Market Overview:
The global semiconductor package substrates market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor packages in mobile devices and automotive industry. In terms of type, the MCP/UTCSP segment is expected to hold the largest share in the global semiconductor package substrates market during the forecast period. This can be attributed to its high demand from mobile devices and automotive industry applications.
Product Definition:
A semiconductor package substrate is a low-cost, thin, planar material used to encapsulate and protect integrated circuits (ICs) and other electronic components. The substrate provides electrical insulation between the IC and the environment, mechanical support for the device, and a means of connecting to external circuitry.
MCP/UTCSP:
MCP/UTCSP is a new process developed by Mitsubishi Chemical for manufacturing semiconductor substrates on flexible plastic films. The technology has been commercialized under the name of MCP (Micro-Chamber Plating/Time-Cure Plating) or UTCSP (Ultraviolet Time-Cure Solid Phase). It uses an innovative microchamber technique to deposit metal on the film at high speed and with high accuracy.
FC-CSP:
FC-CSP is a flow cytometry based cell sorting technology that has wide applications in the semiconductor industry. It is used for selecting and isolating single cells from large populations of mixed cells by their surface markers. FC-CSP facilitates high throughput analysis, which helps in monitoring cell behavior during the manufacturing process as well as improves yield by avoiding contamination due to misfolded or aggregated proteins present in the sample.
Application Insights:
The mobile devices segment accounted for the largest revenue share in 2016 and is projected to continue its dominance over the forecast period. The growth of this application segment can be attributed to increasing demand for smartphones across the globe. Increasing use of semiconductor packages in mobile devices, especially smartphones, has resulted in increased demand for substrates such as PCBs and backplanes. Furthermore, rising demand from other application segments such as consumer electronics is expected to fuel industry expansion over the next eight years.
The automotive industry accounted for a significant revenue share owing to growing usage of electronic components that are mounted on circuit boards using plastic or metal substrates that offer thermal resistance and durability required in this industry. Growing adoption of MCP/UTCSP package substrate by major players such as Continental AG., Daimler AG., Ford Motor Company LLC., General Motors Company LLC., Mitsubishi Electric Corporation, Nissan Motor Co Ltd.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to rising demand for mobile devices, rapid industrialization, and increasing investments in R&D. China is estimated to remain a key player in this industry owing to its large population base and well-established electronics manufacturing sector.
The North American regional market accounted for over 20% of the revenue share in 2017 on account of high consumer awareness regarding technological advancements coupled with an increase in disposable income levels that are enabling people to opt for premium products with enhanced features at competitive prices. Moreover, growing penetration of M2M (machine-to-machine) communication systems across numerous industries including automotive, energy management, healthcare & life sciences will further drive product demand across this region during the forecast period.
Growth Factors:
- Increasing demand for semiconductor package substrates from the consumer electronics sector
- Growing demand for miniaturized and high-performance semiconductor packages
- Proliferation of next-generation technologies, such as 3D ICs and FinFETs, which require advanced packaging solutions
- Rising number of fabless companies that are outsourcing their packaging needs to contract manufacturers
- Emergence of new materials and processes that can improve the performance and reliability of semiconductor packages
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Package Substrates Market Research Report
By Type
MCP/UTCSP, FC-CSP, SiP, PBGA/CSP, BOC, FMC, Automotive Substrate
By Application
Mobile Devices, Automotive Industry, Others
By Companies
SIMMTECH, KYOCERA, Eastern, LG Innotek, Samsung Electro-Mechanics, Daeduck, Unimicron, ASE Group, TTM Technologies
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
235
Number of Tables & Figures
165
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Package Substrates Market Report Segments:
The global Semiconductor Package Substrates market is segmented on the basis of:
Types
MCP/UTCSP, FC-CSP, SiP, PBGA/CSP, BOC, FMC, Automotive Substrate
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Mobile Devices, Automotive Industry, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- SIMMTECH
- KYOCERA
- Eastern
- LG Innotek
- Samsung Electro-Mechanics
- Daeduck
- Unimicron
- ASE Group
- TTM Technologies
Highlights of The Semiconductor Package Substrates Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- MCP/UTCSP
- FC-CSP
- SiP
- PBGA/CSP
- BOC
- FMC
- Automotive Substrate
- By Application:
- Mobile Devices
- Automotive Industry
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Package Substrates Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor package substrates are the materials that make up the exterior of a semiconductor chip. They can be made from a variety of materials, including plastic, metal, and glass.
