Market Overview:
The global MEMS packaging market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for MEMS sensors in various applications, such as automotive, mobile phones, consumer electronics, medical systems, and industrial applications. In addition, the growing demand for miniaturized and low-power consuming devices is also contributing to the growth of this market. The inertial sensors packaging segment is expected to hold the largest share of the global MEMS packaging market during the forecast period. This can be attributed to factors such as increasing demand for inertial sensors in automotive and mobile phone applications.
Product Definition:
MEMS packaging is the process of encapsulating MEMS devices. The purpose of MEMS packaging is to protect the delicate device structures from physical and environmental damage, while providing an interface for electrical and mechanical connection to other system components.
Inertial Sensors Packaging:
Inertial sensors packaging is a new term in the MEMS packaging market. It was created to differentiate between traditional motion sensors and accelerometers that are used in consumer electronic products such as smartphones, tablets, wearables and other devices. The key factor that differentiates inertial sensor from its competitors is its ability to measure both linear and non-linear acceleration with high accuracy even when the device is moving or shaking slightly.
Optical Sensors Packaging:
Optical sensors packaging is used for protecting sensitive optical and MEMS devices from dust, moisture, electrostatic discharge (ESD), and other environmental factors. It helps in providing reliable performance of the device by preventing corrosion, oxidation or any other damage caused to the device due to external factors such as temperature & voltage fluctuations.
Application Insights:
The automotive application segment accounted for the largest revenue share in 2016 and is projected to continue leading over the forecast period. MEMS inertial sensors are used in automobiles for safety applications, such as antiskid brake, traction control, and anti-lock braking system. The increasing need for advanced safety features has led to an increased demand from automobile manufacturers.
MEMS packaging provides enhanced thermal management compared with traditional electronic package types. This allows greater integration of components while maintaining sufficient thermal insulation between them; this factor is expected to drive their demand in various consumer electronics products over the forecast period. They are also used extensively in medical systems owing to their small size and high accuracy; these factors are likely to propel market growth during the forecast period. Other key end-use markets include industrial robots, smart energy grid devices (smart meters), environmental monitoring systems (water & waste water treatment plants), ultrasonic testing equipment/appliances (ovens/freezers) among others.
Regional Analysis:
North America dominated the global market in 2017. The region is expected to continue its dominance over the forecast period as well, owing to factors such as increasing R&D activities and high adoption of MEMS technology across various applications. Asia Pacific is also anticipated to witness significant growth over the coming years due to rising demand for miniaturization and cost-effective solutions from several end-use industries such as automotive, consumer electronics, medical systems, etc. In addition, growing industrialization in emerging countries like China and India coupled with favorable government initiatives aimed at promoting manufacturing activities are expected to drive regional market growth during the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from automotive and medical industries
- Growing popularity of MEMS sensors
- Proliferation of 3D printing technology 5. Development of innovative packaging solutions
Scope Of The Report
Report Attributes
Report Details
Report Title
MEMS Packaging Market Research Report
By Type
Inertial Sensors Packaging, Optical Sensors Packaging, Environmental Sensors Packaging, Ultrasonic Sensors Packaging, Others
By Application
Automotive, Mobile Phones, Consumer Electronics, Medical Systems, Industrial, Others
By Companies
ChipMos Technologies Inc., AAC Technologies Holdings Inc., Bosch Sensortec GmbH, Infineon Technologies AG, Analog Devices, Inc., Texas Instruments Incorporated., Taiwan Semiconductor Manufacturing Company Limited, MEMSCAP, Orbotech Ltd., TDK Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
189
Number of Tables & Figures
133
Customization Available
Yes, the report can be customized as per your need.
Global MEMS Packaging Market Report Segments:
The global MEMS Packaging market is segmented on the basis of:
Types
Inertial Sensors Packaging, Optical Sensors Packaging, Environmental Sensors Packaging, Ultrasonic Sensors Packaging, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive, Mobile Phones, Consumer Electronics, Medical Systems, Industrial, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ChipMos Technologies Inc.
- AAC Technologies Holdings Inc.
- Bosch Sensortec GmbH
- Infineon Technologies AG
- Analog Devices, Inc.
- Texas Instruments Incorporated.
- Taiwan Semiconductor Manufacturing Company Limited
- MEMSCAP
- Orbotech Ltd.
- TDK Corporation
Highlights of The MEMS Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Inertial Sensors Packaging
- Optical Sensors Packaging
- Environmental Sensors Packaging
- Ultrasonic Sensors Packaging
- Others
- By Application:
- Automotive
- Mobile Phones
- Consumer Electronics
- Medical Systems
- Industrial
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the MEMS Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
MEMS packaging is a type of packaging that uses MEMS (microelectromechanical systems) technology. This type of packaging is used to protect products from the environment and from damage during shipping and storage.
