Market Overview:
The global memory packaging market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced memory solutions, especially in consumer electronics and automotive applications. In terms of type, the flip-chip segment is expected to lead the global memory packaging market during the forecast period, followed by through-silicon via (TSV) and lead-frame segments. The TSV segment is projected to grow at a high CAGR during the forecast period owing to its advantages such as higher performance and lower power consumption as compared to other types of memory packaging technologies.
Product Definition:
A memory packaging technology is a technique used to improve the performance of integrated circuits by increasing the density of memory elements within a given area. Memory packaging technologies include three-dimensional stacking, through-silicon vias (TSVs), and embedded dielectrics. These technologies allow for more efficient use of both space and power, resulting in smaller, faster, and more energy-efficient integrated circuits.
Flip-chip:
Flip-chip technology is used to transfer information in the form of electric signals between two substrates or between a semiconductor and an electrical device. Flip-chip devices are increasingly being used in memory packaging applications owing to their small size, low power consumption, and high speed.
Lead-frame:
The lead-frame is a metal or plastic protective shield that is placed between the front of the package and the backside of integrated circuits. It helps in preventing damage to sensitive components due to electrostatic discharge (ESD), electromagnetic interference (EMI) and high-temperature conditions. The lead frame also provides mechanical strength, thermal stability, moisture resistance along with electrical insulation to memory devices.
Application Insights:
The telecom segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% from 2018 to 2030. The memory packaging solutions are witnessing growing adoption in the telecom industry owing to its critical applications, such as signal processing, machine learning and data center storage. Moreover, increasing demand for high-speed data transfer across various applications is further driving the growth of this segment.
The consumer electronics application segment was valued over USD 1 billion in 2017 and is expected to reach nearly USD 6 billion by 2030 driven by rising demand for digital devices across various end-use industries including automotive, healthcare and aerospace & defense among others.
Regional Analysis:
Asia Pacific regional market accounted for the largest share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand from China, Japan, South Korea, and India. Flip-chip packaging has been gaining significant traction in this region owing to its advantages such as low cost of production along with high efficiency and reliability.
The Asia Pacific memory industry is anticipated to witness a CAGR of XX% over the next eight years owing to rapid development in consumer electronics products on account of rising disposable income coupled with growing adoption of smartphones & tablets across various industries including healthcare, automotive & transportation among others. Furthermore, favorable government policies promoting domestic manufacturing are expected drive regional growth during the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of big data and the need for high-performance storage solutions
- Growing trend of cloud-based storage services
- Emergence of new memory technologies, such as 3D XPoint and MRAM
- Rising demand from the automotive industry
Scope Of The Report
Report Attributes
Report Details
Report Title
Memory Packaging Market Research Report
By Type
Flip-chip, Lead-frame, Through-Silicon Via, Others
By Application
Telecom, Consumer Electronics, Automotive, Embedded Systems, Others
By Companies
Hana Micron, FATC, ASE Group, Amkor Technology, Powertech Technology, ChipMOS Technologies, Signetics, KYEC, JCET, Tianshui Huatian Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
139
Number of Tables & Figures
98
Customization Available
Yes, the report can be customized as per your need.
Global Memory Packaging Market Report Segments:
The global Memory Packaging market is segmented on the basis of:
Types
Flip-chip, Lead-frame, Through-Silicon Via, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Telecom, Consumer Electronics, Automotive, Embedded Systems, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Hana Micron
- FATC
- ASE Group
- Amkor Technology
- Powertech Technology
- ChipMOS Technologies
- Signetics
- KYEC
- JCET
- Tianshui Huatian Technology
Highlights of The Memory Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Flip-chip
- Lead-frame
- Through-Silicon Via
- Others
- By Application:
- Telecom
- Consumer Electronics
- Automotive
- Embedded Systems
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Memory Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Memory packaging is a way to organize and manage the memory of an application. It can be used to improve performance, reduce memory usage, and make it easier to troubleshoot problems.
Some of the key players operating in the memory packaging market are Hana Micron, FATC, ASE Group, Amkor Technology, Powertech Technology, ChipMOS Technologies, Signetics, KYEC, JCET, Tianshui Huatian Technology.
The memory packaging market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Memory Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Memory Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Memory Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Memory Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Memory Packaging Market Size & Forecast, 2018-2028
4.5.1 Memory Packaging Market Size and Y-o-Y Growth
4.5.2 Memory Packaging Market Absolute $ Opportunity
Chapter 5 Global Memory Packaging Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Memory Packaging Market Size Forecast by Type
5.2.1 Flip-chip
5.2.2 Lead-frame
5.2.3 Through-Silicon Via
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Memory Packaging Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Memory Packaging Market Size Forecast by Applications
6.2.1 Telecom
6.2.2 Consumer Electronics
6.2.3 Automotive
6.2.4 Embedded Systems
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Memory Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Memory Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Memory Packaging Analysis and Forecast
9.1 Introduction
9.2 North America Memory Packaging Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Memory Packaging Market Size Forecast by Type
9.6.1 Flip-chip
9.6.2 Lead-frame
9.6.3 Through-Silicon Via
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Memory Packaging Market Size Forecast by Applications
9.10.1 Telecom
9.10.2 Consumer Electronics
9.10.3 Automotive
9.10.4 Embedded Systems
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Memory Packaging Analysis and Forecast
10.1 Introduction
10.2 Europe Memory Packaging Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Memory Packaging Market Size Forecast by Type
10.6.1 Flip-chip
10.6.2 Lead-frame
10.6.3 Through-Silicon Via
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Memory Packaging Market Size Forecast by Applications
10.10.1 Telecom
10.10.2 Consumer Electronics
10.10.3 Automotive
10.10.4 Embedded Systems
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Memory Packaging Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Memory Packaging Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Memory Packaging Market Size Forecast by Type
11.6.1 Flip-chip
11.6.2 Lead-frame
11.6.3 Through-Silicon Via
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Memory Packaging Market Size Forecast by Applications
11.10.1 Telecom
11.10.2 Consumer Electronics
11.10.3 Automotive
11.10.4 Embedded Systems
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Memory Packaging Analysis and Forecast
12.1 Introduction
12.2 Latin America Memory Packaging Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Memory Packaging Market Size Forecast by Type
12.6.1 Flip-chip
12.6.2 Lead-frame
12.6.3 Through-Silicon Via
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Memory Packaging Market Size Forecast by Applications
12.10.1 Telecom
12.10.2 Consumer Electronics
12.10.3 Automotive
12.10.4 Embedded Systems
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Memory Packaging Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Memory Packaging Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Memory Packaging Market Size Forecast by Type
13.6.1 Flip-chip
13.6.2 Lead-frame
13.6.3 Through-Silicon Via
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Memory Packaging Market Size Forecast by Applications
13.10.1 Telecom
13.10.2 Consumer Electronics
13.10.3 Automotive
13.10.4 Embedded Systems
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Memory Packaging Market: Competitive Dashboard
14.2 Global Memory Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Hana Micron
14.3.2 FATC
14.3.3 ASE Group
14.3.4 Amkor Technology
14.3.5 Powertech Technology
14.3.6 ChipMOS Technologies
14.3.7 Signetics
14.3.8 KYEC
14.3.9 JCET
14.3.10 Tianshui Huatian Technology