Some of the key players operating in the semiconductor package substrates market are SIMMTECH, KYOCERA, Eastern, LG Innotek, Samsung Electro-Mechanics, Daeduck, Unimicron, ASE Group, TTM Technologies.
The semiconductor package substrates market is expected to register a CAGR of 6.5%.
1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Semiconductor Package Substrates Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Semiconductor Package Substrates Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Semiconductor Package Substrates Market - Supply Chain
4.5. Global Semiconductor Package Substrates Market Forecast
4.5.1. Semiconductor Package Substrates Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Semiconductor Package Substrates Market Size (000 Units) and Y-o-Y Growth
4.5.3. Semiconductor Package Substrates Market Absolute $ Opportunity
5. Global Semiconductor Package Substrates Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. Semiconductor Package Substrates Market Size and Volume Forecast by Type
5.3.1. MCP/UTCSP
5.3.2. FC-CSP
5.3.3. SiP
5.3.4. PBGA/CSP
5.3.5. BOC
5.3.6. FMC
5.3.7. Automotive Substrate
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type
6. Global Semiconductor Package Substrates Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. Semiconductor Package Substrates Market Size and Volume Forecast by Application
6.3.1. Mobile Devices
6.3.2. Automotive Industry
6.3.3. Others
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application
7. Global Semiconductor Package Substrates Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. Semiconductor Package Substrates Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel
8. Global Semiconductor Package Substrates Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. Semiconductor Package Substrates Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global Semiconductor Package Substrates Demand Share Forecast, 2019-2026
9. North America Semiconductor Package Substrates Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.2. North America Semiconductor Package Substrates Market Size and Volume Forecast by Country
9.2.1. U.S.
9.2.2. Canada
9.3. Absolute $ Opportunity Assessment by Country
9.4. North America Semiconductor Package Substrates Market Size and Volume Forecast by Application
9.4.1. Mobile Devices
9.4.2. Automotive Industry
9.4.3. Others
9.5. Basis Point Share (BPS) Analysis by Application
9.6. Y-o-Y Growth Projections by Application
9.7. North America Semiconductor Package Substrates Market Size and Volume Forecast by Type
9.7.1. MCP/UTCSP
9.7.2. FC-CSP
9.7.3. SiP
9.7.4. PBGA/CSP
9.7.5. BOC
9.7.6. FMC
9.7.7. Automotive Substrate
9.8. Basis Point Share (BPS) Analysis by Type
9.9. Y-o-Y Growth Projections by Type
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.10.4. By Sales Channel
9.11. North America Semiconductor Package Substrates Demand Share Forecast, 2019-2026
10. Latin America Semiconductor Package Substrates Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Latin America Average Pricing Analysis
10.2. Latin America Semiconductor Package Substrates Market Size and Volume Forecast by Country
10.2.1. Brazil
10.2.2. Mexico
10.2.3. Rest of Latin America
10.3. Absolute $ Opportunity Assessment by Country
10.4. Latin America Semiconductor Package Substrates Market Size and Volume Forecast by Application
10.4.1. Mobile Devices
10.4.2. Automotive Industry
10.4.3. Others
10.5. Basis Point Share (BPS) Analysis by Application
10.6. Y-o-Y Growth Projections by Application
10.7. Latin America Semiconductor Package Substrates Market Size and Volume Forecast by Type
10.7.1. MCP/UTCSP
10.7.2. FC-CSP
10.7.3. SiP
10.7.4. PBGA/CSP
10.7.5. BOC
10.7.6. FMC
10.7.7. Automotive Substrate
10.8. Basis Point Share (BPS) Analysis by Type
10.9. Y-o-Y Growth Projections by Type
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.10.4. By Sales Channel
10.11. Latin America Semiconductor Package Substrates Demand Share Forecast, 2019-2026
11. Europe Semiconductor Package Substrates Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Europe Average Pricing Analysis
