Market Overview:
The global wafer back grinding tapes market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and miniaturization of electronic devices. In addition, the growing demand for advanced packaging solutions is also contributing to the growth of this market. The global wafer back grinding tapes market can be segmented on the basis of type, application, and region. On the basis of type, it can be divided into UV type and non-UV type. The UV type segment is expected to grow at a higher CAGR than that of non-UV type during the forecast period from 2018 to 2030 owing to its superior properties such as high adhesion strength and chemical resistance as compared with other types available in the market. On the basis of application, it can be classified into standard, standard thin die (S)DBG(GAL), bumping etc., Among these applications, standard accounts for a major share in terms of revenue contribution followed by S)DBG(GAL).
Product Definition:
Wafer back grinding tapes are used to precisely grind the back side of semiconductor wafers. This is important because it ensures that the wafer is flat and that the electrical connections on the back side are smooth and consistent.
UV Type:
UV (Ultraviolet) type is a category of wafer back grinding tapes, which are used for the reduction of high-aspect-ratio wafers in the semiconductor industry. The product has features such as low heat generation and low coefficient of friction, which make it an ideal choice for material handling applications.
The global market size was valued at USD 1.5 billion in 2016.
Non-UV Type:
Non-UV type is used in the wafer back grinding tapes market. Wafer back grinding is a special process applied to microelectronic wafers before they are encapsulated, wherein the surface of the wafer is ground down to a very fine and smooth layer. The purpose of this step is to ensure that there are no sharp edges on the surface of the semiconductor, which can cause damage during UV curing process.
Application Insights:
The standard application segment held the largest share of over 60.0% in 2017. The segment is anticipated to witness significant growth on account of increasing demand for semiconductors from various end-use industries including telecommunication, consumer electronics, and automotive. Furthermore, growing investments by companies in R&D to develop new products and technological innovations is expected to propel the product demand over the forecast period.
The (S)DBG(GAL) application segment accounted for a considerable market share in terms of revenue as well as volume in 2017 owing to its high yield efficiency coupled with low grinding pressure requirements which resultantly reduces manufacturing costs leading to increased profitability margins for manufacturers across the globe. In addition, these tapes are used with multiple backing materials such as glass fiber reinforced plastic (GFRP), metal wire mesh (MWM), ceramic powder particles etc., resulting into higher product versatility which further propels its demand worldwide.
Regional Analysis:
North America dominated the global market in 2017 owing to the presence of major players and increased adoption of backgrinding machines. The region is expected to witness moderate growth over the forecast period, which can be attributed to a decline in wafer processing demand. Asia Pacific is projected to grow at a lucrative rate over the forecast period due to increasing foreign investments and favorable government policies for manufacturing semiconductor devices on a large scale. Moreover, rising labor costs in North America are anticipated to result in reduced production volumes, thereby impacting regional revenue generation positively.
The European market was valued at USD X million as of 2017 and is expected witness steady growth during the forecast years on account of high product demand from microelectronics industry mainly Germany, France and Italy along with other Eastern European countries such as Bulgaria & Romania & Croatia & FYROM (former Yugoslav Republic Of Macedonia).
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of USD 333.8 billion by 2020. This is driven by the increasing demand for miniaturized and more powerful electronic devices across all end-use segments.
- Rising demand for advanced packaging solutions: The need for smaller, faster, and more power-efficient semiconductor devices is driving the adoption of advanced packaging solutions such as wafer back grinding tapes. These tapes offer superior performance in terms of thickness profile control, flatness accuracy, and surface finish compared to other packaging technologies such as die attach films (DAFs) and wire bonding pads/balls.
- Growing popularity of 3D ICs: 3D ICs are gaining popularity due to their ability to improve performance while reducing package size and cost. They are also being increasingly used in high-end applications such as smartphones, tablets, gaming consoles, automotive electronics, etc., where miniaturization and improved thermal management are critical requirements..
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Back Grinding Tapes Market Research Report
By Type
UV Type, Non-UV Type
By Application
Standard, Standard Thin Die, (S)DBG(GAL), Bump
By Companies
Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology, Force-One Applied Materials, AMC Co, Ltd, Pantech Tape Co., Ltd
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
131
Number of Tables & Figures
92
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Back Grinding Tapes Market Report Segments:
The global Wafer Back Grinding Tapes market is segmented on the basis of:
Types
UV Type, Non-UV Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Standard, Standard Thin Die, (S)DBG(GAL), Bump
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Mitsui Chemicals Tohcello
- Nitto
- LINTEC
- Furukawa Electric
- Denka
- D&X
- AI Technology
- Force-One Applied Materials
- AMC Co, Ltd
- Pantech Tape Co., Ltd
Highlights of The Wafer Back Grinding Tapes Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- UV Type
- Non-UV Type
- By Application:
- Standard
- Standard Thin Die
- (S)DBG(GAL)
- Bump
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Back Grinding Tapes Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer back grinding tapes are a type of abrasive paper tape used for grinding and polishing. They are made from a special paper that is coated on one side with fine abrasives. The other side is smooth, so the tape can be easily applied to the workpiece and removed without leaving any residue.
Some of the key players operating in the wafer back grinding tapes market are Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology, Force-One Applied Materials, AMC Co, Ltd, Pantech Tape Co., Ltd.
The wafer back grinding tapes market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Back Grinding Tapes Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Back Grinding Tapes Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Back Grinding Tapes Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Back Grinding Tapes Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Back Grinding Tapes Market Size & Forecast, 2020-2028
4.5.1 Wafer Back Grinding Tapes Market Size and Y-o-Y Growth
4.5.2 Wafer Back Grinding Tapes Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 UV Type
5.2.2 Non-UV Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Standard
6.2.2 Standard Thin Die
6.2.3 (S)DBG(GAL)
6.2.4 Bump
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Back Grinding Tapes Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Back Grinding Tapes Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 UV Type
9.6.2 Non-UV Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Standard
9.10.2 Standard Thin Die
9.10.3 (S)DBG(GAL)
9.10.4 Bump
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 UV Type
10.6.2 Non-UV Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Standard
10.10.2 Standard Thin Die
10.10.3 (S)DBG(GAL)
10.10.4 Bump
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 UV Type
11.6.2 Non-UV Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Standard
11.10.2 Standard Thin Die
11.10.3 (S)DBG(GAL)
11.10.4 Bump
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 UV Type
12.6.2 Non-UV Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Standard
12.10.2 Standard Thin Die
12.10.3 (S)DBG(GAL)
12.10.4 Bump
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 UV Type
13.6.2 Non-UV Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Standard
13.10.2 Standard Thin Die
13.10.3 (S)DBG(GAL)
13.10.4 Bump
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Back Grinding Tapes Market: Competitive Dashboard
14.2 Global Wafer Back Grinding Tapes Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Mitsui Chemicals Tohcello
14.3.2 Nitto
14.3.3 LINTEC
14.3.4 Furukawa Electric
14.3.5 Denka
14.3.6 D&X
14.3.7 AI Technology
14.3.8 Force-One Applied Materials
14.3.9 AMC Co, Ltd
14.3.10 Pantech Tape Co., Ltd
