Market Overview:
Thin wafer market is expected to witness a CAGR of 6.5% during the forecast period 2018-2030. The thin wafer market is segmented on the basis of type, application and region. On the basis of type, the thin wafer market is segmented into 125mm, 200mm and 300mm. On the basis of application, MEMS (Micro-Electro Mechanical Systems), CMOS Image Sensors (Complementary Metal Oxide Semiconductor image sensors), Memory Devices, RF Devices (Radio Frequency devices), LEDs (Light emitting diodes) are some of the key applications in which thin wafers are used extensively. Thin Wafers are also used as interposers and logic devices in various electronic applications.
Product Definition:
A thin wafer is a semiconductor device that is made of a thin slice of silicon. Thin wafers are used in the manufacture of semiconductor devices, such as microchips and solar cells.
125mm:
125mm is the most widely used wafer size and it has a major impact on thin wafer market. 125mm is also known as sub-micron or ultra-thin wafers, which are used in numerous applications such as MEMS (Micro Electro Mechanical System) devices, RFID (Radio Frequency Identification), sensors, etc.
200mm:
200mm is the new term in Thin Wafer market which refers to the thickness of wafers used for semiconductor devices. The 200mm wafer is a double layer of silicon nitride, which has an overall thickness of about 200 mm and a single crystal face on both sides. It was developed by IBM as one among many options for their chip making process back in 2000. Since then this technology has been commercialized by various other companies including Fujitsu Ltd., Samsung Electronics Co.
Application Insights:
The market is segmented by application into MEMS, CMOS image sensors, memory, RF devices, LEDs and interposers. The MEMS segment held the largest share of over 30% in 2017. This large share was attributable to the high usage of thin wafers in various types of mobile devices such as smartphones and tablets. In addition, a significant amount is invested by companies for research & development activities pertaining to new product launches for advanced Thin Wafer products with enhanced features and specifications.
Memory application is anticipated to grow at a CAGR exceeding 11% from 2018 to 2030 owing to increasing demand from various end-use industries including data storage units (NAS), enterprise storage (SAN) and cloud computing services providers that require higher density chipsets for their infrastructure operations. Furthermore, technological advancements coupled with increased production are expected to result in rising demand during the forecast period which would propel growth further over the coming years.
Regional Analysis:
Asia Pacific dominated the global thin wafer market in 2017 and is expected to continue its dominance over the forecast period. The growth of the regional market can be attributed to various factors such as low labor costs, high population density, availability of raw materials at cheaper rates, and rapid development in manufacturing capabilities.
The demand for semiconductors in Europe is anticipated to witness significant growth over the coming years owing to increasing investments by companies in R&D activities along with rising adoption of advanced technologies across several sectors including automotive, consumer electronics among others. This trend is projected to drive industry expansion over this region during the forecast period.
North America accounted for a share of more than 20% within overall industry volume due to growing product demand from end-use industries such as aerospace & defense (AD), automotive & transportation (Trucking), healthcare (Diagnostics) among others which are characterized by critical applications requiring superior performance characteristics offered by semiconductor devices.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of USD 333.8 billion by 2020. This growth can be attributed to the increasing demand for semiconductor devices across various applications such as consumer electronics, automotive, industrial and medical sectors.
- Rising demand for miniaturized and energy-efficient devices: With the growing trend of miniaturization and increased focus on energy efficiency, there is an increased demand for thin wafers that offer high performance-to-power ratio and low thermal resistance. Thin wafers are well suited for these requirements as they are thinner than traditional wafers and have higher electrical performance due to their smaller size.
- Growing popularity of advanced packaging technologies: Advanced packaging technologies such as 3D stacking require thinned wafers with reduced thickness variation in order to achieve high yields and reliability during manufacturing processes. As a result, the adoption of advanced packaging technologies is driving the demand for thinned wafers in the market .
Scope Of The Report
Report Attributes
Report Details
Report Title
Thin Wafer Market Research Report
By Type
125mm, 200mm, 300mm
By Application
MEMS, CMOS Image Sensors, Memory, RF Devices, LEDs, Interposers, Logic
By Companies
LG Siltronic, Shin-Etsu Chemical, Siltronic AG, SUMCO Corporation, SunEdision Semiconductor, SUSS MicroTec AG, Lintec Corporation, DISCO Corporation, 3M, Applied Materials, Nissan Chemical Corporation, Synova, EV Group, Brewer Science, Ulvac
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
139
Number of Tables & Figures
98
Customization Available
Yes, the report can be customized as per your need.