Some of the key players operating in the mems packaging market are ChipMos Technologies Inc., AAC Technologies Holdings Inc., Bosch Sensortec GmbH, Infineon Technologies AG, Analog Devices, Inc., Texas Instruments Incorporated., Taiwan Semiconductor Manufacturing Company Limited, MEMSCAP, Orbotech Ltd., TDK Corporation.
The mems packaging market is expected to register a CAGR of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 MEMS Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 MEMS Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 MEMS Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the MEMS Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global MEMS Packaging Market Size & Forecast, 2018-2028
4.5.1 MEMS Packaging Market Size and Y-o-Y Growth
4.5.2 MEMS Packaging Market Absolute $ Opportunity
Chapter 5 Global MEMS Packaging Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 MEMS Packaging Market Size Forecast by Type
5.2.1 Inertial Sensors Packaging
5.2.2 Optical Sensors Packaging
5.2.3 Environmental Sensors Packaging
5.2.4 Ultrasonic Sensors Packaging
5.2.5 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global MEMS Packaging Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 MEMS Packaging Market Size Forecast by Applications
6.2.1 Automotive
6.2.2 Mobile Phones
6.2.3 Consumer Electronics
6.2.4 Medical Systems
6.2.5 Industrial
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global MEMS Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 MEMS Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America MEMS Packaging Analysis and Forecast
9.1 Introduction
9.2 North America MEMS Packaging Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America MEMS Packaging Market Size Forecast by Type
9.6.1 Inertial Sensors Packaging
9.6.2 Optical Sensors Packaging
9.6.3 Environmental Sensors Packaging
9.6.4 Ultrasonic Sensors Packaging
9.6.5 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America MEMS Packaging Market Size Forecast by Applications
9.10.1 Automotive
9.10.2 Mobile Phones
9.10.3 Consumer Electronics
9.10.4 Medical Systems
9.10.5 Industrial
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe MEMS Packaging Analysis and Forecast
10.1 Introduction
10.2 Europe MEMS Packaging Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe MEMS Packaging Market Size Forecast by Type
10.6.1 Inertial Sensors Packaging
10.6.2 Optical Sensors Packaging
10.6.3 Environmental Sensors Packaging
10.6.4 Ultrasonic Sensors Packaging
10.6.5 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe MEMS Packaging Market Size Forecast by Applications
10.10.1 Automotive
10.10.2 Mobile Phones
10.10.3 Consumer Electronics
10.10.4 Medical Systems
10.10.5 Industrial
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific MEMS Packaging Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific MEMS Packaging Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific MEMS Packaging Market Size Forecast by Type
11.6.1 Inertial Sensors Packaging
11.6.2 Optical Sensors Packaging
11.6.3 Environmental Sensors Packaging
11.6.4 Ultrasonic Sensors Packaging
11.6.5 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific MEMS Packaging Market Size Forecast by Applications
11.10.1 Automotive
11.10.2 Mobile Phones
11.10.3 Consumer Electronics
11.10.4 Medical Systems
11.10.5 Industrial
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America MEMS Packaging Analysis and Forecast
12.1 Introduction
12.2 Latin America MEMS Packaging Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America MEMS Packaging Market Size Forecast by Type
12.6.1 Inertial Sensors Packaging
12.6.2 Optical Sensors Packaging
12.6.3 Environmental Sensors Packaging
12.6.4 Ultrasonic Sensors Packaging
12.6.5 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America MEMS Packaging Market Size Forecast by Applications
12.10.1 Automotive
12.10.2 Mobile Phones
12.10.3 Consumer Electronics
12.10.4 Medical Systems
12.10.5 Industrial
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) MEMS Packaging Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) MEMS Packaging Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) MEMS Packaging Market Size Forecast by Type
13.6.1 Inertial Sensors Packaging
13.6.2 Optical Sensors Packaging
13.6.3 Environmental Sensors Packaging
13.6.4 Ultrasonic Sensors Packaging
13.6.5 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) MEMS Packaging Market Size Forecast by Applications
13.10.1 Automotive
13.10.2 Mobile Phones
13.10.3 Consumer Electronics
13.10.4 Medical Systems
13.10.5 Industrial
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 MEMS Packaging Market: Competitive Dashboard
14.2 Global MEMS Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ChipMos Technologies Inc.
14.3.2 AAC Technologies Holdings Inc.
14.3.3 Bosch Sensortec GmbH
14.3.4 Infineon Technologies AG
14.3.5 Analog Devices, Inc.
14.3.6 Texas Instruments Incorporated.
14.3.7 Taiwan Semiconductor Manufacturing Company Limited
14.3.8 MEMSCAP
14.3.9 Orbotech Ltd.
14.3.10 TDK Corporation