11.2. Europe Semiconductor Package Substrates Market Size and Volume Forecast by Country
11.2.1. Germany
11.2.2. France
11.2.3. Italy
11.2.4. U.K.
11.2.5. Spain
11.2.6. Russia
11.2.7. Rest of Europe
11.3. Absolute $ Opportunity Assessment by Country
11.4. Europe Semiconductor Package Substrates Market Size and Volume Forecast by Application
11.4.1. Mobile Devices
11.4.2. Automotive Industry
11.4.3. Others
11.5. Basis Point Share (BPS) Analysis by Application
11.6. Y-o-Y Growth Projections by Application
11.7. Europe Semiconductor Package Substrates Market Size and Volume Forecast by Type
11.7.1. MCP/UTCSP
11.7.2. FC-CSP
11.7.3. SiP
11.7.4. PBGA/CSP
11.7.5. BOC
11.7.6. FMC
11.7.7. Automotive Substrate
11.8. Basis Point Share (BPS) Analysis by Type
11.9. Y-o-Y Growth Projections by Type
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.10.4. By Sales Channel
11.11. Europe Semiconductor Package Substrates Demand Share, 2019-2026
12. Asia Pacific Semiconductor Package Substrates Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Asia Pacific Average Pricing Analysis
12.2. Asia Pacific Semiconductor Package Substrates Market Size and Volume Forecast by Country
12.2.1. China
12.2.2. Japan
12.2.3. South Korea
12.2.4. India
12.2.5. Australia
12.2.6. Rest of Asia Pacific (APAC)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Asia Pacific Semiconductor Package Substrates Market Size and Volume Forecast by Application
12.4.1. Mobile Devices
12.4.2. Automotive Industry
12.4.3. Others
12.5. Basis Point Share (BPS) Analysis by Application
12.6. Y-o-Y Growth Projections by Application
12.7. Asia Pacific Semiconductor Package Substrates Market Size and Volume Forecast by Type
12.7.1. MCP/UTCSP
12.7.2. FC-CSP
12.7.3. SiP
12.7.4. PBGA/CSP
12.7.5. BOC
12.7.6. FMC
12.7.7. Automotive Substrate
12.8. Basis Point Share (BPS) Analysis by Type
12.9. Y-o-Y Growth Projections by Type
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.10.4. By Sales Channel
12.11. Asia Pacific Semiconductor Package Substrates Demand Share, 2019-2026
13. Middle East & Africa Semiconductor Package Substrates Market Analysis and Forecast
13.1. Introduction
13.1.1. Basis Point Share (BPS) Analysis by Country
13.1.2. Y-o-Y Growth Projections by Country
13.1.3. Asia Pacific Average Pricing Analysis
13.2. Middle East & Africa Semiconductor Package Substrates Market Size and Volume Forecast by Country
13.2.1. Saudi Arabia
13.2.2. South Africa
13.2.3. UAE
13.2.4. Rest of Middle East & Africa (MEA)
13.3. Absolute $ Opportunity Assessment by Country
13.4. Middle East & Africa Semiconductor Package Substrates Market Size and Volume Forecast by Application
13.4.1. Mobile Devices
13.4.2. Automotive Industry
13.4.3. Others
13.5. Basis Point Share (BPS) Analysis by Application
13.6. Y-o-Y Growth Projections by Application
13.7. Middle East & Africa Semiconductor Package Substrates Market Size and Volume Forecast by Type
13.7.1. MCP/UTCSP
13.7.2. FC-CSP
13.7.3. SiP
