The global semiconductor bonding machine market is expected to grow at a CAGR of 5.5% during the forecast period, from 2021 to 2030. The growth of this market is attributed to the increasing demand for semiconductors in various industries such as automotive, aerospace and defense, and consumer electronics. The increasing demand for semiconductors in these industries has led to an increase in the number of manufacturing facilities that are being set up globally. This has resulted in an increased need for bonding machines which are used by manufacturers to assemble these devices.
The wire bonder segment accounted for the largest share of this market during 2018 with a share of over 50%. This can be attributed to its low cost and ease-of-use when compared with other types of bonding machines such as die bonders or wire bonders. Wire bonders are also preferred by IDMs due their ability to handle high volumes efficiently without compromising on quality or reliability.
Some Of The Growth Factors Of This Market:
- The semiconductor industry is one of the fastest growing industries in the world.
- The increasing number of electronic devices and their increasing complexity are driving the need for more sophisticated manufacturing equipment such as semiconductor bonding machines, which will also drive growth in this market during the forecast period.
- Increasing investments by governments and private companies into research and development activities related to semiconductors will also fuel growth in this market during the forecast period.
- Increasing adoption of new technologies such as IoT (Internet of Things) and AI (Artificial Intelligence) are expected to drive growth in this market during the forecast period.
Industry Growth Insights published a new data on “Semiconductor Bonding Machine Market”. The research report is titled “Semiconductor Bonding Machine Market research by Types (Wire Bonder, Die Bonder), By Applications (Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSATs)), By Players/Companies Besi, ASM Pacific Technology, Kulicke& Soffa, Palomar Technologies, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, Panasonic, FASFORD TECHNOLOGY, West-Bond”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Bonding Machine Market Research Report
By Type
Wire Bonder, Die Bonder
By Application
Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSATs)
By Companies
Besi, ASM Pacific Technology, Kulicke& Soffa, Palomar Technologies, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, Panasonic, FASFORD TECHNOLOGY, West-Bond
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
245
Number of Tables & Figures
172
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Bonding Machine Market Report Segments:
The global Semiconductor Bonding Machine market is segmented on the basis of:
Types
Wire Bonder, Die Bonder
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSATs)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Besi
- ASM Pacific Technology
- Kulicke& Soffa
- Palomar Technologies
- DIAS Automation
- F&K Delvotec Bondtechnik
- Hesse
- Hybond
- SHINKAWA Electric
- Toray Engineering
- Panasonic
- FASFORD TECHNOLOGY
- West-Bond
Highlights of The Semiconductor Bonding Machine Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Wire Bonder
- Die Bonder
- By Application:
- Integrated Device Manufacturer (IDMs)
- Outsourced Semiconductor Assembly and Test (OSATs)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Bonding Machine Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A semiconductor bonding machine is a device used to bond semiconductor materials together.
Some of the major companies in the semiconductor bonding machine market are Besi, ASM Pacific Technology, Kulicke& Soffa, Palomar Technologies, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, Panasonic, FASFORD TECHNOLOGY, West-Bond.
The semiconductor bonding machine market is expected to register a CAGR of 5.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Bonding Machine Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Bonding Machine Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Bonding Machine Market - Supply Chain
4.5. Global Semiconductor Bonding Machine Market Forecast
4.5.1. Semiconductor Bonding Machine Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Bonding Machine Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Bonding Machine Market Absolute $ Opportunity
5. Global Semiconductor Bonding Machine Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Bonding Machine Market Size and Volume Forecast by Type
5.3.1. Wire Bonder
5.3.2. Die Bonder
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Bonding Machine Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Bonding Machine Market Size and Volume Forecast by Application
6.3.1. Integrated Device Manufacturer (IDMs)
6.3.2. Outsourced Semiconductor Assembly and Test (OSATs)
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Bonding Machine Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Bonding Machine Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Bonding Machine Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Bonding Machine Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Bonding Machine Demand Share Forecast, 2019-2026
9. North America Semiconductor Bonding Machine Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Bonding Machine Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Bonding Machine Market Size and Volume Forecast by Application
9.4.1. Integrated Device Manufacturer (IDMs)
9.4.2. Outsourced Semiconductor Assembly and Test (OSATs)
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Bonding Machine Market Size and Volume Forecast by Type
9.7.1. Wire Bonder
9.7.2. Die Bonder
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Bonding Machine Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Bonding Machine Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Bonding Machine Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Bonding Machine Market Size and Volume Forecast by Application
10.4.1. Integrated Device Manufacturer (IDMs)
10.4.2. Outsourced Semiconductor Assembly and Test (OSATs)
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Bonding Machine Market Size and Volume Forecast by Type
10.7.1. Wire Bonder
10.7.2. Die Bonder
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Bonding Machine Demand Share Forecast, 2019-2026
11. Europe Semiconductor Bonding Machine Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Bonding Machine Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Bonding Machine Market Size and Volume Forecast by Application
11.4.1. Integrated Device Manufacturer (IDMs)
11.4.2. Outsourced Semiconductor Assembly and Test (OSATs)
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Bonding Machine Market Size and Volume Forecast by Type
11.7.1. Wire Bonder
11.7.2. Die Bonder
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Bonding Machine Demand Share, 2019-2026
12. Asia Pacific Semiconductor Bonding Machine Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Bonding Machine Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Bonding Machine Market Size and Volume Forecast by Application
12.4.1. Integrated Device Manufacturer (IDMs)
12.4.2. Outsourced Semiconductor Assembly and Test (OSATs)
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Bonding Machine Market Size and Volume Forecast by Type
12.7.1. Wire Bonder
12.7.2. Die Bonder
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Bonding Machine Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Bonding Machine Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Bonding Machine Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Bonding Machine Market Size and Volume Forecast by Application
13.4.1. Integrated Device Manufacturer (IDMs)
13.4.2. Outsourced Semiconductor Assembly and Test (OSATs)
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Bonding Machine Market Size and Volume Forecast by Type
13.7.1. Wire Bonder
13.7.2. Die Bonder
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Bonding Machine Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Bonding Machine Market: Market Share Analysis
14.2. Semiconductor Bonding Machine Distributors and Customers
14.3. Semiconductor Bonding Machine Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. Besi
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. ASM Pacific Technology
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Kulicke& Soffa
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. Palomar Technologies
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. DIAS Automation
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. F&K Delvotec Bondtechnik
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Hesse
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. Hybond
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. SHINKAWA Electric
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. Toray Engineering
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. Panasonic
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. FASFORD TECHNOLOGY
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. West-Bond
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