Global Thin Wafer Market Report Segments:
The global Thin Wafer market is segmented on the basis of:
Types
125mm, 200mm, 300mm
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
MEMS, CMOS Image Sensors, Memory, RF Devices, LEDs, Interposers, Logic
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- LG Siltronic
- Shin-Etsu Chemical
- Siltronic AG
- SUMCO Corporation
- SunEdision Semiconductor
- SUSS MicroTec AG
- Lintec Corporation
- DISCO Corporation
- 3M
- Applied Materials
- Nissan Chemical Corporation
- Synova
- EV Group
- Brewer Science
- Ulvac
Highlights of The Thin Wafer Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 125mm
- 200mm
- 300mm
- By Application:
- MEMS
- CMOS Image Sensors
- Memory
- RF Devices
- LEDs
- Interposers
- Logic
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thin Wafer Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thin Wafer is a type of semiconductor material that has been developed to be used in electronic devices. Thin Wafers are made from materials such as silicon and germanium, and they are very thin, which makes them ideal for use in electronic devices. Thin Wafers can be used to create computer chips, displays, and other components.
Some of the key players operating in the thin wafer market are LG Siltronic, Shin-Etsu Chemical, Siltronic AG, SUMCO Corporation, SunEdision Semiconductor, SUSS MicroTec AG, Lintec Corporation, DISCO Corporation, 3M, Applied Materials, Nissan Chemical Corporation, Synova, EV Group, Brewer Science, Ulvac.
The thin wafer market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Thin Wafer Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Thin Wafer Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Thin Wafer Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Thin Wafer Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Thin Wafer Market Size & Forecast, 2018-2028
4.5.1 Thin Wafer Market Size and Y-o-Y Growth
4.5.2 Thin Wafer Market Absolute $ Opportunity
Chapter 5 Global Thin Wafer Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Thin Wafer Market Size Forecast by Type
5.2.1 125mm
5.2.2 200mm
5.2.3 300mm
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Thin Wafer Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Thin Wafer Market Size Forecast by Applications
6.2.1 MEMS
6.2.2 CMOS Image Sensors
6.2.3 Memory
6.2.4 RF Devices
6.2.5 LEDs
6.2.6 Interposers
6.2.7 Logic
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Thin Wafer Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Thin Wafer Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Thin Wafer Analysis and Forecast
9.1 Introduction
9.2 North America Thin Wafer Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Thin Wafer Market Size Forecast by Type
9.6.1 125mm
9.6.2 200mm
9.6.3 300mm
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Thin Wafer Market Size Forecast by Applications
9.10.1 MEMS
9.10.2 CMOS Image Sensors
9.10.3 Memory
9.10.4 RF Devices
9.10.5 LEDs
9.10.6 Interposers
9.10.7 Logic
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Thin Wafer Analysis and Forecast
10.1 Introduction
10.2 Europe Thin Wafer Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Thin Wafer Market Size Forecast by Type
10.6.1 125mm
10.6.2 200mm
10.6.3 300mm
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Thin Wafer Market Size Forecast by Applications
10.10.1 MEMS
10.10.2 CMOS Image Sensors
10.10.3 Memory
10.10.4 RF Devices
10.10.5 LEDs
10.10.6 Interposers
10.10.7 Logic
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Thin Wafer Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Thin Wafer Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Thin Wafer Market Size Forecast by Type
11.6.1 125mm
11.6.2 200mm
11.6.3 300mm
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Thin Wafer Market Size Forecast by Applications
11.10.1 MEMS
11.10.2 CMOS Image Sensors
11.10.3 Memory
11.10.4 RF Devices
11.10.5 LEDs
11.10.6 Interposers
11.10.7 Logic
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Thin Wafer Analysis and Forecast
12.1 Introduction
12.2 Latin America Thin Wafer Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Thin Wafer Market Size Forecast by Type
12.6.1 125mm
12.6.2 200mm
12.6.3 300mm
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Thin Wafer Market Size Forecast by Applications
12.10.1 MEMS
12.10.2 CMOS Image Sensors
12.10.3 Memory
12.10.4 RF Devices
12.10.5 LEDs
12.10.6 Interposers
12.10.7 Logic
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Thin Wafer Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Thin Wafer Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Thin Wafer Market Size Forecast by Type
13.6.1 125mm
13.6.2 200mm
13.6.3 300mm
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Thin Wafer Market Size Forecast by Applications
13.10.1 MEMS
13.10.2 CMOS Image Sensors
13.10.3 Memory
13.10.4 RF Devices
13.10.5 LEDs
13.10.6 Interposers
13.10.7 Logic
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Thin Wafer Market: Competitive Dashboard
14.2 Global Thin Wafer Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 LG Siltronic
14.3.2 Shin-Etsu Chemical
14.3.3 Siltronic AG
14.3.4 SUMCO Corporation
14.3.5 SunEdision Semiconductor
14.3.6 SUSS MicroTec AG
14.3.7 Lintec Corporation
14.3.8 DISCO Corporation
14.3.9 3M
14.3.10 Applied Materials
14.3.11 Nissan Chemical Corporation
14.3.12 Synova
14.3.13 EV Group
14.3.14 Brewer Science
14.3.15 Ulvac
