Market Overview:
The global multi-project wafer (MPW) service market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The MPW service market is segmented on the basis of type, application and region. On the basis of type, the MPW service market is segmented into 12nm, 22nm, 28nm, 40nm, 55nm and others. Among these segments, 12 nm segment is expected to grow at highest CAGR during the forecast period from 2018 to 2030 owing to increasing demand for miniaturization in electronic devices.
 Service Industry Outlook.svg)
Product Definition:
Multi-Project Wafer (MPW) Service is a type of service that allows customers to share the cost of manufacturing wafers with other customers. This type of service is important because it helps reduce the cost of manufacturing wafers for customers.
12nm:
12nm is a key technology used in the manufacturing of semiconductors. The MPW service providers use this technology to reduce process times and costs by reducing the size of wafers that are used in fabrication processes. 12 nm has been witnessing significant growth over the past few years owing to its increasing usage for fabricating semiconductor devices with higher performance, power efficiency, and reduced cost per unit of output.
22nm:
22nm is a type of semiconductor process used to make very fine wires and small pieces of silicon. It has applications in integrated circuits, memory devices, and other electronic products. 22nm is one step below the traditional 28 nm process node which makes the manufacturing cost lower than that of the 28 nm technology. The 22 nm technology helps reduce power consumption by approximately 15% as compared to its counterpart; this factor will help boost demand for this technology over the next few years.
Application Insights:
The others application segment accounted for the largest revenue share in 2017 and is projected to expand at a CAGR of XX% from 2018 to 2030. MEMS is expected to emerge as one of the prominent segments owing to its low power consumption, small size, high accuracy & reliability and ease of manufacturing.
MEMS-based products are used in numerous end-use industries including automotive & transportation electronics healthcare among others due largely on their miniaturization enabling cost-effective solutions that provide enhanced performance over traditional counterparts. Miniaturization also enables product integration with flexible packaging options which further boosts product adoption across various industry verticals.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The region is home to several key players, which has resulted in a high penetration of MPW services in the industry. Furthermore, increasing demand for consumer electronics products such as smartphones and tablets coupled with rising investments by semiconductor manufacturers are anticipated to drive regional growth over the next eight years.
The European market was valued at USD X billion in 2017 and is projected to grow at a CAGR of XX% from 2018 to 2030 owing to growing demand for advanced technologies across various application areas including automotive, aerospace & defense, healthcare & life sciences among others. Moreover, presence of major foundry service providers such as ASML; NXP Semiconductors N.V.; Infineon Technologies AG; Micron Technology Inc.; Qualcomm Technologies Inc.; Samsung Electronics Co., Ltd; SK Hynix Mfg Co., Ltd.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The trend of miniaturization in electronic devices is driving the demand for MPW services as these services can help reduce the size of components and circuits.
- Growing popularity of 3D printing: 3D printing is growing in popularity and is being used to create complex structures that are not possible with traditional manufacturing techniques. MPW services can be used to produce these complex structures using 3D printing technology.
- Advances in semiconductor technology: Semiconductor technology is advancing at a rapid pace, and this is driving the need for MPW services as they can help speed up the development process of new semiconductor products.
- Increased focus on product reliability: As electronics become more complex, product reliability becomes increasingly important, which is driving demand for MPW services that can help improve product quality and reliability.
Scope Of The Report
Report Attributes
Report Details
Report Title
Multi-Project Wafer (MPW) Service Market Research Report
By Type
12nm, 22nm, 28nm, 40nm, 55nm, Others
By Application
Microelectromechanical Systems(MEMS), Integrated Photonics, Others
By Companies
Circuits Multi-Projets, CMC Microsystems, Fraunhofer IIS, GlobalFoundries, Interuniversity Microelectronics Centre, Jeppix, Ligentec SA, Tower Semiconductor, Egalux S.A., Smart Photonics BV, TSMC, Teledyne Technologies Incorporated
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
165
Number of Tables & Figures
116
Customization Available
Yes, the report can be customized as per your need.
Global Multi-Project Wafer (MPW) Service Market Report Segments:
The global Multi-Project Wafer (MPW) Service market is segmented on the basis of:
Types
12nm, 22nm, 28nm, 40nm, 55nm, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Microelectromechanical Systems(MEMS), Integrated Photonics, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Circuits Multi-Projets
- CMC Microsystems
- Fraunhofer IIS
- GlobalFoundries
- Interuniversity Microelectronics Centre
- Jeppix
- Ligentec SA
- Tower Semiconductor
- Egalux S.A.
- Smart Photonics BV
- TSMC
- Teledyne Technologies Incorporated
 Service Market Overview.svg)
Highlights of The Multi-Project Wafer (MPW) Service Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 12nm
- 22nm
- 28nm
- 40nm
- 55nm
- Others
- By Application:
- Microelectromechanical Systems(MEMS)
- Integrated Photonics
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Multi-Project Wafer (MPW) Service Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Service Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Multi-Project Wafer (MPW) Service is a service that allows customers to order multiple wafers at one time. This service helps reduce the amount of time it takes to receive orders and reduces the number of phone calls required from customers.
