Market Overview:
The global solder bar market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the solder bar market can be attributed to the increasing demand for lead free solder bars and rising demand for semiconductor packaging and SMT assembly applications. In terms of type, the lead free solder bar segment is expected to grow at a higher CAGR than the lead solder bar segment during the forecast period. In terms of application, SMT assembly is expected to be one of the fastest-growing segments in the global solder bar market during 2018-2030.
Product Definition:
A solder bar is a metal bar that is used to join two pieces of metal together. The solder bar is heated until it is molten and then it is placed between the two pieces of metal. The solder will melt and join the two pieces of metal together.
Lead Free Solder Bar:
Lead free solder bar is a type of lead-free alloy which contains no more than 0.1% of lead. It has high electrical and thermal conductivity, low melting point, high corrosion resistance and excellent mechanical properties.
Lead Solder Bar:
Lead solder bar is made of high melting point lead-based alloy and it's main function is to melt the solder and attach the components during circuit assembling. It has a wide range of applications in electronic devices manufacturing such as mobile phones, computers, cameras, printers etc. Lead solder bars are widely used by electronics manufacturers due to its properties such as easy assembly with low mechanical stress on joints which makes it suitable for mass production.
Application Insights:
SMT assembly was the largest application segment in 2016 and is expected to continue its dominance over the forecast period. SMT assembly involves soldering of small components such as integrated circuits, resistors, capacitors and other passive components on a printed circuit board. The growth of this application can be attributed to increasing demand for high-density boards with low component count that require minimal space.
The semiconductor packaging segment is projected to witness significant growth over the forecast period owing to growing demand for packaged products in various industries including medical, industrial and consumer electronics among others. Semiconductor packaging includes several processes such as surface mount technology (SMT), through hole mounting technology (THM) among others that solder bars are used for during manufacturing process stages.
Regional Analysis:
Asia Pacific is expected to be the largest and fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for electronic products, such as smartphones and laptops, coupled with rising disposable income of consumers in developing countries including China and India. In addition, growing industrialization in this region will drive product demand further.
The Asia Pacific region accounted for a share of more than 30% in 2016 global revenue owing to its large population base along with high penetration of electronics manufacturing companies across China, Taiwan, South Korea, Japan among other Asian countries. Moreover North America also has a significant presence due to high level research being carried out by various national laboratories on advanced materials chemistry that are used for soldering applications is driving regional growth.
Growth Factors:
- Increasing demand from the electronics and semiconductor industry for advanced soldering technology.
- Growing popularity of lead-free solder bars due to environmental concerns over lead emissions.
- Rising demand for miniaturized electronic devices that require smaller and finer soldering points.
- Proliferation of smart technologies and the Internet of Things (IoT) that need reliable and high-quality solder connections.
Scope Of The Report
Report Attributes
Report Details
Report Title
Solder Bar Market Research Report
By Type
Lead Free Solder Bar, Lead Solder Bar
By Application
SMT Assembly, Semiconductor Packaging
By Companies
Alent (Alpha), Senju, Shenmao, Indium Corporation, Kester, Nihon Superior, AIM, INVENTEC, Tongfang Tech, Yong An
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
229
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Solder Bar Market Report Segments:
The global Solder Bar market is segmented on the basis of:
Types
Lead Free Solder Bar, Lead Solder Bar
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT Assembly, Semiconductor Packaging
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Alent (Alpha)
- Senju
- Shenmao
- Indium Corporation
- Kester
- Nihon Superior
- AIM
- INVENTEC
- Tongfang Tech
- Yong An
Highlights of The Solder Bar Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead Free Solder Bar
- Lead Solder Bar
- By Application:
- SMT Assembly
- Semiconductor Packaging
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Solder Bar Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A solder bar is a small, thin metal strip with a pointed end that is used to join two pieces of metal together. Solder bars are available in different sizes and shapes, and they are often sold in packs of ten or more.
Some of the key players operating in the solder bar market are Alent (Alpha), Senju, Shenmao, Indium Corporation, Kester, Nihon Superior, AIM, INVENTEC, Tongfang Tech, Yong An.
The solder bar market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Solder Bar Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Solder Bar Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Solder Bar Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Solder Bar Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Solder Bar Market Size & Forecast, 2018-2028
4.5.1 Solder Bar Market Size and Y-o-Y Growth
4.5.2 Solder Bar Market Absolute $ Opportunity
Chapter 5 Global Solder Bar Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Solder Bar Market Size Forecast by Type
5.2.1 Lead Free Solder Bar
5.2.2 Lead Solder Bar
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Solder Bar Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Solder Bar Market Size Forecast by Applications
6.2.1 SMT Assembly
6.2.2 Semiconductor Packaging
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Solder Bar Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Solder Bar Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Solder Bar Analysis and Forecast
9.1 Introduction
9.2 North America Solder Bar Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Solder Bar Market Size Forecast by Type
9.6.1 Lead Free Solder Bar
9.6.2 Lead Solder Bar
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Solder Bar Market Size Forecast by Applications
9.10.1 SMT Assembly
9.10.2 Semiconductor Packaging
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Solder Bar Analysis and Forecast
10.1 Introduction
10.2 Europe Solder Bar Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Solder Bar Market Size Forecast by Type
10.6.1 Lead Free Solder Bar
10.6.2 Lead Solder Bar
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Solder Bar Market Size Forecast by Applications
10.10.1 SMT Assembly
10.10.2 Semiconductor Packaging
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Solder Bar Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Solder Bar Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Solder Bar Market Size Forecast by Type
11.6.1 Lead Free Solder Bar
11.6.2 Lead Solder Bar
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Solder Bar Market Size Forecast by Applications
11.10.1 SMT Assembly
11.10.2 Semiconductor Packaging
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Solder Bar Analysis and Forecast
12.1 Introduction
12.2 Latin America Solder Bar Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Solder Bar Market Size Forecast by Type
12.6.1 Lead Free Solder Bar
12.6.2 Lead Solder Bar
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Solder Bar Market Size Forecast by Applications
12.10.1 SMT Assembly
12.10.2 Semiconductor Packaging
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Solder Bar Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Solder Bar Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Solder Bar Market Size Forecast by Type
13.6.1 Lead Free Solder Bar
13.6.2 Lead Solder Bar
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Solder Bar Market Size Forecast by Applications
13.10.1 SMT Assembly
13.10.2 Semiconductor Packaging
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Solder Bar Market: Competitive Dashboard
14.2 Global Solder Bar Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Alent (Alpha)
14.3.2 Senju
14.3.3 Shenmao
14.3.4 Indium Corporation
14.3.5 Kester
14.3.6 Nihon Superior
14.3.7 AIM
14.3.8 INVENTEC
14.3.9 Tongfang Tech
14.3.10 Yong An