13.7.4. PBGA/CSP
13.7.5. BOC
13.7.6. FMC
13.7.7. Automotive Substrate
13.8. Basis Point Share (BPS) Analysis by Type
13.9. Y-o-Y Growth Projections by Type
13.10. Market Attractiveness/Growth Potential Analysis
13.10.1. By Country
13.10.2. By Product Type
13.10.3. By Application
13.10.4. By Sales Channel
13.11. Middle East & Africa Semiconductor Package Substrates Demand Share, 2019-2026
14. Competition Landscape
14.1. Global Semiconductor Package Substrates Market: Market Share Analysis
14.2. Semiconductor Package Substrates Distributors and Customers
14.3. Semiconductor Package Substrates Market: Competitive Dashboard
14.4. Company Profiles (Details Overview, Financials, Developments, Strategy)
14.4.1. SIMMTECH
14.4.1.1. Overview
14.4.1.2. Financials
14.4.1.3. Developments
14.4.1.4. Strategic Outlook
14.4.2. KYOCERA
14.4.2.1. Overview
14.4.2.2. Financials
14.4.2.3. Developments
14.4.2.4. Strategic Outlook
14.4.3. Eastern
14.4.3.1. Overview
14.4.3.2. Financials
14.4.3.3. Developments
14.4.3.4. Strategic Outlook
14.4.4. LG Innotek
14.4.4.1. Overview
14.4.4.2. Financials
14.4.4.3. Developments
14.4.4.4. Strategic Outlook
14.4.5. Samsung Electro-Mechanics
14.4.5.1. Overview
14.4.5.2. Financials
14.4.5.3. Developments
14.4.5.4. Strategic Outlook
14.4.6. Daeduck
14.4.6.1. Overview
14.4.6.2. Financials
14.4.6.3. Developments
14.4.6.4. Strategic Outlook
14.4.7. Unimicron
14.4.7.1. Overview
14.4.7.2. Financials
14.4.7.3. Developments
14.4.7.4. Strategic Outlook
14.4.8. ASE Group
14.4.8.1. Overview
14.4.8.2. Financials
14.4.8.3. Developments
14.4.8.4. Strategic Outlook
14.4.9. TTM Technologies
14.4.9.1. Overview
14.4.9.2. Financials
14.4.9.3. Developments
14.4.9.4. Strategic Outlook
14.4.10. COMPANY 10
14.4.10.1. Overview
14.4.10.2. Financials
14.4.10.3. Developments
14.4.10.4. Strategic Outlook
14.4.11. COMPANY 11
14.4.11.1. Overview
14.4.11.2. Financials
14.4.11.3. Developments
14.4.11.4. Strategic Outlook
14.4.12. COMPANY 12
14.4.12.1. Overview
14.4.12.2. Financials
14.4.12.3. Developments
14.4.12.4. Strategic Outlook
14.4.13. COMPANY 13
14.4.13.1. Overview
14.4.13.2. Financials
14.4.13.3. Developments
14.4.13.4. Strategic Outlook
14.4.14. COMPANY 14
14.4.14.1. Overview
14.4.14.2. Financials
14.4.14.3. Developments
14.4.14.4. Strategic Outlook
14.4.15. COMPANY 15
14.4.15.1. Overview
14.4.15.2. Financials
14.4.15.3. Developments
14.4.15.4. Strategic Outlook
14.4.16. COMPANY 16
14.4.16.1. Overview
14.4.16.2. Financials
14.4.16.3. Developments
14.4.16.4. Strategic Outlook
14.4.17. COMPANY 17
14.4.17.1. Overview
14.4.17.2. Financials
14.4.17.3. Developments
14.4.17.4. Strategic Outlook
14.4.18. COMPANY 18
14.4.18.1. Overview
14.4.18.2. Financials
14.4.18.3. Developments
14.4.18.4. Strategic Outlook
14.4.19. COMPANY 19
14.4.19.1. Overview
14.4.19.2. Financials
14.4.19.3. Developments
14.4.19.4. Strategic Outlook
14.4.20. COMPANY 20
14.4.20.1. Overview
14.4.20.2. Financials
14.4.20.3. Developments
14.4.20.4. Strategic Outlook