Some of the key players operating in the multi-project wafer (mpw) service market are Circuits Multi-Projets, CMC Microsystems, Fraunhofer IIS, GlobalFoundries, Interuniversity Microelectronics Centre, Jeppix, Ligentec SA, Tower Semiconductor, Egalux S.A., Smart Photonics BV, TSMC, Teledyne Technologies Incorporated.
The multi-project wafer (mpw) service market is expected to grow at a compound annual growth rate of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Multi-Project Wafer (MPW) Service Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Multi-Project Wafer (MPW) Service Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Multi-Project Wafer (MPW) Service Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Multi-Project Wafer (MPW) Service Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Multi-Project Wafer (MPW) Service Market Size & Forecast, 2018-2028
4.5.1 Multi-Project Wafer (MPW) Service Market Size and Y-o-Y Growth
4.5.2 Multi-Project Wafer (MPW) Service Market Absolute $ Opportunity
Chapter 5 Global Multi-Project Wafer (MPW) Service Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Multi-Project Wafer (MPW) Service Market Size Forecast by Type
5.2.1 12nm
5.2.2 22nm
5.2.3 28nm
5.2.4 40nm
5.2.5 55nm
5.2.6 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Multi-Project Wafer (MPW) Service Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Multi-Project Wafer (MPW) Service Market Size Forecast by Applications
6.2.1 Microelectromechanical Systems(MEMS)
6.2.2 Integrated Photonics
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Multi-Project Wafer (MPW) Service Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Multi-Project Wafer (MPW) Service Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Multi-Project Wafer (MPW) Service Analysis and Forecast
9.1 Introduction
9.2 North America Multi-Project Wafer (MPW) Service Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Multi-Project Wafer (MPW) Service Market Size Forecast by Type
9.6.1 12nm
9.6.2 22nm
9.6.3 28nm
9.6.4 40nm
9.6.5 55nm
9.6.6 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Multi-Project Wafer (MPW) Service Market Size Forecast by Applications
9.10.1 Microelectromechanical Systems(MEMS)
9.10.2 Integrated Photonics
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Multi-Project Wafer (MPW) Service Analysis and Forecast
10.1 Introduction
10.2 Europe Multi-Project Wafer (MPW) Service Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Multi-Project Wafer (MPW) Service Market Size Forecast by Type
10.6.1 12nm
10.6.2 22nm
10.6.3 28nm
10.6.4 40nm
10.6.5 55nm
10.6.6 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Multi-Project Wafer (MPW) Service Market Size Forecast by Applications
10.10.1 Microelectromechanical Systems(MEMS)
10.10.2 Integrated Photonics
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Multi-Project Wafer (MPW) Service Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Multi-Project Wafer (MPW) Service Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Multi-Project Wafer (MPW) Service Market Size Forecast by Type
11.6.1 12nm
11.6.2 22nm
11.6.3 28nm
11.6.4 40nm
11.6.5 55nm
11.6.6 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Multi-Project Wafer (MPW) Service Market Size Forecast by Applications
11.10.1 Microelectromechanical Systems(MEMS)
11.10.2 Integrated Photonics
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Multi-Project Wafer (MPW) Service Analysis and Forecast
12.1 Introduction
12.2 Latin America Multi-Project Wafer (MPW) Service Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Multi-Project Wafer (MPW) Service Market Size Forecast by Type
12.6.1 12nm
12.6.2 22nm
12.6.3 28nm
12.6.4 40nm
12.6.5 55nm
12.6.6 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Multi-Project Wafer (MPW) Service Market Size Forecast by Applications
12.10.1 Microelectromechanical Systems(MEMS)
12.10.2 Integrated Photonics
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Multi-Project Wafer (MPW) Service Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Multi-Project Wafer (MPW) Service Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Multi-Project Wafer (MPW) Service Market Size Forecast by Type
13.6.1 12nm
13.6.2 22nm
13.6.3 28nm
13.6.4 40nm
13.6.5 55nm
13.6.6 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Multi-Project Wafer (MPW) Service Market Size Forecast by Applications
13.10.1 Microelectromechanical Systems(MEMS)
13.10.2 Integrated Photonics
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Multi-Project Wafer (MPW) Service Market: Competitive Dashboard
14.2 Global Multi-Project Wafer (MPW) Service Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Circuits Multi-Projets
14.3.2 CMC Microsystems
14.3.3 Fraunhofer IIS
14.3.4 GlobalFoundries
14.3.5 Interuniversity Microelectronics Centre
14.3.6 Jeppix
14.3.7 Ligentec SA
14.3.8 Tower Semiconductor
14.3.9 Egalux S.A.
14.3.10 Smart Photonics BV
14.3.11 TSMC
14.3.12 Teledyne Technologies Incorporated
