Market Overview:
The global thermally conductive encapsulants market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for thermally conductive encapsulants in electronics, avionics, automotive, LEDs and lighting, and other applications. In terms of type, the silicon type segment is expected to lead the global thermally conductive encapsulants market during the forecast period. This can be attributed to its high thermal conductivity and low thermal expansion coefficient. In terms of application, the electronics segment is expected to lead the global thermally conductive encapsulants market during the forecast period.
Product Definition:
Thermally conductive encapsulants are materials used to coat or fill the spaces between electronic components and PCBs in order to improve heat dissipation. By doing so, these materials help protect the components from damage caused by overheating and allow them to run at cooler temperatures, which can result in longer life spans and improved performance.
Silicon Type:
Silicon type is a majorly used element in the production of thermally conductive encapsulants. Thermally conductive encapsulants are widely used in semiconductor devices and electronic components to enable heat transfer from one side to the other without dissipating any energy as waste heat.
Epoxy Type:
Epoxy type is a thermosetting polymer and has high thermal stability. Epoxies are widely used in the encapsulation of electronic devices, which helps them to maintain their dimensional stability at elevated temperatures. Thermally conductive epoxy types have wide applications in electronics, automotive & transportation, aerospace & defense sectors.
The major factor driving the global thermally conductive encapsulants market is growing demand for electronic products such as smartphones.
Application Insights:
The electronics segment dominated the global thermally conductive encapsulants market in terms of revenue share in 2017. The growth can be attributed to the high demand for electronic devices, especially smartphones and laptops, across the globe. Thermally conductive materials are used as an alternative to solder masking on printed circuit boards (PCB) during manufacturing of electronic products such as mobile phones, tablets computers, etc. This application is expected to drive product demand over the forecast period.
The aerospace & defense segment accounted for a significant market share in 2017 owing to increasing use of thermoelectric materials that operate at low temperatures for controlling temperature inside aircraft engines and other systems such as heat shields on military aircraft or satellites.
Regional Analysis:
The market in North America was valued at USD X million in 2017 and is expected to grow at a significant rate over the forecast period owing to the presence of major aircraft manufacturers such as Boeing, Lockheed Martin, and Airbus S.A.S., which are actively manufacturing commercial aircraft with high demand across the globe.
In addition, increasing production levels of electric vehicles along with growing adoption by consumers due to benefits such as reduced weight & improved efficiency has led automotive manufacturers including Ford Motors Company; General Motors Company; Tesla Inc.
The Asia Pacific emerged as a prominent region in terms of technological advancements coupled with economic development taking place within emerging countries like China.
Growth Factors:
- Increasing demand for thermally conductive encapsulants from the electronics and semiconductor industries due to the miniaturization of electronic devices and the need for improved heat dissipation.
- Growing demand for thermally conductive encapsulants in LED lighting applications to improve heat dissipation and extend product life.
- Rising demand from the automotive industry for thermally conductive encapsulants to improve engine cooling and thermal management systems.
- Increasing use of thermally conductive encapsulants in solar energy applications to improve heat transfer rates between solar cells and substrates.
Scope Of The Report
Report Attributes
Report Details
Report Title
Thermally Conductive Encapsulants Market Research Report
By Type
Silicon Type, Epoxy Type
By Application
Electronics, Avionics, Automotive, LEDs and Lighting, Other
By Companies
ResinLab, ACC Silicone, Henkel, Momentive, LORD, Dow, Electrolube, Shin-Etsu
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
243
Number of Tables & Figures
171
Customization Available
Yes, the report can be customized as per your need.
Global Thermally Conductive Encapsulants Market Report Segments:
The global Thermally Conductive Encapsulants market is segmented on the basis of:
Types
Silicon Type, Epoxy Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronics, Avionics, Automotive, LEDs and Lighting, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ResinLab
- ACC Silicone
- Henkel
- Momentive
- LORD
- Dow
- Electrolube
- Shin-Etsu
Highlights of The Thermally Conductive Encapsulants Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Silicon Type
- Epoxy Type
- By Application:
- Electronics
- Avionics
- Automotive
- LEDs and Lighting
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thermally Conductive Encapsulants Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thermally conductive encapsulants are materials that allow heat to flow through them more easily than other materials. This makes them useful in applications where heat is a major concern, such as electronics and automotive parts.
Some of the major players in the thermally conductive encapsulants market are ResinLab, ACC Silicone, Henkel, Momentive, LORD, Dow, Electrolube, Shin-Etsu.
The thermally conductive encapsulants market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Thermally Conductive Encapsulants Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Thermally Conductive Encapsulants Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Thermally Conductive Encapsulants Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Thermally Conductive Encapsulants Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Thermally Conductive Encapsulants Market Size & Forecast, 2020-2028
4.5.1 Thermally Conductive Encapsulants Market Size and Y-o-Y Growth
4.5.2 Thermally Conductive Encapsulants Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Silicon Type
5.2.2 Epoxy Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Electronics
6.2.2 Avionics
6.2.3 Automotive
6.2.4 LEDs and Lighting
6.2.5 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Thermally Conductive Encapsulants Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Thermally Conductive Encapsulants Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Silicon Type
9.6.2 Epoxy Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Electronics
9.10.2 Avionics
9.10.3 Automotive
9.10.4 LEDs and Lighting
9.10.5 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Silicon Type
10.6.2 Epoxy Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Electronics
10.10.2 Avionics
10.10.3 Automotive
10.10.4 LEDs and Lighting
10.10.5 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Silicon Type
11.6.2 Epoxy Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Electronics
11.10.2 Avionics
11.10.3 Automotive
11.10.4 LEDs and Lighting
11.10.5 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Silicon Type
12.6.2 Epoxy Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Electronics
12.10.2 Avionics
12.10.3 Automotive
12.10.4 LEDs and Lighting
12.10.5 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Silicon Type
13.6.2 Epoxy Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Electronics
13.10.2 Avionics
13.10.3 Automotive
13.10.4 LEDs and Lighting
13.10.5 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Thermally Conductive Encapsulants Market: Competitive Dashboard
14.2 Global Thermally Conductive Encapsulants Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ResinLab
14.3.2 ACC Silicone
14.3.3 Henkel
14.3.4 Momentive
14.3.5 LORD
14.3.6 Dow
14.3.7 Electrolube
14.3.8 Shin-Etsu
