Market Overview:
The global recycled white lined chipboard market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for recycled white lined chipboard from various end-use applications, such as solar relay, EV relay, and others. In terms of type, the 10A segment is expected to lead the global recycled white lined chipboard market during the forecast period due to its high demand from end-use applications. However, in terms of CAGR, the 16A segment is projected to grow at a higher rate than other segments during the forecast period.
Product Definition:
Recycled white lined chipboard is a paperboard made from recycled materials. It is used for packaging, printing, and other industrial applications.
10A:
10A is the current standard for recycling chipboard. It is a code that represents the maximum amount of waste paper that can be processed through an average sorting machine. The higher the number, generally means more fibers per ton and better quality of chips produced from less virgin fiber.
The 10A rating system was developed by EPA in cooperation with private industry and government agencies to rate the quality of recycled materials used in various applications such as carpeting, packaging, construction materials, etc.
12A:
12A is a type of wood used in chipboard manufacturing. It has high moisture content and low lignin content which makes it suitable for chipboard production. 12A grade is also known as “Pine” or “Pitch pine” due to its abundance in the pine tree.
Application Insights:
The demand for LGCB in the electrical and electronics industry is expected to witness growth at a CAGR of XX% from 2018 to 2030 owing to its properties such as lightweight, high strength and stiffness, durability, low cost and toxicity free nature. The product finds application in various products including circuit boards, housing for electronic devices among others.
In terms of revenue generation in 2017, the solar relay segment dominated the global market with a share of over 35%. LGCB is widely used for making components that are required to operate under harsh environmental conditions such as temperature changes & moisture absorption. Components made using recycled white lined chipboard exhibit excellent resistance against corrosion & weather conditions which makes them suitable for use in solar energy conversion systems where high performance is mandatory requirement.
Regional Analysis:
Asia Pacific dominated the global market in 2017. The region is expected to witness significant growth over the forecast period owing to increasing demand for EV relay from China, India, Japan and South Korea. In addition, rising number of manufacturing facilities of various automotive companies including Honda Motor Co., Ltd., Toyota Industries Corporation and Suzuki Motor Corp is anticipated to propel product demand over the next eight years.
Europe accounted for a major share in terms of revenue as a result of high consumption by Germany which was valued at USD X million in 2017 and growing application scope for recycled white lined chipboard within electrical engineering industry due to strict regulations regarding energy consumption by European Union (EU). Moreover, increasing use within residential sector due to growing consumer awareness regarding environment protection is also expected drive regional growth over the forecast period.
The North American market has been witnessing steady growth on account with rising construction activities across U.S.
Growth Factors:
- Increasing demand from packaging and printing industries
- Rising awareness about the benefits of using recycled materials
- Government initiatives and regulations to promote recycling
- Growing popularity of eco-friendly products among consumers
- Technological advancements that improve the efficiency of recycling processes
Scope Of The Report
Report Attributes
Report Details
Report Title
Recycled White Lined Chipboard Market Research Report
By Type
10A, 12A, 16A, 26A, 32A, 30A, 35A, 40A, 50A, Others
By Application
Solar Relay, EV Relay, Others
By Companies
Omron, Hongfa Technology Co., Ltd., TE Connectivity, Panasonic, Fujitsu, Song Chuan, Sanyou, ABB, Schneider Electric, Teledyne, Zettler Group, Infineon Technologies
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
188
Number of Tables & Figures
132
Customization Available
Yes, the report can be customized as per your need.
Global Recycled White Lined Chipboard Market Report Segments:
The global Recycled White Lined Chipboard market is segmented on the basis of:
Types
10A, 12A, 16A, 26A, 32A, 30A, 35A, 40A, 50A, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Solar Relay, EV Relay, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Omron
- Hongfa Technology Co., Ltd.
- TE Connectivity
- Panasonic
- Fujitsu
- Song Chuan
- Sanyou
- ABB
- Schneider Electric
- Teledyne
- Zettler Group
- Infineon Technologies
Highlights of The Recycled White Lined Chipboard Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 10A
- 12A
- 16A
- 26A
- 32A
- 30A
- 35A
- 40A
- 50A
- Others
- By Application:
- Solar Relay
- EV Relay
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Recycled White Lined Chipboard Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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- Consumer Insights
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Recycled white lined chipboard is a type of recycled paper that has been cleaned and bleached to remove any ink or other contaminants. It is then dried and cut into small pieces to be used in products like packaging, furniture, and flooring.
Some of the major players in the recycled white lined chipboard market are Omron, Hongfa Technology Co., Ltd., TE Connectivity, Panasonic, Fujitsu, Song Chuan, Sanyou, ABB, Schneider Electric, Teledyne, Zettler Group, Infineon Technologies.
The recycled white lined chipboard market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Recycled White Lined Chipboard Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Recycled White Lined Chipboard Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Recycled White Lined Chipboard Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Recycled White Lined Chipboard Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Recycled White Lined Chipboard Market Size & Forecast, 2020-2028 4.5.1 Recycled White Lined Chipboard Market Size and Y-o-Y Growth 4.5.2 Recycled White Lined Chipboard Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 10A
5.2.2 12A
5.2.3 16A
5.2.4 26A
5.2.5 32A
5.2.6 30A
5.2.7 35A
5.2.8 40A
5.2.9 50A
5.2.10 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Solar Relay
6.2.2 EV Relay
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Recycled White Lined Chipboard Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Recycled White Lined Chipboard Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 10A
9.6.2 12A
9.6.3 16A
9.6.4 26A
9.6.5 32A
9.6.6 30A
9.6.7 35A
9.6.8 40A
9.6.9 50A
9.6.10 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Solar Relay
9.10.2 EV Relay
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 10A
10.6.2 12A
10.6.3 16A
10.6.4 26A
10.6.5 32A
10.6.6 30A
10.6.7 35A
10.6.8 40A
10.6.9 50A
10.6.10 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Solar Relay
10.10.2 EV Relay
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 10A
11.6.2 12A
11.6.3 16A
11.6.4 26A
11.6.5 32A
11.6.6 30A
11.6.7 35A
11.6.8 40A
11.6.9 50A
11.6.10 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Solar Relay
11.10.2 EV Relay
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 10A
12.6.2 12A
12.6.3 16A
12.6.4 26A
12.6.5 32A
12.6.6 30A
12.6.7 35A
12.6.8 40A
12.6.9 50A
12.6.10 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Solar Relay
12.10.2 EV Relay
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 10A
13.6.2 12A
13.6.3 16A
13.6.4 26A
13.6.5 32A
13.6.6 30A
13.6.7 35A
13.6.8 40A
13.6.9 50A
13.6.10 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Solar Relay
13.10.2 EV Relay
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Recycled White Lined Chipboard Market: Competitive Dashboard
14.2 Global Recycled White Lined Chipboard Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Omron
14.3.2 Hongfa Technology Co., Ltd.
14.3.3 TE Connectivity
14.3.4 Panasonic
14.3.5 Fujitsu
14.3.6 Song Chuan
14.3.7 Sanyou
14.3.8 ABB
14.3.9 Schneider Electric
14.3.10 Teledyne
14.3.11 Zettler Group
14.3.12 Infineon Technologies