produce and transport the product, as well as reducing environmental impact.
Some of the key players operating in the embedded die packaging market are ASE Group, AT & S, General Electric, Amkor Technology, TDK-Epcos, Schweizer, Fujikura, Microchip Technology, Infineon, Toshiba Corporation, Fujitsu Limited, STMICROELECTRONICS.
The embedded die packaging market is expected to grow at a compound annual growth rate of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Embedded Die Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Embedded Die Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Embedded Die Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Embedded Die Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Embedded Die Packaging Market Size & Forecast, 2018-2028
4.5.1 Embedded Die Packaging Market Size and Y-o-Y Growth
4.5.2 Embedded Die Packaging Market Absolute $ Opportunity
Chapter 5 Global Embedded Die Packaging Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Embedded Die Packaging Market Size Forecast by Type
5.2.1 Embedded Die in Rigid Board
5.2.2 Embedded Die in Flexible Board
5.2.3 Embedded Die in IC Package Substrate
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Embedded Die Packaging Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Embedded Die Packaging Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 IT & Telecommunications
6.2.3 Automotive
6.2.4 Healthcare
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Embedded Die Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Embedded Die Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Embedded Die Packaging Analysis and Forecast
9.1 Introduction
9.2 North America Embedded Die Packaging Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Embedded Die Packaging Market Size Forecast by Type
9.6.1 Embedded Die in Rigid Board
9.6.2 Embedded Die in Flexible Board
9.6.3 Embedded Die in IC Package Substrate
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Embedded Die Packaging Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 IT & Telecommunications
9.10.3 Automotive
9.10.4 Healthcare
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Embedded Die Packaging Analysis and Forecast
10.1 Introduction
10.2 Europe Embedded Die Packaging Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Embedded Die Packaging Market Size Forecast by Type
10.6.1 Embedded Die in Rigid Board
10.6.2 Embedded Die in Flexible Board
10.6.3 Embedded Die in IC Package Substrate
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Embedded Die Packaging Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 IT & Telecommunications
10.10.3 Automotive
10.10.4 Healthcare
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Embedded Die Packaging Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Embedded Die Packaging Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Embedded Die Packaging Market Size Forecast by Type
11.6.1 Embedded Die in Rigid Board
11.6.2 Embedded Die in Flexible Board
11.6.3 Embedded Die in IC Package Substrate
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Embedded Die Packaging Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 IT & Telecommunications
11.10.3 Automotive
11.10.4 Healthcare
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Embedded Die Packaging Analysis and Forecast
12.1 Introduction
12.2 Latin America Embedded Die Packaging Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Embedded Die Packaging Market Size Forecast by Type
12.6.1 Embedded Die in Rigid Board
12.6.2 Embedded Die in Flexible Board
12.6.3 Embedded Die in IC Package Substrate
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Embedded Die Packaging Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 IT & Telecommunications
12.10.3 Automotive
12.10.4 Healthcare
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Embedded Die Packaging Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Embedded Die Packaging Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Embedded Die Packaging Market Size Forecast by Type
13.6.1 Embedded Die in Rigid Board
13.6.2 Embedded Die in Flexible Board
13.6.3 Embedded Die in IC Package Substrate
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Embedded Die Packaging Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 IT & Telecommunications
13.10.3 Automotive
13.10.4 Healthcare
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Embedded Die Packaging Market: Competitive Dashboard
14.2 Global Embedded Die Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASE Group
14.3.2 AT & S
14.3.3 General Electric
14.3.4 Amkor Technology
14.3.5 TDK-Epcos
14.3.6 Schweizer
14.3.7 Fujikura
14.3.8 Microchip Technology
14.3.9 Infineon
14.3.10 Toshiba Corporation
14.3.11 Fujitsu Limited
14.3.12 STMICROELECTRONICS
