Market Overview:
The global polymer core solder ball market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for miniaturization and higher density packaging in consumer electronics and semiconductor applications. In terms of type, the 200-400 µm segment is expected to account for the largest share of the market during the forecast period. This can be attributed to its high demand from WLCSP applications. In terms of region, Asia Pacific is expected to account for the largest share of the market duringthe forecast period.
Product Definition:
A solder ball that has a polymer core is used for underfill encapsulation. The polymer core helps to prevent the solder ball from spreading out and creates a more consistent shape. This allows for better placement and reduces the risk of shorts.
200-400 µm:
200-400 µm, it's usage.
The 200-400 µm range of soldering irons is used for surface mount devices (SMD) such as microchips.
400-500 µm:
400-500 µm is the range of average particle size for polymeric core solder ball. It has a round shape and is made from high purity polymers, which makes it ideal for soldering applications in electronic devices. 400-500 µm polymeric core solder ball has better electrical characteristics such as lower surface area, higher melting point and density, which helps to provide reliable soldering performance with less risk of failure.
Application Insights:
The WLCSP application segment led the global market and accounted for more than 40% of the total revenue share in 2017. The growing demand for high-density interconnection technologies in various end-use industries, such as consumer electronics, telecommunications and IT, is expected to drive the product demand over the forecast period.
Ceramic BGA is another key application segment that is projected to witness significant growth during the forecast period owing to increasing use of ceramic balls in smartphones and laptops among other electronic devices. Moreover, rising use of BGA components in medical equipment and machinery also boosts industry growth over the forecast period.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The region’s growth can be attributed to increasing demand from end-use industries, such as electronics, automotive, medical devices and others. China is estimated to remain a key consumer owing to its large population base and rapid urbanization resulting in increased per capita income levels. Moreover, rising foreign investments coupled with favorable government policies are anticipated to boost regional product demand over the forecast period.
The Asia Pacific economy has been witnessing strong economic growth on account of robust manufacturing sectors across major economies including China, India Japan South Korea Indonesia Thailand Vietnam Myanmar (Burma) Philippines Bangladesh Pakistan Sri Lanka Afghanistan Kuwait Iran Oman Saudi Arabia United Arab Emirates (UAE).
Growth Factors:
- Increasing demand from the automotive and electronics industries
- Growing popularity of polymer core solder balls in LED packaging
- Rising demand for miniaturized and high-density electronic devices
- Proliferation of 3D printing technology
- Technological advancements in the field of soldering
Scope Of The Report
Report Attributes
Report Details
Report Title
Polymer Core Solder Ball Market Research Report
By Type
200-400 µm, 400-500 µm, > 500 µm
By Application
WLCSP, Ceramic BGA, Package on Package
By Companies
Sekisui Chemical, TopLine, Sekisui Chemical
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
207
Number of Tables & Figures
145
Customization Available
Yes, the report can be customized as per your need.
Global Polymer Core Solder Ball Market Report Segments:
The global Polymer Core Solder Ball market is segmented on the basis of:
Types
200-400 µm, 400-500 µm, > 500 µm
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
WLCSP, Ceramic BGA, Package on Package
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Sekisui Chemical
- TopLine
- Sekisui Chemical
Highlights of The Polymer Core Solder Ball Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 200-400 µm
- 400-500 µm
- > 500 µm
- By Application:
- WLCSP
- Ceramic BGA
- Package on Package
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Polymer Core Solder Ball Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Polymer Core Solder Ball is a type of solder ball that has a polymer core. This makes it easier to handle and less likely to cause heat damage during soldering.
Some of the major companies in the polymer core solder ball market are Sekisui Chemical, TopLine, Sekisui Chemical.
The polymer core solder ball market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Polymer Core Solder Ball Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Polymer Core Solder Ball Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Polymer Core Solder Ball Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Polymer Core Solder Ball Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Polymer Core Solder Ball Market Size & Forecast, 2018-2028 4.5.1 Polymer Core Solder Ball Market Size and Y-o-Y Growth 4.5.2 Polymer Core Solder Ball Market Absolute $ Opportunity
Chapter 5 Global Polymer Core Solder Ball Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Polymer Core Solder Ball Market Size Forecast by Type
5.2.1 200-400 µm
5.2.2 400-500 µm
5.2.3 > 500 µm
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Polymer Core Solder Ball Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Polymer Core Solder Ball Market Size Forecast by Applications
6.2.1 WLCSP
6.2.2 Ceramic BGA
6.2.3 Package on Package
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Polymer Core Solder Ball Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Polymer Core Solder Ball Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Polymer Core Solder Ball Analysis and Forecast
9.1 Introduction
9.2 North America Polymer Core Solder Ball Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Polymer Core Solder Ball Market Size Forecast by Type
9.6.1 200-400 µm
9.6.2 400-500 µm
9.6.3 > 500 µm
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Polymer Core Solder Ball Market Size Forecast by Applications
9.10.1 WLCSP
9.10.2 Ceramic BGA
9.10.3 Package on Package
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Polymer Core Solder Ball Analysis and Forecast
10.1 Introduction
10.2 Europe Polymer Core Solder Ball Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Polymer Core Solder Ball Market Size Forecast by Type
10.6.1 200-400 µm
10.6.2 400-500 µm
10.6.3 > 500 µm
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Polymer Core Solder Ball Market Size Forecast by Applications
10.10.1 WLCSP
10.10.2 Ceramic BGA
10.10.3 Package on Package
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Polymer Core Solder Ball Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Polymer Core Solder Ball Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Polymer Core Solder Ball Market Size Forecast by Type
11.6.1 200-400 µm
11.6.2 400-500 µm
11.6.3 > 500 µm
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Polymer Core Solder Ball Market Size Forecast by Applications
11.10.1 WLCSP
11.10.2 Ceramic BGA
11.10.3 Package on Package
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Polymer Core Solder Ball Analysis and Forecast
12.1 Introduction
12.2 Latin America Polymer Core Solder Ball Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Polymer Core Solder Ball Market Size Forecast by Type
12.6.1 200-400 µm
12.6.2 400-500 µm
12.6.3 > 500 µm
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Polymer Core Solder Ball Market Size Forecast by Applications
12.10.1 WLCSP
12.10.2 Ceramic BGA
12.10.3 Package on Package
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Polymer Core Solder Ball Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Polymer Core Solder Ball Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Polymer Core Solder Ball Market Size Forecast by Type
13.6.1 200-400 µm
13.6.2 400-500 µm
13.6.3 > 500 µm
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Polymer Core Solder Ball Market Size Forecast by Applications
13.10.1 WLCSP
13.10.2 Ceramic BGA
13.10.3 Package on Package
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Polymer Core Solder Ball Market: Competitive Dashboard
14.2 Global Polymer Core Solder Ball Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Sekisui Chemical
14.3.2 TopLine
14.3.3 Sekisui Chemical